14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Broadband Semiconductor Characterization in the Sub-Terahertz Range

Single-touchdown measurements from near DC to 250 GHz accelerate the development of high-frequency transistors for future telecommunications systems.

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13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Infimotion News

InfiMotion highlights advanced electric drives at Paris Motor Show

The supplier powers multiple automotive brands with integrated 800V and 900V high-efficiency traction systems.

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13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Infineon News

Digital Power-Path Protection for 800-Volt AI Server Architectures

Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Link Layer Retry Validation in AI Ethernet Fabrics

Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Qualcomm News

AI-Native Broadband Network Innovation Platform

Qualcomm Technologies introduces Dragonwing platforms to transform fiber, Wi-Fi 8, and fixed wireless access infrastructure into edge-computed intelligent service environments.

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12 {{ "2026-10-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-12T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Fraunhofer IPMS introduces miniaturized Li-Fi TinySpot optical transceiver

The ultra-low-power 5 mW data link provides secure, contactless 20 Mbps communication for space-constrained industrial sensors.

Read more…

12 {{ "2026-10-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-12T00:00:00+00:00" | date "longDate" }}

Hilscher News

Hilscher introduces comX 90CN for compact industrial devices

The connector-free embedded communication module gives OEMs flexible network interface placement and multiprotocol support.

Read more…

09 {{ "2026-10-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-09T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

Power and Edge Computing Semiconductors for Industrial Infrastructure

ROHM Semiconductor will present its analog and power architectures designed to support automotive electrification, industrial automation, and artificial intelligence data centers.

Read more…

09 {{ "2026-10-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-09T00:00:00+00:00" | date "longDate" }}

Kontron News

Global Electronics Manufacturing and IoT Supply Chain Integration

Kontron and Ennoconn are combining their regional production capabilities to provide original equipment manufacturers with a resilient digital supply chain for embedded systems.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

Broadband Semiconductor Characterization in the Sub-Terahertz Range

Single-touchdown measurements from near DC to 250 GHz accelerate the development of high-frequency transistors for future telecommunications systems.

InfiMotion highlights advanced electric drives at Paris Motor Show

The supplier powers multiple automotive brands with integrated 800V and 900V high-efficiency traction systems.

Digital Power-Path Protection for 800-Volt AI Server Architectures

Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.

Link Layer Retry Validation in AI Ethernet Fabrics

Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.

AI-Native Broadband Network Innovation Platform

Qualcomm Technologies introduces Dragonwing platforms to transform fiber, Wi-Fi 8, and fixed wireless access infrastructure into edge-computed intelligent service environments.

Fraunhofer IPMS introduces miniaturized Li-Fi TinySpot optical transceiver

The ultra-low-power 5 mW data link provides secure, contactless 20 Mbps communication for space-constrained industrial sensors.

Hilscher introduces comX 90CN for compact industrial devices

The connector-free embedded communication module gives OEMs flexible network interface placement and multiprotocol support.

Power and Edge Computing Semiconductors for Industrial Infrastructure

ROHM Semiconductor will present its analog and power architectures designed to support automotive electrification, industrial automation, and artificial intelligence data centers.

Global Electronics Manufacturing and IoT Supply Chain Integration

Kontron and Ennoconn are combining their regional production capabilities to provide original equipment manufacturers with a resilient digital supply chain for embedded systems.

International