New interdigital electrode chips enable parallel, high-precision material testing, accelerating development of organic electronic devices and sensor technologies.
Silicon Storage Technology and United Microelectronics Corporation qualify SuperFlash Gen 4 eNVM for safety-critical automotive controllers on UMC’s 28HPC+ process.
OMRON Components Europe has introduced ultra-compact G3VM MOSFET relays designed for high-density, high-speed switching in test and measurement equipment.
Northrop Grumman demonstrates compact radiation-testing technology under DARPA program to shorten qualification cycles for space and nuclear microelectronics.
Mitsubishi Electric introduces four trench SiC-MOSFET bare dies for embedded power electronics, targeting lower losses and stable performance in EV inverters, chargers and renewable energy systems.
Microchip Technology introduces MIL-PRF-19500-qualified plastic transient voltage suppressors to address weight, cost, and reliability requirements in aerospace and defense electronics.