STMicroelectronics has extended support for Microsoft^® Azure RTOS in the STM32Cube development environment, covering additional high performance, mainstream, ultra-low-power and wireless microcontrollers (MCUs) from the STM32 family.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and SEONG JI INDUSTRIAL (SeongJi), a global one-stop supplier of state-of-the-art wireless connectivity modules, today announced the LSM module series for sub-GHz LPWAN from SeongJi powered by ST’s STM32WL, the world’s first Sigfox and LoRa System-on-Chip (SoC).

STMicroelectronics’ L9908 integrated automotive three-phase gate driver unit (GDU) operates in 12V, 24V, or 48V systems and has flexible input and output channels to fulfil numerous applications in conventional and hybrid/electric vehicles.

This collaboration brings the power of advanced 3D gesture, cursor, and motion control to the digital pen, unleashing a host of new applications and user convenience.

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

The STMicroelectronics VIPerGaN50 simplifies building single-switch flyback converters up to 50 Watts and integrates a 650V gallium-nitride (GaN) power transistor for superior energy efficiency and miniaturization.

The STMicroelectronics TSV772 dual operational amplifier (op amp) combines high accuracy, low power consumption, and the option of an extremely small 2.0mm x 2.0mm DFN8 package.

STMicroelectronics is increasing the integration of automotive body electronics with the L99DZ200G door-zone system IC, which enables a single-chip front-drives-rear setup managing a front-door window, mirror, and lighting as well as the rear-window lift.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top manufacturer of micro-electro-mechanical systems (MEMS), is introducing its third generation of MEMS sensors.

STMicroelectronics,a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a new family of high-resolution Time-of-Flight sensors that bring advanced 3D depth imaging to smartphones and other devices.