CEA-Leti is a French research institute specializing in micro and nanotechnologies, driving innovations in AI, photonics, quantum computing, and semiconductors. It collaborates with industries, startups, and academia to accelerate technology transfer from lab to market. With state-of-the-art cleanrooms and research platforms, it supports the development of cybersecurity, wireless communication, and power electronics solutions, reinforcing sustainability and eco-innovation.
What's new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.
