Anritsu and VTT Technical Research Centre of Finland validate beam-steering transmitarray technology for multi-gigabit D-band wireless links under realistic over-the-air conditions.
Keysight Technologies and Samsung Electronics demonstrate a standards-based satellite-to-satellite NR-NTN connection at CES 2026, validating 3GPP Release 19 band n252 for direct-to-cell services.
congatec broadens its module offering after integrating Kontron’s JUMPtec business, creating the industry’s most extensive COM-HPC, COM Express, SMARC, and Qseven portfolio.
Designed to reduce system complexity, the LDE Series supports faster installation and lower entry barriers for system integrators and AV professionals.
Keysight Technologies introduces a lifecycle-based software platform to analyze, validate, and monitor AI behavior in regulated environments such as automotive and industrial systems.
The new TPS4500 series from TDK addresses high-voltage industrial systems requiring configurable outputs, transformer-free three-phase operation, and digitally monitored power delivery.
Digid qualifies printed electronics technology for volume production of micrometre-scale sensors targeting robotics, medical devices, and advanced biosensing applications.
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing™ SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.