Versions Available Supporting High-Speed DDR3L/DDR4 Memory Interface and Octal-SPI Memory Interface for Simpler Design.

New SmartBond DA1470x Family Features Small Form Factor with Integrated Applications and 2D Graphics Processors, Voice Activity Detector and Power Management Enables Small Form Factor for IoT Product Designs.

Announced at 2022 Symposium on VLSI: Achieving 5.9 ns Random Read Access and 5.8 MB/s Write Throughput on Test Chip.

Renesas Investing $10 million in Arduino’s New Round of Series B Funding; Renesas Senior Vice President, Chris Allexandre, to Join Arduino’s Board of Directors.

The new chips enable I3C control plane networks with multiple initiator controllers, such as CPU and Baseboard Management Controllers (BMC), to support targets across a large physical network running at full speed by improving signal integrity and reducing capacitive loading. They also support heterogeneous designs by providing IO level shifting and protocol translation for mixed I2C/SMBus and I3C networks.

Microcontroller Leader to Showcase Performance, High Integration and Security Advances at Embedded World 2022 Exhibition and Conference.

RA Family of 32-bit Arm Cortex-M Microcontrollers Offers Ultimate IoT Security with Renesas’s Secure Crypto Engine (SCE) and Arm TrustZone.

Boosting Power Semiconductor Production Capacity in Response to Growing Demand for EVs.

New Devices from the Timing Leader Offer High Output Count, Small Packages, and Design Margin for Future Requirements; Complete Industry’s First PCIe Gen6 Timing Solution.

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that its wireless power charging technology is integrated in the Active ES^® pen solutions from Wacom, a leader in cutting-edge digital pen and ink solutions.