24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

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innodisk

Innodisk Launches CXL Add-In Card for Scalable Edge AI Memory Expansion

The new CXL 2.0 Type 3 expansion card delivers flexible DDR5 memory scaling via PCIe Gen 5, addressing latency and space constraints in edge and micro data center environments.

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24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

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Kyocera News

KYOCERA AVX expands ultra-broadband capacitors to 110 GHz

New MLCC values and higher voltage ratings target signal integrity requirements in optical communications, RF front ends and mmWave electronics.

Read more…

24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

Teledyne SP Devices

High-Speed Data Acquisition for Advanced Applications: The ADQ35 Digitizer

Teledyne SP Devices’ ADQ35 is an established leader in high-performance data acquisition. As part of the 12 bit ADQ3 series, it offers an exceptional combination of speed, resolution, and flexibility, making it a strong fit for demanding scientific, industrial, and OEM applications.

Read more…

24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS Showcases 3D ToF, Monitoring and AI Camera Technologies for Intralogistics at LogiMAT 2026

3D ToF and intelligent vision systems for precise, reliable intralogistics automation.

Read more…

24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

Analog Devices News

Analog Devices showcases embedded sensing and control platforms

Demonstrations at Embedded World 2026 examine integrated simulation, networking and edge-level processing across robotics, industrial automation and digital health design workflows.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

Telefonica News

Pan-European federated edge infrastructure demonstration at MWC 2026

Deutsche Telekom, Orange, Telefónica, TIM and Vodafone interconnected operator edge nodes to enable cross-network application deployment across Europe.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE Launches EnOcean 5 Click Board

Bidirectional ESP3 gateway enables low-power EnOcean connectivity for building automation systems.

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23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Introduces BroadPeak Radio DFE SoC for 5G Advanced and 6G

Broadcom launches the BroadPeak BCM85021, a 5 nm integrated radio digital front-end SoC targeting massive MIMO and remote radio head applications across 400 MHz to 8.5 GHz.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Technologies Introduces Infiniium XR8 Real-Time Oscilloscope

Keysight launches the Infiniium XR8 with new front-end ASICs and digital engine architecture to accelerate high-speed digital validation and compliance testing.

Read more…

20 {{ "2026-02-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-20T00:00:00+00:00" | date "longDate" }}

TDK News

High-Ripple DC Link Capacitors for EV Chargers

TDK Corporation expands its automotive power portfolio with two aluminum electrolytic capacitor series engineered for high-voltage on-board charger DC link stages.

Read more…

Technical Articles

Satellite monitoring systems for real-time RF intelligence

Case studies

Cold, clever, convenient – Früchte Jork puts new deep-freeze warehouse into operation

Innodisk Launches CXL Add-In Card for Scalable Edge AI Memory Expansion

The new CXL 2.0 Type 3 expansion card delivers flexible DDR5 memory scaling via PCIe Gen 5, addressing latency and space constraints in edge and micro data center environments.

KYOCERA AVX expands ultra-broadband capacitors to 110 GHz

New MLCC values and higher voltage ratings target signal integrity requirements in optical communications, RF front ends and mmWave electronics.

High-Speed Data Acquisition for Advanced Applications: The ADQ35 Digitizer

Teledyne SP Devices’ ADQ35 is an established leader in high-performance data acquisition. As part of the 12 bit ADQ3 series, it offers an exceptional combination of speed, resolution, and flexibility, making it a strong fit for demanding scientific, industrial, and OEM applications.

IDS Showcases 3D ToF, Monitoring and AI Camera Technologies for Intralogistics at LogiMAT 2026

3D ToF and intelligent vision systems for precise, reliable intralogistics automation.

Analog Devices showcases embedded sensing and control platforms

Demonstrations at Embedded World 2026 examine integrated simulation, networking and edge-level processing across robotics, industrial automation and digital health design workflows.

Pan-European federated edge infrastructure demonstration at MWC 2026

Deutsche Telekom, Orange, Telefónica, TIM and Vodafone interconnected operator edge nodes to enable cross-network application deployment across Europe.

MIKROE Launches EnOcean 5 Click Board

Bidirectional ESP3 gateway enables low-power EnOcean connectivity for building automation systems.

Broadcom Introduces BroadPeak Radio DFE SoC for 5G Advanced and 6G

Broadcom launches the BroadPeak BCM85021, a 5 nm integrated radio digital front-end SoC targeting massive MIMO and remote radio head applications across 400 MHz to 8.5 GHz.

Keysight Technologies Introduces Infiniium XR8 Real-Time Oscilloscope

Keysight launches the Infiniium XR8 with new front-end ASICs and digital engine architecture to accelerate high-speed digital validation and compliance testing.

High-Ripple DC Link Capacitors for EV Chargers

TDK Corporation expands its automotive power portfolio with two aluminum electrolytic capacitor series engineered for high-voltage on-board charger DC link stages.

International