18
'25
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Renesas News
18
'25
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Vishay News
Vishay Introduces First SMD Y1-Rated Automotive Capacitors
Vishay’s SMDY1 Automotive Series capacitors provide 500 VAC Y1 safety rating, AEC-Q200 compliance, EMI suppression, and cost-efficient surface-mount assembly for EV power electronics.
18
'25
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ZEISS News
ZEISS Introduces AIMS EUV 3.0
The AIMS EUV 3.0 mask qualification tool is fully compatible with High-NA-EUV technology, supporting both Low-NA and High-NA-EUV imaging to give chip manufacturers strategic advantages and flexibility.
18
'25
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Grinn News
Grinn Partners with MediaTek to Launch World’s Smallest Genio-Based SOMs
New GenioSOM-700 and GenioSOM-510 deliver high-performance AI, vision, and IoT capabilities, backed by privileged access to MediaTek’s products, roadmaps, and technical support.
17
'25
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iBASE News
IBASE Launches RISC-Based SBC for Low-Power AIoT Edge Computing
IBASE's IBR500 SBC utilizes MediaTek Genio 700/510 processors to deliver 3.2 TOPS AI performance in a compact 3.5” form factor for edge AIoT deployments.
17
'25
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Telit News
Telit Cinterion Unveils Module for Reliable Location with Dead Reckoning
The SE869EK5-DR offers reliable, uninterrupted location data with Untethered Dead Reckoning, ideal for fleet management, automotive telematics, and asset tracking in mission-critical applications.
17
'25
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Mediatek News
MediaTek develops chip using TSMC's 2nm process
Compared to the N3E process, N2P offers an 18% performance increase at the same power, a 36% power reduction, and a 1.2x increase in logic density.
17
'25
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Siemens News
Siemens launches Tessent AnalogTest, automating IC analog test generation
Siemens’ Tessent AnalogTest reduces analog circuit test generation from months to days, achieving >95% defect coverage and 100x faster testing.
17
'25
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Anritsu News
Anritsu to Showcase Multi-Core Fiber OTDR Solution at ECOC 2025
Anritsu's multi-channel OTDR solution for weakly coupled multi-core fiber visualizes crosstalk and loss to optimize next-gen optical communications infrastructure.
17
'25
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TDK News
