07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

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Digi-Key News

High-Speed Video Links Drive Vision System Performance

Manufacturers deploy Gigabit Multimedia Serial Link technology to support high-bandwidth, low-latency video and sensor data across automotive and industrial sectors.

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07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

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Seco News

COM Express module brings Intel Core Ultra Series 3 to the edge

SECO introduces a new COM Express Type 6 module based on Intel Core Ultra Series 3 processors, targeting AI-driven industrial and embedded edge systems.

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07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

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STMicroelectronics News

STM32MP21 targets cost-efficient, secure edge computing

STMicroelectronics expands the STM32MP2 series with the STM32MP21 MPUs, combining low power consumption, flexible performance, and a security architecture aligned with industrial and IoT requirements.

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07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

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ADLINK News

COM Express module targets high-performance edge AI

ADLINK Technology Inc. introduces the Express-PTL COM Express module based on Intel Core Ultra Series 3 processors to support demanding edge AI and embedded applications.

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07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

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Micron News

Micron Launches World's First Gen5 G9 QLC SSD for Client Computing

The new client SSD combines Gen5 bandwidth, high-density QLC NAND and low-power design to enable compact, AI-capable laptops with higher storage capacity and efficiency.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Congatec News

High-Performance Embedded Compute Modules with Scalable AI Acceleration

Congatec's new modules with Intel Core Ultra Series 3 processors deliver embedded AI and high-speed I/O for automation, robotics, smart cities, and retail.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Kontron News

3.5-inch single board computer for industrial edge AI

Kontron introduces a compact SBC platform built on Intel Core Ultra architecture to support low-latency AI, graphics, and real-time processing at the edge.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Vecow News

Vecow Introduces Stackable Edge AI PC Based on Intel Core Ultra Series 3

The TGS-2000 Series expands Vecow’s embedded portfolio with a modular, industrial-grade AI PC designed for computer vision, edge inference, and scalable accelerator-based deployments.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Contrinex News

Contrinex Expands Digital Distance Sensors for Flexible Automation

Smart digital measurement sensors from Contrinex combine high-resolution distance sensing with configurable outputs and diagnostics to support modular automation, IIoT integration, and predictive maintenance strategies.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Mediatek News

MediaTek Advances Wi-Fi 8 Reliability for High-Density Connected Devices

The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.

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Case studies

CompControl automates inbound electronics logistics with machine vision

High-Speed Video Links Drive Vision System Performance

Manufacturers deploy Gigabit Multimedia Serial Link technology to support high-bandwidth, low-latency video and sensor data across automotive and industrial sectors.

COM Express module brings Intel Core Ultra Series 3 to the edge

SECO introduces a new COM Express Type 6 module based on Intel Core Ultra Series 3 processors, targeting AI-driven industrial and embedded edge systems.

STM32MP21 targets cost-efficient, secure edge computing

STMicroelectronics expands the STM32MP2 series with the STM32MP21 MPUs, combining low power consumption, flexible performance, and a security architecture aligned with industrial and IoT requirements.

COM Express module targets high-performance edge AI

ADLINK Technology Inc. introduces the Express-PTL COM Express module based on Intel Core Ultra Series 3 processors to support demanding edge AI and embedded applications.

Micron Launches World's First Gen5 G9 QLC SSD for Client Computing

The new client SSD combines Gen5 bandwidth, high-density QLC NAND and low-power design to enable compact, AI-capable laptops with higher storage capacity and efficiency.

High-Performance Embedded Compute Modules with Scalable AI Acceleration

Congatec's new modules with Intel Core Ultra Series 3 processors deliver embedded AI and high-speed I/O for automation, robotics, smart cities, and retail.

3.5-inch single board computer for industrial edge AI

Kontron introduces a compact SBC platform built on Intel Core Ultra architecture to support low-latency AI, graphics, and real-time processing at the edge.

Vecow Introduces Stackable Edge AI PC Based on Intel Core Ultra Series 3

The TGS-2000 Series expands Vecow’s embedded portfolio with a modular, industrial-grade AI PC designed for computer vision, edge inference, and scalable accelerator-based deployments.

Contrinex Expands Digital Distance Sensors for Flexible Automation

Smart digital measurement sensors from Contrinex combine high-resolution distance sensing with configurable outputs and diagnostics to support modular automation, IIoT integration, and predictive maintenance strategies.

MediaTek Advances Wi-Fi 8 Reliability for High-Density Connected Devices

The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.

International