29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }} STMicroelectronics News Ultralow-Power Vision Sensors for Edge AI Devices STMicroelectronics introduces compact global-shutter image sensors enabling always-on embedded vision for wearables, AR/VR systems, and energy-constrained smart devices. Read more…
29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }} TDK News Integrated DC-DC converters simplify industrial power design TDK Corporation introduces encapsulated converter modules to reduce design complexity and footprint in industrial power architectures. Read more…
29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }} Leuze Leuze Highlights Seven Steps to Ensure Safe and Seamless Site Inspections in Automation A structured approach to identifying risks, closing safety gaps, and achieving compliance across industrial environments. Read more…
29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }} Microchip News Microchip introduces post-quantum root of trust controllers New controllers support post-quantum cryptography and secure boot for data center, telecom and infrastructure platforms. Read more…
29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }} Syensqo News Material for High-Voltage Smartphone Batteries Syensqo develops Energain SA076 to enable safer high-voltage lithium-ion batteries for next-generation smartphone platforms. Read more…
29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }} Rohm Semiconductors News ROHM NFC Chipset Enables Wireless Charging in Wearables Compact receiver and transmitter ICs support proximity-based power transfer for ultra-small devices, addressing design constraints in next-generation wearable electronics. Read more…
29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }} Bodewell Group News PECVD SiCN system for advanced semiconductor processing ACM Research deploys PECVD SiCN platform to enable BEOL and advanced packaging process control in collaboration with a semiconductor manufacturer. Read more…
28 {{ "2026-04-28T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-28T00:00:00+00:00" | date "longDate" }} Toshiba News Toshiba Samples Integrated Motor Control Device for Automotive New SmartMCD component combines MCU, gate driver, and sensorless FOC to support compact, efficient BLDC motor control in electrified vehicle systems. Read more…
28 {{ "2026-04-28T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-28T00:00:00+00:00" | date "longDate" }} MURATA News Murata introduces ultra-low power AMR sensors New AMR sensors enable low-voltage operation and extended battery life in healthcare, wearable, and IoT applications. Read more…
27 {{ "2026-04-27T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-04-27T00:00:00+00:00" | date "longDate" }} Kontron News Secure remote access for industrial IoT systems Kontron and TeamViewer integrate hardware and software to enable agentless, zero-trust access to industrial control systems. Read more…