New MCU families integrate a neural processing unit and development tools to enable low-latency, energy-efficient edge AI in consumer, industrial, and robotics applications.

Texas Instruments integrates mmWave radar with NVIDIA Jetson Thor to enhance humanoid robot safety, enabling low-latency 3D perception and reliable navigation in complex environments.

The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.

TI’s TMAG5134 detects magnetic fields as low as 1mT, reduces system costs, consumes 0.6µA, and enhances design flexibility.

NISAR’s dual-band radar captures global Earth data every 12 days using TI’s radiation-hardened chips, optimizing power, precision and performance.

Predictive battery management technology from TI delivers up to 30% longer run time in battery-powered electronics.

The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.

TI introduces a groundbreaking MCU, 38% smaller than existing models, designed to enhance space efficiency, performance, and power optimization in compact electronics.

TI's exhibit in hall 3A, booth 131 will showcase the latest advancements in application areas such as robotics, energy transition and electric vehicles.

The new opto-emulator portfolio of signal isolation semiconductors is designed to improve signal integrity, consume less power, and extend the lifetime of high-voltage industrial and automotive applications.