Intel Foundry Services will lead the first phase of the U.S. Department of Defense’s RAMP-C program to establish a domestic commercial foundry infrastructure.

Intel unveils new architectures for two x86 CPU cores, two data center SoCs, two discrete GPUs and a revolutionary multicore performance hybrid architecture for client.

Optimized for high-performance, general-purpose compute, Amazon EC2 M6i is the highest performance Intel-based Amazon EC2 instance today.

The new graphics brand will cover hardware, software and services. The first silicon will appear in products in the first quarter of 2022, in both mobile and desktop form factors.

As Intel increases its worldwide manufacturing footprint, a construction milestone passes at Intel’s Ronler Acres factory in Hillsboro, Oregon.

Intel optimizes its latest workstation platform for advanced workstation professionals.

Intel announced the Intel^® NUC 11 Extreme Kit (code-named “Beast Canyon”), a highly modular desktop PC engineered to provide a phenomenal experience for gaming, streaming and recording. With the latest 11th Gen Intel^® Core processors, support for full-size discrete graphics cards and a full range of I/O ports, the Intel NUC 11 Extreme Kit delivers high performance gameplay and smooth, immersive visuals.

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

The collaboration is part of Airtel’s 5G roadmap as it transforms India’s networks to provide the full possibilities of a hyperconnected world.

‘Behind the Builders:’ Intel Fellow Ravi Mahajan found packaging technologies were improving on a disturbingly straight line, inspiring an approach that was simple in concept but hard to pull off.