The industry's first 32Gb LPDDR5X die enables 1.33x more capacity, 2.3x faster LLM inference, and 3x better efficiency while significantly reducing power and footprint.
PentaG-NTN modem subsystem supports LEO and MEO satellite connectivity and accelerates development of standards-based 5G non-terrestrial network terminals.
Aetina Corporation, a leading provider of Edge AI solutions, is set to debut its award-winning AIP-FR68S AI Agent Edge Workstation at Embedded World 2026.
Licensing TSMC’s 650V GaN process technology enables in-house wafer fabrication at ROHM Hamamatsu, strengthening supply continuity for high-voltage AI server and EV power systems.
AMD introduces the Ryzen AI 400 Series and Ryzen AI PRO 400 Series to provide hardware-accelerated processing for consumer and enterprise desktop computing environments.
Qualcomm Technologies introduces the X105 Modem-RF system with 3GPP Release 19 readiness, 6nm RF transceiver and integrated NR-NTN support for 5G Advanced devices.
Broadcom unveils VMware Telco Cloud Platform 9 to improve hardware efficiency, reduce total cost of ownership and enable AI monetization in telecom data centers.