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ONSEMI News
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Samsung News
Samsung Launches 245.76TB BM1773 SSD for High-Density AI Data Centers
E3.S QLC SSD combines PCIe 5.0, 4.5GB/s sequential writes, 50K IOPS and enhanced durability for demanding AI workloads.
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STMicroelectronics News
STMicroelectronics Unveils New Image Sensor for Automotive In-Cabin Monitoring
The 1.1 MP VD56GA sensor lowers system costs for driver and occupant monitoring in high-volume vehicle platforms through enhanced infrared sensitivity.
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FESTO News
Configurable Digital I/O Module for Decentralized Automation
Festo introduces the CPX-AP-I-16DIO M12 configurable digital I/O module to optimize decentralized machine architectures and expand connectivity for Mitsubishi PLC environments.
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Intel News
Intel Demonstrates AI Inference Gains in MLPerf Inference v6.1 Benchmarks
Results showcase AI inference throughput gains achieved through software stack optimization across Intel Xeon 6 processors and Intel Arc Pro B-series GPUs.
16
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Zel Components News
Alternative Component Distribution in Electronics Manufacturing
Zel Components and partner organizations deploy alternative supply strategies to mitigate electronic component shortages and reduce procurement costs.
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Mediatek News
Advanced 2nm Silicon Architecture Powers Mobile Machine Learning Systems
MediaTek introduced a multi-core processor platform leveraging semiconductor fabrication advances to support high-density edge intelligence and low-latency mobile graphics.
16
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STMicroelectronics News
Digital Twin Center Advances Semiconductor Research and Development
STMicroelectronics collaborates with academic and industrial partners to establish a research facility deploying digital infrastructure for semiconductor design and qualification.
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ams OSRAM News
Integrated Optical Sensing Architectures for Mobile Display and Camera Subsystems
ams OSRAM introduces an imaging-to-display sensing architecture combining under-display spectral detection, multi-channel flicker analysis, and direct time-of-flight depth mapping for mobile devices.
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Micron News
