This certification qualifies these modules for operation in railway applications, confirming that they meet the requirements for extreme conditions such as extended temperatures, rapid temperature changes, shocks, and vibrations.

congatec is pleased to announce that it is expanding its strategic solutions portfolio in the Arm processor sector to include Texas Instruments (TI) processors.

With the new COM-HPC Mini standard, even the most space-constrained solutions can now benefit from a high-performance boost and a significantly larger number of new high-speed interfaces.

The ultimate performance boost consolidated edge applications have been waiting for.

Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here.

Congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini.

Performance boost now standard-compliant.

Congatec – a leading vendor of embedded and edge computing technology – enters the high-end industrial workstation and desktop client market by introducing its first modular Micro-ATX compliant carrier board with COM-HPC interface.

Congatec – a leading vendor of embedded and edge computing technology – extends its Intel Xeon D-2700 processor based Server-on-Module portfolio by launching five new modules in the compact (160x160mm) COM-HPC Server Size D performance class.

Congatec – a leading vendor of embedded and edge computing technology – introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each.