Fiber optics typically offers many advantages over conventional electrical and electronic systems, but often times a harsh environment can make the use of glass fiber difficult. Fortunately, the Diamond AVIM® connector family is specifically designed and built for these conditions.
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), commences first deliveries of its high performance VX3060-S2 Blade PC. Based on 11th Gen Intel® Core processors, this underscores Kontron’s strong partnership with Intel, enabling the company to be first to market with a powerful and versatile space-saving 3U VPX single board PC.
TDK Corporation (TSE:6762) presents a new series of very compact EPCOS X2 capacitors for noise suppression. They are rated for 275 V AC and cover a capacitance spectrum from 33 nF to 1 µF. Depending on the capacitance value, the interference suppression components have lead spaces of 10 mm (B32921X* / Y*), 15 mm (B32922X* / Y*) and 22.5 mm (B32923X* / Y*).
AT&S uses pure air as an innovative carrier medium for minimal signal loss in 5G applications. For this innovative transmission technology, the Styrian company received the Futurezone Award 2021 in the “5G Innovation of the Year powered by Huawei” category.
Flex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC) which provides high power density for data centers, thus improving board space utilization and freeing space for other components.
Impulse Embedded a leading provider of industrial computing systems and solutions, announces the availability of the RC300-CS, a Fanless Rugged Embedded PC System, featuring MXM GPU Targeting AIoT for railway and rolling stock applications.