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CUI devices News

CUI Devices Appoints Tony Harris as Newest Board Member

CUI Devices, an electronic components manufacturer specializing in an ever-expanding range of product technologies, today announced the appointment of Tony Harris as its newest board member.

Congatec News

Whopping 50% more edge computing power

congatec welcomes Intel Atom® x6000E Series processor launch on five form factors.

LEMO

A new LEMO production site is inaugurated!

The new REDEL 2 production site, at 400m from the main site (St-Croix, Switzerland), was officially inaugurated on 3rd September 2020.

Molex News

BittWare Boosts Wireless Application Performance with RFSoC-based Acquisition Card

BittWare, a Molex company, the leading supplier of enterprise-class products featuring FPGA technology, today announces the RFX-8440 data acquisition card featuring the Zynq UltraScale+ RFSoC (Radio Frequency System-on-Chip), from Xilinx, Inc.

SICK News

SICK and Microsoft have a vision of the future - Both technology companies combine their strengths in 3DToF technology

SICK AG (SICK) is working with Microsoft Corp. (Microsoft) to enable the development of commercial industrial 3D cameras and related solutions, which will be compatible with a Microsoft ecosystem built on top of Microsoft depth, Intelligent Cloud, and Intelligent Edge platforms. Selected customers are already testing SICK cameras that incorporate Microsoft ToF depth technology.

Vaisala News

Vaisala introduces a groundbreaking method for detecting power transformer air leaks

The new method, based on measuring total pressure of all dissolved gases in the power transformer insulation oil, will help customers detect and repair any air leaks early. This can extend the lifetime of a transformer and lead to significant cost savings.

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