Anritsu has announced the launch of its new Tensor Vector Network Analyzer (VNA) platform, engineered to manage advanced active and passive device characterization.
Microchip Technology introduces a software update designed to coordinate high-precision time transfer links and detect satellite vulnerabilities within distributed digital ecosystems.
Toshiba introduces a 40-volt electrical switching architecture designed to increase thermal dissipation and current capacity for high-stress vehicle motor drive systems.
Kontron introduces a compact computing solution designed to process artificial intelligence inference and parallel calculations within harsh aerospace defense environments.
Jointly developed 3-level standard package enhances inverter efficiency, design flexibility and standardization for industrial and renewable applications.
ROHM develops a surface-mount package architecture designed to maximize thermal dissipation and high-voltage insulation in automotive and industrial power conversion systems.
Nexperia introduced high-voltage wide-bandgap semiconductors featuring a surface-mount configuration designed to optimize thermal dissipation in power-dense systems.