Newest addition to the Dimensity 5G series continues MediaTek’s history of flagship innovation.

MediaTek has unveiled the Dimensity 1080, the newest chipset in the company’s popular Dimensity portfolio for 5G smartphones. The new 5G chipset offers a nice performance bump and significantly upgraded camera features compared to its predecessor, the Dimensity 920.

The T830 is built with MediaTek’s M80 modem which supports advanced Release 16 capabilities for sub-6GHz band operations, making the platform ideal for 5G networks around the globe.

The company’s latest chipset offers device makers another high-performance option for flagship smartphones.

MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas.

MediaTek leads in pervasive wireless connectivity with advanced Filogic Wi-Fi 7 technology.

Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022.

MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today unveiled the world’s first 7-nanometer 8K digital TV flagship system-on-chip (SoC), the MediaTek Pentonic 2000. Built with TSMC’s N7 advanced process technology, the MediaTek Pentonic 2000 offers unparalleled performance and power efficiency with features including powerful artificial intelligence (AI) engines, Motion Estimation and Motion Compensation (MEMC), Versatile Video Coding (VVC) decoding and picture-in-picture (PiP) technology.

The MediaTek Pentonic smart TV series is built on MediaTek’s innovative technologies in display, audio, AI, broadcasting and connectivity. All-in-one flagship chip integrates powerful AI-engines, MEMC, VVC decoding and picture-in-picture technology.

Highly integrated chipsets offer fast, reliable connectivity with enhanced performance for broadband routers, mesh systems, enterprise access points and retail routers.