STMicroelectronics and Qualcomm Technologies integrate motion sensing and secure NFC technologies into the Snapdragon Wear Elite platform to enable low-power AI processing and contactless services in wearable devices.
The industry's first 32Gb LPDDR5X die enables 1.33x more capacity, 2.3x faster LLM inference, and 3x better efficiency while significantly reducing power and footprint.
PentaG-NTN modem subsystem supports LEO and MEO satellite connectivity and accelerates development of standards-based 5G non-terrestrial network terminals.
Aetina Corporation, a leading provider of Edge AI solutions, is set to debut its award-winning AIP-FR68S AI Agent Edge Workstation at Embedded World 2026.
Licensing TSMC’s 650V GaN process technology enables in-house wafer fabrication at ROHM Hamamatsu, strengthening supply continuity for high-voltage AI server and EV power systems.
AMD introduces the Ryzen AI 400 Series and Ryzen AI PRO 400 Series to provide hardware-accelerated processing for consumer and enterprise desktop computing environments.
Qualcomm Technologies introduces the X105 Modem-RF system with 3GPP Release 19 readiness, 6nm RF transceiver and integrated NR-NTN support for 5G Advanced devices.