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ANSYS News
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
Ansys multiphysics platforms support TSMC's latest silicon technologies, enabling advanced semiconductor vendors to create faster, lower power designs.
TSMC and Ansys join forces to enable faster, lower power semiconductor designs
Key Highlights
Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are certified for TSMC’s latest N2 nanosheet-based process technology
Ansys RaptorX™ solution for on-chip electromagnetic modeling is certified for TSMC’s N5 process
Ansys announced the certification of its power integrity platforms for TSMC’s N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs. RaptorX is now certified for TSMC’s N5 technology — crucial for modeling on-chip electromagnetic integrity in radio frequency systems, 5G, telecommunications, datacenters, and 3D-IC heterogeneous silicon systems.
Ansys has also collaborated with TSMC on an AI-enabled analysis optimization flow using Ansys optiSLang™ and Ansys multiphysics solutions, including RaptorX, RedHawk-SC, and RedHawk-SC Electrothermal. “The significant power and performance boost delivered by our most advanced 2nm process technology is driving customers’ needs for accurate and comprehensive multiphysics analysis,” said Dan Kochpatcharin, head of design infrastructure management division at TSMC. “Our latest collaboration with Ansys delivers power integrity solutions for our most advanced process technologies that are pivotal to enable customer designs, and we have extended our partnership with Ansys to include RaptorX to manage the growing influence of electromagnetic effects in high-speed circuits.”
"The Ansys multiphysics platform boasts strong technical solutions for power integrity and high-speed electromagnetics," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Our collaboration with TSMC empowers our joint customers with the most advanced multiphysics simulations and analyses, enabling them to design some of the most innovative and advanced chips in the world."
www.ansys.com
Key Highlights
Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are certified for TSMC’s latest N2 nanosheet-based process technology
Ansys RaptorX™ solution for on-chip electromagnetic modeling is certified for TSMC’s N5 process
Ansys announced the certification of its power integrity platforms for TSMC’s N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs. RaptorX is now certified for TSMC’s N5 technology — crucial for modeling on-chip electromagnetic integrity in radio frequency systems, 5G, telecommunications, datacenters, and 3D-IC heterogeneous silicon systems.
Ansys has also collaborated with TSMC on an AI-enabled analysis optimization flow using Ansys optiSLang™ and Ansys multiphysics solutions, including RaptorX, RedHawk-SC, and RedHawk-SC Electrothermal. “The significant power and performance boost delivered by our most advanced 2nm process technology is driving customers’ needs for accurate and comprehensive multiphysics analysis,” said Dan Kochpatcharin, head of design infrastructure management division at TSMC. “Our latest collaboration with Ansys delivers power integrity solutions for our most advanced process technologies that are pivotal to enable customer designs, and we have extended our partnership with Ansys to include RaptorX to manage the growing influence of electromagnetic effects in high-speed circuits.”
"The Ansys multiphysics platform boasts strong technical solutions for power integrity and high-speed electromagnetics," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Our collaboration with TSMC empowers our joint customers with the most advanced multiphysics simulations and analyses, enabling them to design some of the most innovative and advanced chips in the world."
www.ansys.com
