02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

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Siemens digital Industry Software News

Siemens Adds Agentic AI to Chip Verification

New workflows automate RTL checks, debugging and planning while remaining compatible with existing EDA environments and cloud-based development infrastructures.

Read more…

02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

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NEC Corporation News

NEC Enables Hybrid Cloud-Edge UPF Deployment

Support for AWS Outposts racks enables telecom operators to place 5G core processing where latency and traffic conditions require flexible infrastructure design.

Read more…

02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-02T00:00:00+00:00" | date "longDate" }}

Mediatek News

MediaTek Showcases 6G and Edge AI at MWC 2026

Demonstrations span 6G interoperability, 5G-Advanced CPE with Wi-Fi 8, automotive connectivity, edge AI devices and high-bandwidth data center interconnects.

Read more…

02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

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MIkroe News

High-Current Control for Automotive Body Electronics

MIKROE launches the SmartMCD TB9M001FTG development board, an integrated platform for prototyping electric sunroofs, power windows, and adjustable seating systems.

Read more…

02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-02T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Validating NR-NTN LEO Mobility for Satellite-to-Mobile Deployments

Keysight and Samsung collaborate to demonstrate lab-based validation of 5G Non-Terrestrial Networks (NR-NTN), aligning with upcoming LEO satellite timelines like Starlink Direct to Cell.

Read more…

02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-02T00:00:00+00:00" | date "longDate" }}

Toshiba News

High-side ideal diode controller for automotive applications with reverse polarity protection

Toshiba Electronics Europe presents a compact high-side ideal diode controller for protected and redundant automotive power architecture.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Seco News

Edge AI Platforms for Industrial Systems

SECO and Qualcomm Technologies combine Dragonwing platforms and Clea software to deploy scalable edge computing solutions for industrial automation, smart grid, and advanced HMI applications.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Infineon News

Integrated 600 V GaN Half-Bridge Simplifies Power Design

Infineon introduces compact driver-integrated power stage for motor drives and switched-mode supplies requiring efficient high-frequency conversion.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Sysgo News

Embedded Platforms Align With Cyber Resilience Regulation

SYSGO will present virtualization-based real-time architectures at Embedded World 2026 to support certifiable safety and cybersecurity requirements in connected embedded systems.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

75V Motor Driver ICs Target 48V Industrial Systems

STMicroelectronics introduces scalable motor-control chips supporting multiple motor types and up to 500 W applications across automation and electromechanical equipment.

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Technical Articles

Satellite monitoring systems for real-time RF intelligence

Case studies

Früchte Jork puts new deep-freeze warehouse into operation

Siemens Adds Agentic AI to Chip Verification

New workflows automate RTL checks, debugging and planning while remaining compatible with existing EDA environments and cloud-based development infrastructures.

NEC Enables Hybrid Cloud-Edge UPF Deployment

Support for AWS Outposts racks enables telecom operators to place 5G core processing where latency and traffic conditions require flexible infrastructure design.

MediaTek Showcases 6G and Edge AI at MWC 2026

Demonstrations span 6G interoperability, 5G-Advanced CPE with Wi-Fi 8, automotive connectivity, edge AI devices and high-bandwidth data center interconnects.

High-Current Control for Automotive Body Electronics

MIKROE launches the SmartMCD TB9M001FTG development board, an integrated platform for prototyping electric sunroofs, power windows, and adjustable seating systems.

Validating NR-NTN LEO Mobility for Satellite-to-Mobile Deployments

Keysight and Samsung collaborate to demonstrate lab-based validation of 5G Non-Terrestrial Networks (NR-NTN), aligning with upcoming LEO satellite timelines like Starlink Direct to Cell.

High-side ideal diode controller for automotive applications with reverse polarity protection

Toshiba Electronics Europe presents a compact high-side ideal diode controller for protected and redundant automotive power architecture.

Edge AI Platforms for Industrial Systems

SECO and Qualcomm Technologies combine Dragonwing platforms and Clea software to deploy scalable edge computing solutions for industrial automation, smart grid, and advanced HMI applications.

Integrated 600 V GaN Half-Bridge Simplifies Power Design

Infineon introduces compact driver-integrated power stage for motor drives and switched-mode supplies requiring efficient high-frequency conversion.

Embedded Platforms Align With Cyber Resilience Regulation

SYSGO will present virtualization-based real-time architectures at Embedded World 2026 to support certifiable safety and cybersecurity requirements in connected embedded systems.

75V Motor Driver ICs Target 48V Industrial Systems

STMicroelectronics introduces scalable motor-control chips supporting multiple motor types and up to 500 W applications across automation and electromechanical equipment.

International