20 {{ "2026-04-20T00:00:00+00:00" | date "MMM" }} '26

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Teledyne SP Devices

Enabling High-Speed Swept-Source OCT with Advanced Data Acquisition

Optical coherence tomography (OCT) has become an essential tool in modern medical imaging, with swept-source OCT (SS-OCT) emerging as a leading modality because of its superior imaging speed, depth penetration, and sensitivity. By employing swept laser sources, SS-OCT enables high-resolution, real-time visualization of tissue microstructures, making it particularly valuable in applications such as ophthalmology, cardiology, dermatology and dental imaging.

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17 {{ "2026-04-17T00:00:00+00:00" | date "MMM" }} '26

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Intel News

Scalable Mobile Processors for Enhanced Edge and Commercial Computing

Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.

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17 {{ "2026-04-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-17T00:00:00+00:00" | date "longDate" }}

Congatec News

Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units

Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.

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16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

Thales Group News

Thales Develops Compact PNT Receiver for Defense

New receiver integrates GNSS resilience, anti-jamming, and timing functions to maintain navigation and communication in electronic warfare scenarios.

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16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

Tria Technologies News

Tria Technologies Introduces COM-HPC Module with Edge AI Acceleration

New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.

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16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

TDK News

TDK enables 1250 V DC designs with compact EMI chokes

New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.

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16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

Infineon News

Radiation-Hardened Semiconductors Validate Performance in Deep Space

Infineon components supported Artemis II mission systems, demonstrating reliability in power, control, and communication electronics under prolonged radiation exposure conditions.

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15 {{ "2026-04-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-15T00:00:00+00:00" | date "longDate" }}

Powell Electronics News

High-Density Connector Series for 56G PAM4 Systems

Amphenol’s SOSA-aligned connector, distributed by Powell Electronics, supports high-speed embedded computing with increased density and signal integrity for defense platforms.

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15 {{ "2026-04-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-15T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip expands DSC family for power and motor control applications

New dsPIC33A controllers integrate real-time control, analog functions and post-quantum cryptography for secure, high-performance embedded systems.

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15 {{ "2026-04-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-15T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS: Digital precision transforms aircraft construction with Ensenso 3D vision

An Ensenso 3D camera integrated into an automated process chain ensures accurate detection and alignment of drilling positions in aircraft cabin assembly.

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Technical Articles

Electronic Design: What Is a Process Design Kit?

Case studies

Surface-mount production lines for automotive electronics manufacturing

Enabling High-Speed Swept-Source OCT with Advanced Data Acquisition

Scalable Mobile Processors for Enhanced Edge and Commercial Computing

Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.

Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units

Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.

Thales Develops Compact PNT Receiver for Defense

New receiver integrates GNSS resilience, anti-jamming, and timing functions to maintain navigation and communication in electronic warfare scenarios.

Tria Technologies Introduces COM-HPC Module with Edge AI Acceleration

New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.

TDK enables 1250 V DC designs with compact EMI chokes

New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.

Radiation-Hardened Semiconductors Validate Performance in Deep Space

Infineon components supported Artemis II mission systems, demonstrating reliability in power, control, and communication electronics under prolonged radiation exposure conditions.

High-Density Connector Series for 56G PAM4 Systems

Amphenol’s SOSA-aligned connector, distributed by Powell Electronics, supports high-speed embedded computing with increased density and signal integrity for defense platforms.

Microchip expands DSC family for power and motor control applications

New dsPIC33A controllers integrate real-time control, analog functions and post-quantum cryptography for secure, high-performance embedded systems.

IDS: Digital precision transforms aircraft construction with Ensenso 3D vision

An Ensenso 3D camera integrated into an automated process chain ensures accurate detection and alignment of drilling positions in aircraft cabin assembly.

International