05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

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Silicon Labs News

Silicon Labs Launches BG2B Bluetooth SoC Delivering Ultra-Low-Power IoT Performance

New chip combines Bluetooth Channel Sounding, Secure Vault, CAN-FD integration extending battery life while reducing system cost for developers worldwide.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Launches TXZ+ M4L Microcontroller Series

These Arm Cortex-M4 components integrate hardware accelerators for efficient and secure motor control.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Rision News

RISION Launches Magic Series USB-C Thermal Cameras

The compact, battery-free modules transform smartphones and computers into precision thermal inspection tools across consumer and professional applications.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Demonstrates PCIe Gen 6 Storage Architecture with Micron

Switchtec PCIe Switches and Micron 9650 NVMe solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Kioxia News

CXL Memory Expansion Modules for AI Infrastructure

KIOXIA introduces a high-performance flash-based module designed to bridge the capacity and cost gap between standard DRAM and solid-state storage.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM presents second-generation Terahertz Wave Oscillation Device

To address the growing demand for improved signal quality in application development, ROHM has now developed a second-generation terahertz wave oscillation device.

Read more…

04 {{ "2026-08-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-04T00:00:00+00:00" | date "longDate" }}

Acbel

Acbel: From 800V Vehicle Platforms to High-Power Charging: Acbel Expands Its European EV Presence with Integrated Power Solutions

Combining onboard power electronics, charging infrastructure expertise, and automotive-grade manufacturing, Acbel helps OEMs reduce system integration complexity while supporting high-voltage EV architectures and intelligent charging ecosystems.

Read more…

04 {{ "2026-08-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-04T00:00:00+00:00" | date "longDate" }}

Beckhoff News

Beckhoff Warns on Over-Specifying Automation Systems

Scalable architectures and right-sized components reduce costs without limiting future machine flexibility.

Read more…

04 {{ "2026-08-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-04T00:00:00+00:00" | date "longDate" }}

Ambiq News

Agentic AI Implementation for Hardware Design and Verification

Ambiq integrates ChipAgents platforms to automate logic design workflows and support the development of low-power edge computing architectures.

Read more…

03 {{ "2026-08-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-03T00:00:00+00:00" | date "longDate" }}

Rutronik News

Multilayer Ceramic Capacitor Architectures for High Power Density Systems

The YAGEO Group expands its passive component portfolio to address power stability and electromagnetic interference challenges in modern industrial electrification.

Read more…

Case studies

IDS cameras enable interactive museum experiences with vvvv and SCHNELLE BUNTE BILDER

Silicon Labs Launches BG2B Bluetooth SoC Delivering Ultra-Low-Power IoT Performance

New chip combines Bluetooth Channel Sounding, Secure Vault, CAN-FD integration extending battery life while reducing system cost for developers worldwide.

Toshiba Launches TXZ+ M4L Microcontroller Series

These Arm Cortex-M4 components integrate hardware accelerators for efficient and secure motor control.

RISION Launches Magic Series USB-C Thermal Cameras

The compact, battery-free modules transform smartphones and computers into precision thermal inspection tools across consumer and professional applications.

Microchip Demonstrates PCIe Gen 6 Storage Architecture with Micron

Switchtec PCIe Switches and Micron 9650 NVMe solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity.

CXL Memory Expansion Modules for AI Infrastructure

KIOXIA introduces a high-performance flash-based module designed to bridge the capacity and cost gap between standard DRAM and solid-state storage.

ROHM presents second-generation Terahertz Wave Oscillation Device

To address the growing demand for improved signal quality in application development, ROHM has now developed a second-generation terahertz wave oscillation device.

Acbel: From 800V Vehicle Platforms to High-Power Charging: Acbel Expands Its European EV Presence with Integrated Power Solutions

Combining onboard power electronics, charging infrastructure expertise, and automotive-grade manufacturing, Acbel helps OEMs reduce system integration complexity while supporting high-voltage EV architectures and intelligent charging ecosystems.

Beckhoff Warns on Over-Specifying Automation Systems

Scalable architectures and right-sized components reduce costs without limiting future machine flexibility.

Agentic AI Implementation for Hardware Design and Verification

Ambiq integrates ChipAgents platforms to automate logic design workflows and support the development of low-power edge computing architectures.

Multilayer Ceramic Capacitor Architectures for High Power Density Systems

The YAGEO Group expands its passive component portfolio to address power stability and electromagnetic interference challenges in modern industrial electrification.

International