The new ecosystem unifies modular software tools, AI augmentation, and cross-standard support to streamline installation, debugging, analysis, and wireless performance optimization.

Silicon Labs announced the general availability of its new 22 nm Series 3 SoCs, featuring multi-core architecture and the world's first PSA Level 4 security to accelerate secure, feature-rich IoT and Matter deployments.

FG23L SoC offers ~146 dB link budget, +20 dBm power, 78 MHz Cortex-M33 core, enabling 10+ years IoT battery life.

Series 3 SiXG301 SoC withstands advanced physical attacks, ensuring RED compliance and lifecycle security; general availability expected Q3 2025.

New BG22L delivers robust security and processing for common Bluetooth devices, while BG24L supports advanced AI/ML acceleration and Channel Sounding.

These new SiWx917Y modules are designed to help device makers streamline the complex development & offer plug-and-play simplicity with global RF certifications for Wi-Fi 6 devices.

Series 3 devices answers challenges that continued acceleration of IoT poses--demands for more processing power at far-edge devices across IoT applications & demands for increasingly portable, secure, compute-intensive applications.

Silicon Labs secure intelligent wireless technology for a more connected world announced their new xG22E family of Wireless SoCs designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications.

Silicon Labs has announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date.

New BB5 family provides more development choices for simple applications.