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Sysgo News
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STMicroelectronics News
75V Motor Driver ICs Target 48V Industrial Systems
STMicroelectronics introduces scalable motor-control chips supporting multiple motor types and up to 500 W applications across automation and electromechanical equipment.
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Teledyne Flir OEM
Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology
Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs.
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Toshiba News
Compact Automotive Power Management IC Enhances Redundant Rail Safety
Toshiba Electronic Devices & Storage Corporation introduces a new high-side switch designed to improve power control reliability in automotive systems.
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Broadcom News
Broadcom Ships Industry First 2nm Custom Compute SoC for AI
Broadcom launches its 3.5D XDSiP platform featuring 2nm technology and 3D-IC integration, enabling Fujitsu and other partners to scale high-performance, low-power XPUs for massive AI.
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TDK News
TDK at Embedded World 2026
From March 10 to 12 in Nuremberg, discover how TDK presents advanced sensors, power supplies, and motor controllers to drive efficiency in automotive, industrial, and smart technology sectors.
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SK Hynix News
SK hynix Advances HBF Standardization with Sandisk
A joint Open Compute Project workstream aims to define High Bandwidth Flash as a new scalable, power-efficient memory tier for AI inference infrastructure.
27
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Anritsu News
AI acceleration technology for low-latency wireless communication
Anritsu and MediaTek have verified AI QoS and L4S technologies to optimize performance for latency-sensitive applications on 5G platforms.
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Keysight technologies News
High-Fidelity Emulation Advances AI-Native Networks
Keysight Technologies presents agentic AI, digital twins and network emulation at Mobile World Congress 2026 to validate 5G-Advanced, 6G and non-terrestrial network performance.
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TDK News
