Applied Materials, Inc. today unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements.

Applied Materials, Inc. introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps for heterogeneous chip design and integration.

Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).

Applied Materials, Inc. today unveiled a major innovation in process control that uses Big Data and AI technology to help semiconductor manufacturers accelerate node development, speed time to revenue and earn more profits over the life of a node.

Applied Materials, Inc. today announced a new addition to its highly successful Centris^® Sym3^® etch product family that now enables chipmakers to precisely pattern and shape ever-smaller features in leading-edge memory and logic chips.