08
'26
Written on
TDK News
08
'26
Written on
MURATA News
High-Capacitance MLCCs Enable Compact Automotive Electronics
Murata Manufacturing expands its MLCC portfolio with high-capacitance components designed to support ADAS systems and improve PCB space efficiency in automotive applications.
07
'26
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AMD News
Fujisoft develops AI security system on AMD platform
Integrated FPGA and x86 architecture enables low-latency AI image recognition for industrial site monitoring and reduced false alarms.
06
'26
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CEA Leti News
RISC-V and Photonics Integration for AI Chiplets
CEA-Leti, CEA-List and Powerchip Semiconductor Manufacturing Corporation (PSMC) collaborate to combine RISC-V computing and silicon photonics within 3D semiconductor integration platforms for AI systems.
03
'26
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STMicroelectronics News
GaN Gate Drivers for High-Speed Power Conversion
STMicroelectronics introduces GaN drivers enabling efficient motion control and compact power conversion system design.
03
'26
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Anritsu News
Anritsu Expands European Portfolio Through Strategic Sales Partnership With TTi
Anritsu now distributes TTi general purpose instruments across Europe, enhancing its laboratory and production offerings with precision power supplies and signal generators for diverse engineering applications.
02
'26
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Nanomade News
Transparent force and touch sensing film for HMIs
A joint Nanomade–PolyIC development combines printed electronics and force detection to support transparent user interfaces in automotive, medical and consumer devices.
02
'26
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Molex News
Molex Completes Acquisition of Smiths Interconnect
Molex acquires Smiths Interconnect to expand capabilities across aerospace, medical, and semiconductor markets.
02
'26
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Omnivision News
Image signal processor integration for arthroscopy imaging
Omnivision ISP integration targets stable colour reproduction and low-latency processing in endoscopic visualization platforms used in minimally invasive surgical imaging workflows.
01
'26
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Tria Technologies News
