Orthosie-I, a configurable model, and Stephano-I, with pre-installed firmware, are ESP32-C3-based wireless modules supporting Wi-Fi, Bluetooth LE 5.0, with compact, flexible designs.
The technology company Siemens announced a significant update to its industrial-grade private 5G infrastructure solution, that will enable manufacturers to cover larger industrial areas with enhanced connectivity capabilities.
Connect more concurrent users with the advanced Wi-Fi 7 capabilities of the Snapdragon Auto Connectivity Platform from Qualcomm Technologies, Inc. This platform powers RUBY-W2, which supports automotive-grade connectivity with high throughput and low latency.
Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment.
Demonstrations will include emulation and test solutions for electrical and optical transmissions and data center interconnect applications up to speeds of 800G and 1.6T as well as design and simulation of chiplet interconnects.