12
'26
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TDK News
12
'26
Written on
Microchip News
Microchip Advances Edge AI Sensor Connectivity
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems while lowering power, cost and integration complexity.
11
'26
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Toshiba News
Compact Photorelays for Semiconductor Automated Test Equipment
Toshiba introduces high-current solid-state relays in a miniature package to improve switching accuracy and circuit board density in hardware testing environments.
11
'26
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Nordic Semiconductor News
Satellite and Cellular Connectivity Certification for Digital Infrastructure
Nordic Semiconductor and LooUQ obtain satellite network certification for embedded modems to accelerate dual-mode cellular and satellite IoT deployment across remote industrial infrastructure.
11
'26
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MURATA News
Murata Heads to Hot Chips 2026
At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter.
11
'26
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Anglia Components News
Anglia and Silanna Partner to Distribute Cost-Effective ADCs
The agreement delivers pin-compatible analog-to-digital converters with long-term price stability and up to 30% savings.
10
'26
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Samsung News
Next-Generation 3D Memory Architectures for AI Data Infrastructure
Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.
10
'26
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Antaira News
Antaira Launches 100W AC-Powered PoE++ Injector
The rugged INJ-0201G-bt-AC-100-T delivers up to 100W over a single cable, upgrading non-PoE networks in harsh conditions.
07
'26
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Molex News
Compact Hybrid Connectors Simplify Humanoid Robot Joint Wiring
Molex combines 15 A power delivery and 1 Gbps Ethernet in a 5.65 mm routing profile for humanoid robots, AMRs and industrial automation systems.
07
'26
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Pickering News
