Toshiba Electronic Devices & Storage Corporation releases the DCL32xx00 Series digital isolators to eliminate ground loops in compact industrial equipment.
Microchip expands its SPE portfolio with the LAN8679 and LAN8680 transceivers and the LAN8660X/1X/2X terminal node family to extend network edge connectivity.
Baumer presents compact 5 GigE industrial cameras with high integration flexibility for industrial automation at the Vision 2026 trade show held in Stuttgart from September 29 to October 1, 2026.
Renesas Electronics introduced the TP65H020G4PLSGBD 650V GaN device to resolve thermal dissipation and board space constraints in 800V DC intermediate bus architectures.
Delta will combine its automotive energy management, xEV powertrain, in-vehicle high-performance computing and system integration expertise with NVIDIA Hyperion and NVIDIA Halos to support the development of Level 4 autonomous driving solutions.
Murata begins mass production of 0201-inch three-terminal MLCCs in the LLD series to minimize parasitic inductance in space-constrained mobile electronics.
3D Systems introduces a semiconductor wafer table prototype based on additive manufacturing to optimize thermal control and reduce production lead times.