24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-24T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Transparent emissive microdisplays for ultra-light and compact augmented reality systems

As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

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Rohm Semiconductors News

ROHM’s New Energy-Saving DC-DC Converter ICs Offered in the TSOT23 Package

Compact size reduces component area by 72%, contributing to smaller power supplies in consumer and industrial equipment.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-24T00:00:00+00:00" | date "longDate" }}

Thinesolutions News

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for NVIDIA Jetson Orin NX/Nano

THine Solutions has introduced the THEIA-CAM 13MP PDAF Camera, THSCJ101, for NVIDIA Jetson Orin NX and Jetson Orin Nano platforms, enabling easy integration of advanced imaging capabilities.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-24T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics New Product Insider: Over 10,000 New Parts Added in First Quarter of 2024

Mouser Electronics is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-24T00:00:00+00:00" | date "longDate" }}

Omron Components News

New Sealed Power Relays Extend Switching Current to 36A

Omron Electronic Components Europe has further expanded its sealed-type power relay portfolio with a 36A model extending its 16A and 20A devices. Omron's new sealed type G6QE-1A4 complements the existing G6QE relay lineup for flux protection.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-24T00:00:00+00:00" | date "longDate" }}

Intel News

INTEL GAUDI, XEON AND AI PC ACCELERATE META LLAMA 3 GENAI WORKLOADS

Intel’s AI products offer developers the latest optimizations to run Meta Llama 3, its next-generation large language model.

Read more…

23 {{ "2024-04-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-23T00:00:00+00:00" | date "longDate" }}

Delta Electronics

Delta Unveils Groundbreaking Solutions for Smart Manufacturing and e-Mobility at Hannover Messe 2024

Delta is presenting, under the theme “Realizing an Intelligent, Sustainable and Connecting World,” its unique capabilities to foster smart manufacturing and sustainable cities at Hannover Messe 2024.

Read more…

23 {{ "2024-04-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-23T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free IoT

Silicon Labs secure intelligent wireless technology for a more connected world announced their new xG22E family of Wireless SoCs designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications.

Read more…

23 {{ "2024-04-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-23T00:00:00+00:00" | date "longDate" }}

Bender News

The new Bender's ISOMETER^® iso175

Bender presents the ISOMETER^® iso175, a pioneering insulation monitoring device that revolutionises safety in these vehicles.

Read more…

23 {{ "2024-04-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-23T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

ROHM and STMicroelectronics has announced the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

Read more…

Technical Articles

ROHM Develops a New Op Amp that Minimizes Current Consumption

Transparent emissive microdisplays for ultra-light and compact augmented reality systems

As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay.

ROHM’s New Energy-Saving DC-DC Converter ICs Offered in the TSOT23 Package

Compact size reduces component area by 72%, contributing to smaller power supplies in consumer and industrial equipment.

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for NVIDIA Jetson Orin NX/Nano

THine Solutions has introduced the THEIA-CAM 13MP PDAF Camera, THSCJ101, for NVIDIA Jetson Orin NX and Jetson Orin Nano platforms, enabling easy integration of advanced imaging capabilities.

Mouser Electronics New Product Insider: Over 10,000 New Parts Added in First Quarter of 2024

Mouser Electronics is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market.

New Sealed Power Relays Extend Switching Current to 36A

Omron Electronic Components Europe has further expanded its sealed-type power relay portfolio with a 36A model extending its 16A and 20A devices. Omron's new sealed type G6QE-1A4 complements the existing G6QE relay lineup for flux protection.

INTEL GAUDI, XEON AND AI PC ACCELERATE META LLAMA 3 GENAI WORKLOADS

Intel’s AI products offer developers the latest optimizations to run Meta Llama 3, its next-generation large language model.

Delta Unveils Groundbreaking Solutions for Smart Manufacturing and e-Mobility at Hannover Messe 2024

Delta is presenting, under the theme “Realizing an Intelligent, Sustainable and Connecting World,” its unique capabilities to foster smart manufacturing and sustainable cities at Hannover Messe 2024.

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free IoT

Silicon Labs secure intelligent wireless technology for a more connected world announced their new xG22E family of Wireless SoCs designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications.

The new Bender's ISOMETER^® iso175

Bender presents the ISOMETER^® iso175, a pioneering insulation monitoring device that revolutionises safety in these vehicles.

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

ROHM and STMicroelectronics has announced the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

International

Technical Articles

As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay.

Compact size reduces component area by 72%, contributing to smaller power supplies in consumer and industrial equipment.

THine Solutions has introduced the THEIA-CAM 13MP PDAF Camera, THSCJ101, for NVIDIA Jetson Orin NX and Jetson Orin Nano platforms, enabling easy integration of advanced imaging capabilities.

Mouser Electronics is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market.

Omron Electronic Components Europe has further expanded its sealed-type power relay portfolio with a 36A model extending its 16A and 20A devices. Omron's new sealed type G6QE-1A4 complements the existing G6QE relay lineup for flux protection.

Intel’s AI products offer developers the latest optimizations to run Meta Llama 3, its next-generation large language model.

Delta is presenting, under the theme “Realizing an Intelligent, Sustainable and Connecting World,” its unique capabilities to foster smart manufacturing and sustainable cities at Hannover Messe 2024.

Silicon Labs secure intelligent wireless technology for a more connected world announced their new xG22E family of Wireless SoCs designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications.

Bender presents the ISOMETER® iso175, a pioneering insulation monitoring device that revolutionises safety in these vehicles.

ROHM and STMicroelectronics has announced the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

International

Bender presents the ISOMETER^® iso175, a pioneering insulation monitoring device that revolutionises safety in these vehicles.