16
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TDK News
16
'26
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Bopla News
BOPLA Presents Versatile BoNext Electronics Enclosure Series
Modular enclosures combine concealed screw connections, ambient lighting, and IP68 protection for demanding applications.
16
'26
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Advantech News
Advantech launches AIR-411 edge AI HPC system
The 17-liter workstation integrates Intel Core 200S processors and 300W GPUs for inspection, imaging, and localized LLMs.
16
'26
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Rutronik News
TDK launches high-current SMD power inductors for DC/DC converters
The compact SPM6530T and SPM6550T series are now available through Rutronik for high-density power supplies.
16
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MURATA News
Murata Develops 135 GHz Antenna Module for 6G Systems
The solution combines LTCC ceramic substrates and beamforming integrated circuits for D-band communications.
15
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Etel News
Planar Air Bearing Platforms for Semiconductor Step-and-Scan Applications
ETEL introduces a full air bearing planar platform designed to support next-generation maskless lithography and optical inspection within the semiconductor ecosystem.
15
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Infineon News
Semiconductor Architectures for Physical Artificial Intelligence and Edge Automation
Infineon showcases embedded hardware solutions for computing, sensing, and power management in robotics, software-defined vehicles, and intelligent edge infrastructure.
15
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EInfochips News
eInfochips Demonstrates Complete ASIC Solution with New Test Chip
Turnkey architecture bundles microcontroller, diagnostic, and control functions to reduce board complexity.
15
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Siemens News
Computational Lithography Workflows in Semiconductor Manufacturing
Siemens and NVIDIA integrated the cuLitho CUDA-X library into Calibre software to solve advanced patterning runtime bottlenecks for leading-edge nodes.
15
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Vecow News
