23
'20
Written on
Flex Power Modules News
23
'20
Written on
CUI devices News
CUI Devices Appoints Tony Harris as Newest Board Member
CUI Devices, an electronic components manufacturer specializing in an ever-expanding range of product technologies, today announced the appointment of Tony Harris as its newest board member.
23
'20
Written on
ONSEMI news
SUBARU Selects ON Semiconductor Image Sensing Technology for its New-Generation EyeSight® Driver Assist Platform
ON Semiconductor and SUBARU redefine leading-edge ADAS capability with new machine vision algorithms and sensing technology.
23
'20
Written on
E+E ELEKTRONIK News
Miniature Sensor Module Measures CO2, Temperature and Pressure
The new EE895 sensor module from E+E Elektronik measures CO2, temperature and ambient pressure.
23
'20
Written on
Congatec News
Whopping 50% more edge computing power
congatec welcomes Intel Atom® x6000E Series processor launch on five form factors.
23
'20
Written on
Mouser News
Now at Mouser: Texas Instruments’ IWR6x mmWave 60GHz–64GHz Sensors for Industrial Radar Systems
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the new IWR6x mmWave sensors from Texas Instruments (TI).
23
'20
Written on
LEMO
A new LEMO production site is inaugurated!
The new REDEL 2 production site, at 400m from the main site (St-Croix, Switzerland), was officially inaugurated on 3rd September 2020.
23
'20
Written on
Molex News
BittWare Boosts Wireless Application Performance with RFSoC-based Acquisition Card
BittWare, a Molex company, the leading supplier of enterprise-class products featuring FPGA technology, today announces the RFX-8440 data acquisition card featuring the Zynq UltraScale+ RFSoC (Radio Frequency System-on-Chip), from Xilinx, Inc.
23
'20
Written on
SICK News
SICK and Microsoft have a vision of the future - Both technology companies combine their strengths in 3DToF technology
SICK AG (SICK) is working with Microsoft Corp. (Microsoft) to enable the development of commercial industrial 3D cameras and related solutions, which will be compatible with a Microsoft ecosystem built on top of Microsoft depth, Intelligent Cloud, and Intelligent Edge platforms. Selected customers are already testing SICK cameras that incorporate Microsoft ToF depth technology.
23
'20
Written on
Vaisala News
