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SENSOR + TEST 2024

Nuremberg • 11 JUN '24

News

electronics-journal.com
Fraunhofer News

Fraunhofer consortium presents one-stop store for micromechanical ultrasound

The institutes Fraunhofer ISIT, IPMS and ENAS are presenting a pioneering initiative to promote MEMS-based ultrasonic sensor technology at SENSOR+TEST in Nuremberg, Germany.

Fraunhofer consortium presents one-stop store for micromechanical ultrasound

Sensors based on microelectromechanical systems (MEMS) have become an integral part of our everyday lives. In ultrasonic sensor technology, they offer numerous advantages in terms of miniaturization, functionality and cost efficiency, enabling innovative solutions for a wide range of applications.

However, the high development complexity and initial costs of these semiconductor-based micromechanical ultrasonic transducers (MUT) prevent many small and medium-sized companies from developing their own solutions.

To close this gap, the Fraunhofer Institutes ISIT, IPMS and ENAS are presenting a pioneering initiative: a one-stop shop for the next generation of ultrasonic sensor technology.

The institutes Fraunhofer ISIT, ENAS and IPMS have been leading the development of micromechanical ultrasonic devices and systems within the Research Fab Microelectronics Germany (FMD) for years.

The plattform offers not only a broad technology portfolio of electrostatic and piezoelectric solutions, but also has a first-class infrastructure for pilot production in its own clean rooms. From concept development to production, characterization and connection technology to system integration, the institutes work together to offer customized development services along the entire value chain for a wide range of applications in the frequency range from 20 kHz to 20 MHz, for example in production, medical technology and human-machine interaction.

From June 11 to 13, 2024, the three Fraunhofer Institutes will present their groundbreaking technology platform for micromechanical ultrasonic transducers at the SENSOR+TEST in Nuremberg at the joint booth 1-317 and in several lectures at the 22nd GMA/ITG Symposium.

www.ipms.fraunhofer.com

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