Vishay Intertechnology has introduced a new Automotive Grade IHDF edge-wound, through-hole inductor with rated current up to 72 A and saturation currents up to 230 A.
Thanks to an adjustable sound cone and small dead zone, the new Leuze ultrasonic sensors of the 420B and 412B series can be used for many different applications.
Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips.
Innodisk, a leading global AI solution provider, announces the launch of its industry’s first MIPI over Type-C solution. This exclusive technology overcomes traditional MIPI cable lengths limitations, allowing embedded camera modules to be positioned farther from the system.
CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.
New flow provides an efficient, integrated radio frequency circuit re-design solution based on Synopsys Custom Design Family, Keysight Electromagnetic Simulation, and Ansys Device Synthesis.