Intel Corporation has integrated Xeon 6 processors with Arc Pro B-Series GPUs to provide scalable hardware for large language model inference and enterprise workstations.
A joint Nanomade–PolyIC development combines printed electronics and force detection to support transparent user interfaces in automotive, medical and consumer devices.
Würth Elektronik introduces modular heat sink families to improve thermal management efficiency in power electronics, embedded systems, and industrial applications.
STMicroelectronics introduces Smart STripFET F8 MOSFETs to reduce conduction losses and improve thermal performance in automotive power distribution and battery management systems.
Toshiba Electronics introduces the TPHR6704RL 40V N-channel MOSFET designed to enhance power density and thermal management within the automotive data ecosystem and industrial power sectors.