New MCU families integrate a neural processing unit and development tools to enable low-latency, energy-efficient edge AI in consumer, industrial, and robotics applications.
MediaTek introduces Genio Pro, Genio 420 and Genio 360 platforms delivering generative AI acceleration and multimedia support for edge AI and IoT devices.
Kyocera introduces an OSFP-XD optoelectronic module supporting PCIe 6.0 optical interconnects to increase bandwidth and reduce power consumption in data center architectures.
NXP Semiconductors introduces i.MX 93W to combine edge AI acceleration and tri-radio wireless connectivity for industrial, healthcare and IoT edge systems.
NXP's i.MX 95 series integrates an AI NPU with tri-radio connectivity into one package, replacing 60 components to simplify edge deployment and accelerate time-to-market.