30
'26
Written on
Wooptix News
30
'26
Written on
AMD News
AMD Introduces Versal Premium Gen 2 Memory on Package Adaptive SoCs
New devices integrate up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development.
29
'26
Written on
Melexis News
Digital current sensing optimizes signal integrity in automotive traction inverters
Melexis introduces a digital output current sensor to mitigate electromagnetic interference within high-power electric vehicle powertrains.
29
'26
Written on
Kvaser AB
Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity
Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.
26
'26
Written on
Rutronik News
3D Hall-Effect Sensors for Automotive and Industrial Motion Control
Distributed by Rutronik, TDK's factory-programmable 3D sensing architecture resolves spatial constraints and alignment challenges within compact electric motor actuator designs.
26
'26
Written on
Anritsu News
5G NR Uplink Data Compression Test Case Verification
Anritsu and Qualcomm verify 3GPP Release 17 uplink data compression test cases for 5G networks.
26
'26
Written on
TE Connectivity News
1.27 mm Pitch Board Connectors for Industrial Electronics
TE Connectivity introduces the AMP SMC essential connector series for board-to-board applications.
26
'26
Written on
Toshiba News
Prototyping Board for Evaluating Isolated Photorelays
Toshiba and MIKROE introduce the Opto 8 Click board to evaluate industrial photorelays.
26
'26
Written on
MURATA News
PIM API Expansion for Electronic Component Data
Murata expands its information management API service to cover 73 product categories.
25
'26
Written on
HBK World News
