08 {{ "2023-02-08T00:00:00+00:00" | date "MMM" }} '23

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Rohm Semiconductors News

ROHM’s New Compact Intelligent (Smart) Low Side Switches: Reduced Power Loss and Safer Operation Using Proprietary TDACC Circuit and Device Technology

Replaces mechanical relays and MOSFETs fulfilling functional safety requirements in the automotive and industrial equipment applications.

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22 {{ "2022-12-22T00:00:00+00:00" | date "MMM" }} '22

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MURATA News

Murata Is Seeking Partners to begin discussions for a New Transparent and Bendable Conductive Film along with the Application of New Ideas to Open up the IoT Era (Technical Explanation)

Murata Manufacturing is now developing a new material with unprecedented strong points. This new material combines transparency, flexibility, conductivity, and safety. Furthermore, it realizes high workability to be able to easily draw circuit patterns and other elements with diverse methods.

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20 {{ "2022-12-20T00:00:00+00:00" | date "MMM" }} '22

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Rohm Semiconductors News

ROHM’s New MOSFETs: Contributing to Higher Efficiency and Safer Operation with an Original Insulation Structure

Deliver class-leading power dissipation in a compact package ideal for small, thin devices.

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30 {{ "2022-11-30T00:00:00+00:00" | date "MMM" }} '22

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Rohm Semiconductors News

ROHM Develops Ultra-Low-Power On-Device Learning Edge AI Chip

ROHM has developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. It utilizes artificial intelligence to predict failures (predictive failure detection) in electronic devices equipped with motors and sensors in real-time with ultra-low power consumption.

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25 {{ "2022-11-25T00:00:00+00:00" | date "MMM" }} '22

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TDK News

TDK: Flying Capacitors in PV Booster stages

One of the well-established key requirements in solar inverters is their high efficiency. But also, their costs, size and weight are subject to continuous improvements. One approach to better fulfil all these demanding requirements simultaneously is the use of multilevel topologies.

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17 {{ "2022-11-17T00:00:00+00:00" | date "MMM" }} '22

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TDK News

TDK: Wire Bondable NTC temperature sensor

The NTCWS series can be mounted by wire bonding, achieving small size, high accuracy and unquestionable reliability.

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31 {{ "2022-10-31T00:00:00+00:00" | date "MMM" }} '22

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TDK News

TDK: Power Inductor SPM Series

The SPM series power inductors are the metal composite type wire-wound inductors that have the coils integrally molded with metallic magnetic powder. Compared to ferrite-base wire-wound inductors, the SPM series inductors realize larger current, lower Rdc, smaller size and superior DC bias characteristic.

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28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

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Rohm Semiconductors News

ROHM’s New SerDes ICs for Automotive Multi-Displays Simplify Video Transmission

The full HD compatible products contribute to functional safety through end-to-end data monitoring.

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26 {{ "2022-10-26T00:00:00+00:00" | date "MMM" }} '22

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Rohm Semiconductors News

ROHM’s New Compact 300mA Automotive-Grade LDO Regulators for High Performance ADAS Sensors

ROHM developed automotive-grade LDO regulator ICs: the BUxxJA3DG-C series (BU12JA3DG-C, BU15JA3DG-C, BU18JA3DG-C, BU25JA3DG-C, BU30JA3DG-C, BU33JA3DG-C). The devices are designed for automotive applications such as sensors for ADAS (Advanced Driver Assistance Systems) which have become smaller and more powerful.

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25 {{ "2022-10-25T00:00:00+00:00" | date "MMM" }} '22

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TDK News

PCB Pattern Design for ESD Countermeasures and ESD Visualization

TDK has a lineup of multilayer chip varistors that protect equipment for malfunction and failure due to ESD (electrostatic discharge), and we have long contributed to solving customer ESD problems.

Read more…

Replaces mechanical relays and MOSFETs fulfilling functional safety requirements in the automotive and industrial equipment applications.

Murata Manufacturing is now developing a new material with unprecedented strong points. This new material combines transparency, flexibility, conductivity, and safety. Furthermore, it realizes high workability to be able to easily draw circuit patterns and other elements with diverse methods.

Deliver class-leading power dissipation in a compact package ideal for small, thin devices.

One of the well-established key requirements in solar inverters is their high efficiency. But also, their costs, size and weight are subject to continuous improvements. One approach to better fulfil all these demanding requirements simultaneously is the use of multilevel topologies.

The NTCWS series can be mounted by wire bonding, achieving small size, high accuracy and unquestionable reliability.

The full HD compatible products contribute to functional safety through end-to-end data monitoring.

TDK has a lineup of multilayer chip varistors that protect equipment for malfunction and failure due to ESD (electrostatic discharge), and we have long contributed to solving customer ESD problems.

International