The new Dimensity 6100+ chipset makes advanced 5G connectivity more accessible while offering improved features.

At MWC 2023, MediaTek will spotlight technology and product highlights from its Dimensity, Filogic, Genio, Kompanio, and Pentonic portfolios, along with a variety of new demos for 5G beyond mobile.

Dimensity 8200 offers cutting-edge gaming, display, connectivity, and picture quality features in ultra power-efficient 4nm chipset.

MediaTek Upgrades Flagship 4K 120Hz TV Experiences with New Pentonic 1000 Chipset.

Newest addition to the Dimensity 5G series continues MediaTek’s history of flagship innovation.

MediaTek has unveiled the Dimensity 1080, the newest chipset in the company’s popular Dimensity portfolio for 5G smartphones. The new 5G chipset offers a nice performance bump and significantly upgraded camera features compared to its predecessor, the Dimensity 920.

The T830 is built with MediaTek’s M80 modem which supports advanced Release 16 capabilities for sub-6GHz band operations, making the platform ideal for 5G networks around the globe.

The company’s latest chipset offers device makers another high-performance option for flagship smartphones.

MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas.

MediaTek leads in pervasive wireless connectivity with advanced Filogic Wi-Fi 7 technology.