15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-15T00:00:00+00:00" | date "longDate" }}

TDK News

TDK introduces xEVCap, a standardized and modular DC link capacitor design for xEV traction inverters

The xEVCap, design for powertrain inverters in passenger cars, commercial and off-highway vehicles, and machinery tools.

Read more…

15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-15T00:00:00+00:00" | date "longDate" }}

Navitas News

Navitas GaNSlim™ Power ICs Drive Ease-of-use, System Cost, and Energy Savings in Mobile, Consumer, and Home Appliance

Highly integrated GaN power ICs with autonomous EMI control and loss-less sensing are the industry’s fastest, smallest, and most efficient solution in an optimized DPAK-4L package.

Read more…

15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-15T00:00:00+00:00" | date "longDate" }}

ASUS News

ASUS Unveils ROG Maximus, ROG Strix, TUF Gaming, Prime, and ProArt Z890 Motherboards

These motherboards are ready for Intel Core Ultra Processors (Series 2) and advanced AI, with ultrafast connectivity, intelligent features, and high performance.

Read more…

15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-15T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE Expands NXP's FRDM-MCXN947 Capabilities with New Shield for Enhanced Click Integration

MIKROE's new Click Shield expands NXP FRDM-MCXN947's potential, enabling integration with over 1700 Click boards™ for rapid development across IoT, industrial, and automotive applications.

Read more…

14 {{ "2024-10-14T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-14T00:00:00+00:00" | date "longDate" }}

Nvidia News

TSMC and NVIDIA Transform Semiconductor Manufacturing With Accelerated Computing

The application of generative AI enables creation of a near-perfect inverse mask, speeding up the overall optical proximity correction process by 2x.

Read more…

14 {{ "2024-10-14T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-14T00:00:00+00:00" | date "longDate" }}

AMD News

AMD Delivers Leadership AI Performance with AMD Instinct MI325X Accelerators

These accelerators offer market leading HBM3E memory capacity and are supported by partners and customers including Dell Technologies, HPE, Lenovo, Supermicro and others.

Read more…

14 {{ "2024-10-14T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-14T00:00:00+00:00" | date "longDate" }}

Alps Alpine News

Alps Alpine Develops the World’s Smallest Class TACT Switch

Combining Miniaturization and High Performance to Drive Further Evolution in Electronic Devices.

Read more…

14 {{ "2024-10-14T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-14T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon launches ultra-high current density power modules to enable high-performance AI computing

Data centers are currently responsible for more than two percent of global energy consumption. Fueled by AI, this number is expected to grow to up to around seven percent in 2030, matching the current energy consumption of India.

Read more…

11 {{ "2024-10-11T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-11T00:00:00+00:00" | date "longDate" }}

Rutronik Info

Amphenol IPG Anytek terminal blocks for high-temperature applications

The IPG Anytek series terminal blocks from Amphenol are now available from Rutronik as a stock package.

Read more…

11 {{ "2024-10-11T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-11T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon adds new automotive-grade laser driver to leading REAL3 Time-of-Flight portfolio

Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play an important role in in-vehicle monitoring systems.

Read more…

Technical Articles

TDK: How to select the right PoC Filter Inductors and Chip Beads for Automotive SerDes (LVDS) Transmission

Case studies

IDS: Up to 20 IDS cameras support Munich-based Start up, Marvel Fusion GmbH in their research

White Paper

ABB STUDY REVEALS ROBOTIC MACHINING BOOSTS ELECTRONICS MANUFACTURING PRODUCTIVITY BY 33%, OFFERS 1200% ROI

TDK introduces xEVCap, a standardized and modular DC link capacitor design for xEV traction inverters

The xEVCap, design for powertrain inverters in passenger cars, commercial and off-highway vehicles, and machinery tools.

Navitas GaNSlim™ Power ICs Drive Ease-of-use, System Cost, and Energy Savings in Mobile, Consumer, and Home Appliance

Highly integrated GaN power ICs with autonomous EMI control and loss-less sensing are the industry’s fastest, smallest, and most efficient solution in an optimized DPAK-4L package.

ASUS Unveils ROG Maximus, ROG Strix, TUF Gaming, Prime, and ProArt Z890 Motherboards

These motherboards are ready for Intel Core Ultra Processors (Series 2) and advanced AI, with ultrafast connectivity, intelligent features, and high performance.

MIKROE Expands NXP's FRDM-MCXN947 Capabilities with New Shield for Enhanced Click Integration

MIKROE's new Click Shield expands NXP FRDM-MCXN947's potential, enabling integration with over 1700 Click boards™ for rapid development across IoT, industrial, and automotive applications.

TSMC and NVIDIA Transform Semiconductor Manufacturing With Accelerated Computing

The application of generative AI enables creation of a near-perfect inverse mask, speeding up the overall optical proximity correction process by 2x.

AMD Delivers Leadership AI Performance with AMD Instinct MI325X Accelerators

These accelerators offer market leading HBM3E memory capacity and are supported by partners and customers including Dell Technologies, HPE, Lenovo, Supermicro and others.

Alps Alpine Develops the World’s Smallest Class TACT Switch

Combining Miniaturization and High Performance to Drive Further Evolution in Electronic Devices.

Infineon launches ultra-high current density power modules to enable high-performance AI computing

Data centers are currently responsible for more than two percent of global energy consumption. Fueled by AI, this number is expected to grow to up to around seven percent in 2030, matching the current energy consumption of India.

Amphenol IPG Anytek terminal blocks for high-temperature applications

The IPG Anytek series terminal blocks from Amphenol are now available from Rutronik as a stock package.

Infineon adds new automotive-grade laser driver to leading REAL3 Time-of-Flight portfolio

Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play an important role in in-vehicle monitoring systems.

International