Freudenberg Sealing Technologies developed a profiled metal spring mechanism to manage thermal runaway through adjustable trigger pressure and rapid gas venting.
The innovative 1200V trench-gate power device aims to enhance energy efficiency and reduce power consumption in next-generation generative artificial intelligence data centers.
ROHM introduces low-capacitance protection diodes for multi-gigabit industrial, automotive, and consumer interfaces where signal integrity and transient suppression must coexist.
Qualcomm Technologies introduces the Dragonwing MBM platform family for broadband devices combining 5G connectivity, advanced multimedia processing and integrated AI capabilities.
Infineon Technologies coordinates a 62-partner initiative to develop advanced power electronics systems utilizing heterogeneous integration and chiplet architectures for industrial applications.
Keysight Technologies has expanded its PCIe 7.0 test portfolio with a new receiver stress-test calibration solution for AI and data center applications.
Swissbit AG introduces a new PCIe Gen4 SSD family for embedded systems, combining low power consumption, industrial endurance, and configurable storage options for mixed and write-intensive workloads.