21
'26
Written on
Hik Vision News
21
'26
Written on
Infineon News
European Consortium Launches Moore4Power Heterogeneous Semiconductor Integration Project
Infineon Technologies coordinates a 62-partner initiative to develop advanced power electronics systems utilizing heterogeneous integration and chiplet architectures for industrial applications.
21
'26
Written on
Würth Elektronik News
Digital Isolators Support I²C Signal Protection
Würth Elektronik introduces bidirectional I²C isolators with 3750 VRMS isolation and ±150 kV/µs noise immunity for embedded systems.
20
'26
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Keysight technologies News
PCIe 7.0 Receiver Testing for 128 GT/s Systems
Keysight Technologies has expanded its PCIe 7.0 test portfolio with a new receiver stress-test calibration solution for AI and data center applications.
20
'26
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Swissbit News
PCIe SSD Platform for Embedded Industrial Systems
Swissbit AG introduces a new PCIe Gen4 SSD family for embedded systems, combining low power consumption, industrial endurance, and configurable storage options for mixed and write-intensive workloads.
20
'26
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Rohm Semiconductors News
ROHM Targets Scalable Automotive SoC Power Design
A configurable automotive power management architecture combining PMIC and DrMOS components is designed to support scalable SoC platforms in ADAS, cockpit, and vision systems.
20
'26
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IDS Imaging Development Systems GmbH
IDS camera technology powers flexible AI-supported visual inspection system
Modular plug-and-play inspection solution combines AI software, edge computing and IDS uEye XC cameras to enable fast, intuitive visual quality inspection without image processing expertise.
20
'26
Written on
TDK News
High Efficiency Point Of Load DC To DC Power Modules
TDK Corporation introduces a compact 3A power module designed to support next generation optical transceivers and artificial intelligence edge computing infrastructure.
20
'26
Written on
Fraunhofer News
High-Density Quasi-Monolithic Chiplet Integration at Wafer Level
Fraunhofer IPMS has developed a quasi-monolithic integration method utilizing structured silicon pockets to embed chiplets for advanced heterogeneous semiconductor manufacturing.
19
'26
Written on
TDK News
