Congatec News

Congatec GmbH, founded in 2004 and headquartered in Deggendorf, Germany, is a leading supplier of embedded computer modules and single board computers. The company specializes in Computer-on-Modules (COMs), including standards such as COM-HPC, COM Express, SMARC, and Qseven, which are integral to applications in industrial automation, medical technology, transportation, and energy sectors. Congatec's products enable OEMs to enhance system performance and scalability while reducing time-to-market. With a focus on innovation, quality, and customer support, Congatec collaborates closely with clients to deliver tailored solutions that meet the evolving demands of embedded computing.

www.congatec.com

10 APR '24

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congatec introduces 3.5-inch application carrier board for COM-HPC Mini modules

Congatec presents the first board-level product in line with its recently introduced aReady. strategy.

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22 MAR '24

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Congatec welcomes publication of COM-HPC Carrier Design Guide Rev. 2.2

COM-HPC Mini specification is now complete.

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21 MAR '24

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Congatec expands its modular edge server ecosystem with a µATX server carrier board

The new µATX server carrier board offers scalability across the entire Intel Ice Lake D processor range and beyond.

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01 MAR '24

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CONGATEC ENHANCES ITS COMPUTER-ON-MODULES PORTFOLIO WITH CTRLX OS SUPPORT

Bosch Rexroth has opened up the Linux-based ctrlX OS operating system for embedded computer applications from congatec.

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31 JAN '24

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congatec simplifies system consolidation by integrating the Hypervisor on its x86 Computer-on-Modules

Congatec has integrated the Hypervisor into all new x86 COMs, making it an easy addition to its x86-based Computers-on-Modules (COMs).

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20 DEC '23

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congatec launches COM Express Compact module with brand new Intel^® Core™ Ultra processors

congatec is introducing its latest range of COM Express Compact modules based on the Intel^® Core Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

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18 DEC '23

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Next-generation AI computing for the edge

Congatec is introducing its latest COM Express Compact modules, powered by Intel^® Core™ Ultra processors, which offer a unique combination of CPU, GPU, and NPU, making them ideal for running demanding AI workloads at the edge.

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15 NOV '23

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congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM

congatec introduces six new COM Express Compact Computer-on-Modules based on 13th Gen Intel Core processor featuring highest ruggedness.

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11 OCT '23

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Maximum performance for mini footprints

congatec welcomes ratification of COM-HPC 1.2 specification, Introducing COM-HPC Mini.

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29 SEP '23

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Congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors

High-end edge AI and vision processing in ultra-low power envelop.

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