30
'26
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Rutronik News
30
'26
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Vector News
Embedded Software Integration for Scalable Vehicle Platforms
Vector contributes system integration and embedded software capabilities to NXP CoreRide, supporting faster deployment of software-defined vehicle architectures across automotive development programs.
29
'26
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STMicroelectronics News
Ultralow-Power Vision Sensors for Edge AI Devices
STMicroelectronics introduces compact global-shutter image sensors enabling always-on embedded vision for wearables, AR/VR systems, and energy-constrained smart devices.
29
'26
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TDK News
Integrated DC-DC converters simplify industrial power design
TDK Corporation introduces encapsulated converter modules to reduce design complexity and footprint in industrial power architectures.
29
'26
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Leuze
Leuze Highlights Seven Steps to Ensure Safe and Seamless Site Inspections in Automation
A structured approach to identifying risks, closing safety gaps, and achieving compliance across industrial environments.
29
'26
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Microchip News
Microchip introduces post-quantum root of trust controllers
New controllers support post-quantum cryptography and secure boot for data center, telecom and infrastructure platforms.
29
'26
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Syensqo News
Material for High-Voltage Smartphone Batteries
Syensqo develops Energain SA076 to enable safer high-voltage lithium-ion batteries for next-generation smartphone platforms.
29
'26
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Rohm Semiconductors News
ROHM NFC Chipset Enables Wireless Charging in Wearables
Compact receiver and transmitter ICs support proximity-based power transfer for ultra-small devices, addressing design constraints in next-generation wearable electronics.
29
'26
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Bodewell Group News
PECVD SiCN system for advanced semiconductor processing
ACM Research deploys PECVD SiCN platform to enable BEOL and advanced packaging process control in collaboration with a semiconductor manufacturer.
28
'26
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Kyocera News
