ADLINK expands its 3.5” SBC portfolio with AI-ready SBC35-MTL and rugged SBC35-ASL, offering flexible I/O via SBC-FM modules for diverse edge applications.

COM-HPC-mMTL: 14-Core Intel^® Core™ Ultra Processor with Integrated ARC GPU+NPU and 16x PCIe Ultra-Power Performance, Perfectly Sized to Fit Any Space.

The new OSM-MTK510 features a 6-core CPU, AI acceleration (3.2 TOPS), low power consumption (<5W), NPU for fast AI inference, and robust storage for AI tasks.

Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment.

Designed as a Media Player for Smart Retail, the EMP-100 is an industrial Next Unit of Computing (NUC) device with dual 4K display capabilities that comes in a compact size and durability, making it fit for the industrial sector as well.

Two new series of Mini-ITX motherboards provide power-efficient and high-performance options for edge AI applications.

Ideal for smart manufacturing, renewable energy, smart electric vehicle charging and smart buildings.

The ADLINK designed EGX-PCIE-A380E incorporates an Intel Arc GPU to deliver a PCIe Gen4 powerful, highly efficient discrete graphics card.

Two-day virtual event will explore the integration of edge computing and AI, industry trends and display technologies.

Breakthrough Intel^® Core technology with ADLINK Computer-on-Modules allow for hybrid architecture performance and a wide variety of deployment scenarios with superior performance.