02 {{ "2026-04-02T00:00:00+00:00" | date "MMM" }} '26

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Omnivision News

Image signal processor integration for arthroscopy imaging

Omnivision ISP integration targets stable colour reproduction and low-latency processing in endoscopic visualization platforms used in minimally invasive surgical imaging workflows.

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01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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Tria Technologies News

Multi-OS Support for ARM Embedded Systems

Tria Technologies extends Qualcomm-based platforms with Yocto Linux, Windows 11 IoT, and Android to increase flexibility in embedded system design.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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Melexis News

Code-Free Three-Phase Motor Driver Simplifies BLDC Design

Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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Würth Elektronik News

Expanded Heat Sink Portfolio Targets Thermal Management Optimization

Würth Elektronik introduces modular heat sink families to improve thermal management efficiency in power electronics, embedded systems, and industrial applications.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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Rohm Semiconductors News

ROHM expands op amp portfolio for precision electronics

New CMOS op amps target automotive, industrial and consumer applications requiring accurate signal amplification and low-noise analog design.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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STMicroelectronics News

Low-RDS(on) MOSFETs optimize automotive power efficiency

STMicroelectronics introduces Smart STripFET F8 MOSFETs to reduce conduction losses and improve thermal performance in automotive power distribution and battery management systems.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

Power MOSFET Advancements in High-Efficiency Switched-Mode Power Supplies

Toshiba Electronics introduces the TPHR6704RL 40V N-channel MOSFET designed to enhance power density and thermal management within the automotive data ecosystem and industrial power sectors.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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Emerson

Emerson Launches New, Easily Configurable Welding Platform, Fully Adaptable to Evolving Manufacturing Needs

Branson Polaris Ultrasonic Welding Platform delivers a flexible, scalable and future-proof approach to joining a variety of materials in product packaging and other uses.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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Congatec News

congatec enables rugged AI computing with Intel Core Ultra COMs

New Computer-on-Modules operate from -40 °C to +85 °C, delivering up to 180 TOPS for edge AI in industrial and mission-critical environments.

Read more…

31 {{ "2026-03-31T00:00:00+00:00" | date "MMM" }} '26

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Sivers Semiconductors News

7–15 GHz Beamforming ICs for FR3 Networks

Sivers Semiconductors introduces Daybreak chipset to support 5G-Advanced and 6G FR3 deployments in base stations and CPE markets.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

Deployable 5G networks enable tactical communications

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

Image signal processor integration for arthroscopy imaging

Omnivision ISP integration targets stable colour reproduction and low-latency processing in endoscopic visualization platforms used in minimally invasive surgical imaging workflows.

Multi-OS Support for ARM Embedded Systems

Tria Technologies extends Qualcomm-based platforms with Yocto Linux, Windows 11 IoT, and Android to increase flexibility in embedded system design.

Code-Free Three-Phase Motor Driver Simplifies BLDC Design

Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.

Expanded Heat Sink Portfolio Targets Thermal Management Optimization

Würth Elektronik introduces modular heat sink families to improve thermal management efficiency in power electronics, embedded systems, and industrial applications.

ROHM expands op amp portfolio for precision electronics

New CMOS op amps target automotive, industrial and consumer applications requiring accurate signal amplification and low-noise analog design.

Low-RDS(on) MOSFETs optimize automotive power efficiency

STMicroelectronics introduces Smart STripFET F8 MOSFETs to reduce conduction losses and improve thermal performance in automotive power distribution and battery management systems.

Power MOSFET Advancements in High-Efficiency Switched-Mode Power Supplies

Toshiba Electronics introduces the TPHR6704RL 40V N-channel MOSFET designed to enhance power density and thermal management within the automotive data ecosystem and industrial power sectors.

Emerson Launches New, Easily Configurable Welding Platform, Fully Adaptable to Evolving Manufacturing Needs

Branson Polaris Ultrasonic Welding Platform delivers a flexible, scalable and future-proof approach to joining a variety of materials in product packaging and other uses.

congatec enables rugged AI computing with Intel Core Ultra COMs

New Computer-on-Modules operate from -40 °C to +85 °C, delivering up to 180 TOPS for edge AI in industrial and mission-critical environments.

7–15 GHz Beamforming ICs for FR3 Networks

Sivers Semiconductors introduces Daybreak chipset to support 5G-Advanced and 6G FR3 deployments in base stations and CPE markets.

International