CEA-Leti collaborates with NcodiN to move optical interposer technology toward wafer-scale manufacturing for high-bandwidth computing and AI processor integration.
Synopsys presents a cloud-enabled development platform for virtual validation of automotive and physical AI systems within complex semiconductor and software ecosystems.
MIKROE introduces a Renesas-based development board for rapid prototyping using modular sensor and communication interfaces for embedded systems and industrial IoT applications.
Microchip Technology has expanded its Trust Platform with the TA101 secure authentication integrated circuits to assist developers in meeting stringent international cybersecurity standards and legislative requirements.
Intel introduces the Core Ultra 200S Plus series to expand the automotive data ecosystem and high-end computational performance for desktop enthusiasts.