Aetina Corporation, a leading provider of Edge AI solutions, is set to debut its award-winning AIP-FR68S AI Agent Edge Workstation at Embedded World 2026.
Licensing TSMC’s 650V GaN process technology enables in-house wafer fabrication at ROHM Hamamatsu, strengthening supply continuity for high-voltage AI server and EV power systems.
AMD introduces the Ryzen AI 400 Series and Ryzen AI PRO 400 Series to provide hardware-accelerated processing for consumer and enterprise desktop computing environments.
Qualcomm Technologies introduces the X105 Modem-RF system with 3GPP Release 19 readiness, 6nm RF transceiver and integrated NR-NTN support for 5G Advanced devices.
Broadcom unveils VMware Telco Cloud Platform 9 to improve hardware efficiency, reduce total cost of ownership and enable AI monetization in telecom data centers.
Keysight Technologies and MediaTek demonstrate a prototype combining RAN-assisted AI, site-specific retraining and OTA model updates to improve uplink performance.
e-con Systems presents edge AI and multi-camera vision technologies for robotics, mobility, and industrial applications at NVIDIA GTC 2026 and Embedded World 2026.
New workflows automate RTL checks, debugging and planning while remaining compatible with existing EDA environments and cloud-based development infrastructures.
Support for AWS Outposts racks enables telecom operators to place 5G core processing where latency and traffic conditions require flexible infrastructure design.