22 {{ "2026-04-22T00:00:00+00:00" | date "MMM" }} '26

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MURATA News

Murata at Sensors Converge 2026

From May 5-7 in Santa Clara, California, Murata showcases cutting-edge mobility, medical, and industrial innovations, featuring ultrasonic clearing devices and high-precision positioning modules to accelerate the development of smarter, more connected systems.

Read more…

22 {{ "2026-04-22T00:00:00+00:00" | date "MMM" }} '26

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Microchip News

Microchip integrates programmable logic into low-power microcontrollers

CLB-based PIC MCUs combine hardware logic and embedded control to reduce latency, improve determinism and simplify timing-critical system design.

Read more…

22 {{ "2026-04-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-22T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM introduces 5th generation SiC MOSFETs for efficiency

New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.

Read more…

21 {{ "2026-04-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-21T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix advances AI servers with 192GB SOCAMM2 memory

High-density LPDDR5X module improves bandwidth and power efficiency for NVIDIA Vera Rubin platforms, addressing AI memory bottlenecks.

Read more…

21 {{ "2026-04-21T00:00:00+00:00" | date "MMM" }} '26

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STMicroelectronics News

High-precision dual operational amplifiers support a wide operating voltage range

ST introduces dual operational amplifiers featuring high offset stability and wide supply voltage integration for industrial and automotive signal-conditioning applications.

Read more…

17 {{ "2026-04-17T00:00:00+00:00" | date "MMM" }} '26

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Intel News

Scalable Mobile Processors for Enhanced Edge and Commercial Computing

Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.

Read more…

17 {{ "2026-04-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-17T00:00:00+00:00" | date "longDate" }}

Congatec News

Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units

Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.

Read more…

16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

Thales Group News

Thales Develops Compact PNT Receiver for Defense

New receiver integrates GNSS resilience, anti-jamming, and timing functions to maintain navigation and communication in electronic warfare scenarios.

Read more…

16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

Tria Technologies News

Tria Technologies Introduces COM-HPC Module with Edge AI Acceleration

New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.

Read more…

16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

TDK News

TDK enables 1250 V DC designs with compact EMI chokes

New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.

Read more…

Technical Articles

Enabling High-Speed Swept-Source OCT with Advanced Data Acquisition

Case studies

Surface-mount production lines for automotive electronics manufacturing

Murata at Sensors Converge 2026

From May 5-7 in Santa Clara, California, Murata showcases cutting-edge mobility, medical, and industrial innovations, featuring ultrasonic clearing devices and high-precision positioning modules to accelerate the development of smarter, more connected systems.

Microchip integrates programmable logic into low-power microcontrollers

CLB-based PIC MCUs combine hardware logic and embedded control to reduce latency, improve determinism and simplify timing-critical system design.

ROHM introduces 5th generation SiC MOSFETs for efficiency

New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.

SK hynix advances AI servers with 192GB SOCAMM2 memory

High-density LPDDR5X module improves bandwidth and power efficiency for NVIDIA Vera Rubin platforms, addressing AI memory bottlenecks.

High-precision dual operational amplifiers support a wide operating voltage range

ST introduces dual operational amplifiers featuring high offset stability and wide supply voltage integration for industrial and automotive signal-conditioning applications.

Scalable Mobile Processors for Enhanced Edge and Commercial Computing

Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.

Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units

Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.

Thales Develops Compact PNT Receiver for Defense

New receiver integrates GNSS resilience, anti-jamming, and timing functions to maintain navigation and communication in electronic warfare scenarios.

Tria Technologies Introduces COM-HPC Module with Edge AI Acceleration

New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.

TDK enables 1250 V DC designs with compact EMI chokes

New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.

International