At CES 2026, TDK demonstrates new sensor, power, and haptic platforms that strengthen AI-enabled consumer, automotive, and industrial systems while debuting its “In Everything, Better” brand identity.
New 750 V G2 devices in Q-DPAK and D2PAK packages improve thermal behavior, switching efficiency, and gate-drive flexibility for automotive chargers and industrial power systems.
The expanded eFuse lineup supports wide-range power systems with integrated overcurrent, overvoltage, and thermal protection to simplify circuit design in industrial and consumer equipment.
Micro-Epsilon expands its sensor portfolio with temperature- and vacuum-resistant confocal chromatic displacement sensors for precise distance and thickness measurements up to 200 °C.
Designed for constrained networking, storage and industrial equipment, AMD’s new EPYC Embedded 2005 series combines Zen 5 compute density, scalable I/O and long-life support for 24/7 embedded workloads.
The GMSL2 series offers HDR and LED flicker–free imaging, NVIDIA Jetson Orin integration, and ruggedized design for demanding mobility, robotics, and heavy-duty industrial applications.
SGS enhances product compliance for hardlines and electrical goods through advanced testing and inspection services at its UKAS-accredited Manchester laboratory.