These high-performance interface pads provide up to 3.3 W/m-K thermal conductivity and 20 kV insulation while minimizing signal interference and energy loss in high-frequency power systems.
Bosch Rexroth introduces the PXC7100 control system for low-current resistance welding, enabling precise splice compacting and sensor or battery joining in industrial applications.
Microchip introduces BZPACK mSiC modules designed for HV-H3TRB compliance, enabling durable and efficient power conversion in industrial and renewable energy systems.
Keysight Technologies developed this emulation and analytics platform to provide high-fidelity validation of inference-optimized hardware and software stacks within the digital supply chain of AI infrastructure.
Partnership with AMD focuses on high-bandwidth memory and DDR5 solutions to improve performance, efficiency, and scalability in AI and data center systems.