Toshiba expanded its semiconductor portfolio with ten new quad-channel high-speed standard digital isolators designed for high-temperature industrial equipment.
Würth Elektronik ICS will present high-voltage power distribution and electronic control systems for mobile machinery and commercial vehicles at iVT Expo 2026 in Cologne.
Anritsu provides the spectrum analyzer hardware technology, while YOTASYS acts as system integrator, combining Anritsu’s RF hardware with its own AI, software and GPU-based processing capabilities.
Broadcom and Samsung Electronics collaborate on a new broadband-optimized fixed wireless access reference platform integrating Broadcom’s BCM6776 Wi-Fi 8 SoC with Samsung’s B1320 5G Modem.
Keysight Technologies integrates a complete EOE simulation solution into ADS 2026 for modeling signal paths in AI infrastructures and high-performance computing systems.
The showcase combines AI compute platforms, industrial storage, connectivity, sensing, and software technologies to support scalable and secure AI deployment across enterprise and industrial applications.
From June 7-12, in Boston, the company will showcase automated RF design simulation, environment emulation, and validation technologies to accelerate development across wireless, satellite, and 6G applications.
Live demonstrations featuring NVIDIA-based edge AI systems, robotic automation, lightweight VLM deployment and agentic AI workflows will showcase real-time AI processing at the edge.
Microchip's new 3.3 kV HV-D3 mSiC power modules accelerate solid-state transformer adoption to deliver efficient, direct medium-voltage power for AI hyperscale facilities and heavy industrial applications.