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AMD News
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Toshiba News
Toshiba Introduces 3300V Dual SiC MOSFET Power Module
High surge current capability and low conduction losses enhance conversion efficiency and operational resilience across heavy rail traction and grid infrastructure.
25
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Renesas News
Ultra-Compact Configurable Mixed-Signal ICs
Renesas offers a highly miniaturized configurable hardware solution designed to consolidate analog and digital logic functions within space-constrained wearable technology hardware.
24
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Samsung News
Adaptive High-Bandwidth Memory for Mobile AI
Samsung validates its next-generation LPDDR memory on Qualcomm’s mobile platform to address rising bandwidth and power demands of edge AI.
24
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Qualcomm News
Micro-Power Processing Architectures for Multimodal Audio Wearable Devices
Qualcomm introduces a new processing platform that integrates artificial intelligence and micro-power Wi-Fi connectivity to support multimodal smart wearable ecosystems.
24
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Synopsys News
Accelerating System Design on Advanced Semiconductor Nodes
Synopsys and TSMC collaborate to deploy automated EDA workflows and unified multiphysics verification for high-performance computing components.
24
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FLIR
FLIR Launches Si2a-LD and Si2a-Pro Fixed Acoustic Imaging Cameras for Continuous Asset Condition Monitoring
Teledyne FLIR completes its Si2a-Series portfolio for continuous condition monitoring.
24
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Siemens News
Siemens & TSMC Automate Advanced Semiconductor Node Design
New agentic workflows accelerate physical verification, thermal analysis, and packaging integration across sub-2nm processes and silicon photonics architectures.
23
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STMicroelectronics News
Advanced 6-Axis Motion Sensors for Sustainable Smart Devices
STMicroelectronics launches sustainable 6-axis motion sensors featuring super-symmetric gyroscope architectures and dual-accelerometer tracking for industrial and consumer smart applications.
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Omnivision News
