24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Anritsu News

5G RedCap Device Application Evaluation Solutions for Cellular Network Testing

Anritsu Corporation launched enhanced application evaluation solutions to streamline wireless performance testing for the growing 5G market.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Toshiba News

32-Bit Arm Cortex-M4 MCUs for Industrial Control

Toshiba introduces 120 MHz entry-level MCUs with integrated motor control and analog peripherals for 5 V industrial automation.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Infineon News

Gallium Nitride Switching Technology for Solar Power Optimizers

Infineon supplies 100-volt gallium nitride devices to enhance the efficiency and power density of rooftop solar photovoltaic energy systems.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Introduces Fastest UFS 5.0 Storage for Next-Generation Mobile AI

New memory solution delivers higher speeds, improved efficiency, and compact designs for smartphones, wearables, and XR devices.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Ransemi News

Open Source CU/DU Integration for 5G Small Cells

RANsemi and TechPhosis integrate Linux Foundation OCUDU software with commercial PHY for 5G small cells.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Nanocrystalline cable cores for effective EMC interference suppression

The new WE-NCC series complements conventional ferrite cores, offering compact, temperature-stable, and broadband solutions designed specifically for modern power electronics and system reliability.

Read more…

23 {{ "2026-06-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-23T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Direct Time-of-Flight 3D LiDAR Module for Edge Systems

STMicroelectronics introduces a high-resolution 3D sensing module providing depth mapping and spatial awareness for robotics, industrial automation, and smart infrastructure.

Read more…

23 {{ "2026-06-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-23T00:00:00+00:00" | date "longDate" }}

ARROW News

Collaboration between Arrow and ST in the field of AMR

Arrow Electronics, its engineering services subsidiary eInfochips, and STMicroelectronics have announced the development of a common reference platform dedicated to autonomous mobile robots (AMR).

Read more…

23 {{ "2026-06-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-23T00:00:00+00:00" | date "longDate" }}

Infineon News

Cloud-Based Virtual Framework for Automotive Microcontroller Evaluation

Infineon introduces a digital infrastructure solution enabling automotive engineers to test and validate microcontroller capabilities without requiring physical hardware.

Read more…

19 {{ "2026-06-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-19T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Corporation Introduces New Software Defined Radio Test Solution

Combining the MD8190A hardware with IQ Control Hub software, this MATLAB integrated solution enhances design and field testing efficiency for next-generation 6G wireless development.

Read more…

Market Overview

Overview of Silicon Carbide (SiC) Electronic Components and Modules Announced in the First Half of 2026

Technical Articles

Vertical Transistor Integration Through Stacked Nanosheet Architecture

Case studies

Integrated SMT Line for Complex Assemblies

5G RedCap Device Application Evaluation Solutions for Cellular Network Testing

Anritsu Corporation launched enhanced application evaluation solutions to streamline wireless performance testing for the growing 5G market.

32-Bit Arm Cortex-M4 MCUs for Industrial Control

Toshiba introduces 120 MHz entry-level MCUs with integrated motor control and analog peripherals for 5 V industrial automation.

Gallium Nitride Switching Technology for Solar Power Optimizers

Infineon supplies 100-volt gallium nitride devices to enhance the efficiency and power density of rooftop solar photovoltaic energy systems.

Samsung Introduces Fastest UFS 5.0 Storage for Next-Generation Mobile AI

New memory solution delivers higher speeds, improved efficiency, and compact designs for smartphones, wearables, and XR devices.

Open Source CU/DU Integration for 5G Small Cells

RANsemi and TechPhosis integrate Linux Foundation OCUDU software with commercial PHY for 5G small cells.

Nanocrystalline cable cores for effective EMC interference suppression

The new WE-NCC series complements conventional ferrite cores, offering compact, temperature-stable, and broadband solutions designed specifically for modern power electronics and system reliability.

Direct Time-of-Flight 3D LiDAR Module for Edge Systems

STMicroelectronics introduces a high-resolution 3D sensing module providing depth mapping and spatial awareness for robotics, industrial automation, and smart infrastructure.

Collaboration between Arrow and ST in the field of AMR

Arrow Electronics, its engineering services subsidiary eInfochips, and STMicroelectronics have announced the development of a common reference platform dedicated to autonomous mobile robots (AMR).

Cloud-Based Virtual Framework for Automotive Microcontroller Evaluation

Infineon introduces a digital infrastructure solution enabling automotive engineers to test and validate microcontroller capabilities without requiring physical hardware.

Anritsu Corporation Introduces New Software Defined Radio Test Solution

Combining the MD8190A hardware with IQ Control Hub software, this MATLAB integrated solution enhances design and field testing efficiency for next-generation 6G wireless development.

International