17
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Intel News
17
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Congatec News
Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units
Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.
16
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Thales Group News
Thales Develops Compact PNT Receiver for Defense
New receiver integrates GNSS resilience, anti-jamming, and timing functions to maintain navigation and communication in electronic warfare scenarios.
16
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Tria Technologies News
Tria Technologies Introduces COM-HPC Module with Edge AI Acceleration
New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.
16
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TDK News
TDK enables 1250 V DC designs with compact EMI chokes
New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.
16
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Infineon News
Radiation-Hardened Semiconductors Validate Performance in Deep Space
Infineon components supported Artemis II mission systems, demonstrating reliability in power, control, and communication electronics under prolonged radiation exposure conditions.
15
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Powell Electronics News
High-Density Connector Series for 56G PAM4 Systems
Amphenol’s SOSA-aligned connector, distributed by Powell Electronics, supports high-speed embedded computing with increased density and signal integrity for defense platforms.
15
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Microchip News
Microchip expands DSC family for power and motor control applications
New dsPIC33A controllers integrate real-time control, analog functions and post-quantum cryptography for secure, high-performance embedded systems.
15
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IDS Imaging Development Systems GmbH
IDS: Digital precision transforms aircraft construction with Ensenso 3D vision
An Ensenso 3D camera integrated into an automated process chain ensures accurate detection and alignment of drilling positions in aircraft cabin assembly.
15
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TDK News
