At the TSMC 2022 Technology Symposium, Siemens Digital Industries Software today announced that its ongoing collaboration with longtime foundry partner TSMC has resulted in new product certifications for several of Siemens’ most advanced toolsets.

Siemens Digital Industries Software today announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology. With this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPC U+ process for their next-generation analog/mixed-signal designs.

Siemens Digital Industries Software announced it has enabled several of its leading electronic design automation (EDA) product families for the latest versions of Samsung Foundry’s advanced processes, including Siemens’ solutions targeting advanced packaging, electrostatic discharge (ESD) rules and integrated circuit (IC) design in the cloud.

Siemens’ Simcenter solutions selected as the technological foundation of model-based development (MBD/MBSE). Model-based development process and systems are used in Japan and globally to adapt to the biggest automotive transformation in 100 years. Pilot deployment completed in three years; full scale deployment planned in 2022.

New JEP181 standard, proposed and chaired by Siemens, simplifies exchange of simulation data for thermal digital twins of electronic devices.

Bringing the proFPGA technology and team in-house can allow Siemens to more fully integrate and optimize the scalable, high-performance prototyping platform for lab and desktop environments into its Veloce hardware-assisted verification system.

Siemens today announced that the newest version of its Nucleus ReadyStart software for Arm^®-based devices has been updated to provide enhanced support for the Arm Cortex^® family of processors.

Today at the TSMC 2021 Online Technology Symposium, Siemens Digital Industries Software announced that its Calibre^® nmPlatform tools and Analog FastSPICE platform are now both qualified for TSMC’s advanced N3 and N4 processes.

Engineered to expedite verification closure and expose complex design issues, Siemens’ QVIP solution supports detailed functional verification across all layers of the PCI Express 6.0 specification.

Siemens Digital Industries Software today announced that long-term partner Samsung Foundry has recognized its partnership and substantial contributions to the broader Samsung Foundry ecosystem over the past year with three Samsung SAFE Awards.