Cadence Design Systems, Inc., established in 1988 and headquartered in San Jose, California, is a global leader in electronic design automation (EDA) and intelligent system design. The company provides software, hardware, and silicon structures for designing integrated circuits and systems, enabling electronic product development across various industries. Cadence's offerings include custom IC design, digital design and signoff, functional verification, and system analysis, supporting sectors like consumer electronics, automotive, aerospace, and healthcare. Their commitment to innovation and collaboration has positioned them as a trusted partner in the semiconductor industry, facilitating the creation of cutting-edge electronic products worldwide.
Significantly expands multi-physics simulation portfolio with the addition of proven CFD technology for the aerospace, automotive, industrial and marine industries.
Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications.
High capacity and scalability allowed Samsung Foundry to qualify its latest chips for advanced-node applications in the automotive, mobile, consumer and healthcare industries.
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Rockley Photonics, a leading supplier of integrated photonic solutions, has deployed a comprehensive set of Cadence system analysis and custom tools to design a state-of-the-art, high-performance System-in-Package (SiP) for hyperscale data centers. Using a broad suite of Cadence tools, Rockley Photonics achieved first-pass success, accelerating time to market.
Cadence achieves recognition for joint development of N3 design infrastructure, 3D-IC design productivity solution, timing signoff in the cloud design solution and DSP IP.