Toshiba launches the new TLX9161T automotive photorelay, a small-sized device with a high output withstand voltage of 1500V for use in modern automotive battery systems.
The ICK SMD heat sinks are available as Tape & Reel in various sizes, with black anodized or solderable coating, Kapton dot assembly aid, and customer-specific adaptations.
Renesas' RA4C1 MCU group combines an 80MHz Arm Cortex-M33 core, PSA Certified security, and 168 µA/MHz active power consumption for smart metering and building automation applications.
ASMPT’s WORKS Optimization integrates printing, placement, and SPI/AOI data via IPC-2591-CFX, automating process control to reduce scrap and accelerate SMT production.
The new 1 kV-rated components reduce PCB floor space requirements by approximately 30% compared to traditional single-gate drive transformer designs that support equivalent insulation.