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'20
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Cadence News
www.cadence.com
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'20
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Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the results of a three-way collaboration with TSMC and Microsoft focused on utilizing cloud infrastructure to reduce semiconductor design signoff schedules. Through this collaboration, common customers will have an accelerated path to complete timing signoff by adopting the Cadence® Tempus Timing Signoff Solution and the Quantus Extraction Solution using TSMC technologies on the Microsoft Azure Cloud with the Cadence CloudBurst Platform.
01
'20
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Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development
Ambarella to shorten design cycle using Clarity 3D Solver for fast, accurate 3D analysis
29
'20
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Cadence Optimizes Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile Device Development
Cadence Design Systems, Announced that it has broadened its long-standing collaboration with Arm to advance the development of mobile devices based on the Arm® Cortex®-A78 and Cortex-X1 CPUs. To drive Cortex-A78 and Cortex-X1 adoption, Cadence has delivered a comprehensive, digital full flow Rapid Adoption Kit (RAK) that helps customers optimize power, performance, and area (PPA) and boost overall productivity.
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