For fully automated inline inspection of unpopulated PCBs, 3D snapshot sensors from Micro-Epsilon are used. Unlike conventional test systems such as microscopes, they are more cost-efficient and work significantly faster. For high-end ceramics substrates, manufacturing tolerances up to 2 µm apply which can be monitored using surfaceCONTROL sensors.

The innovative white light interferometers from Micro-Epsilon set a benchmark in high-precision distance and thickness measurements. These sensors enable stable measurement results with sub-nanometer resolution offering a comparatively large measuring range and offset distance. The interferometers are available in 3 series: the IMS5400-DS for high-precision industrial distance measurements, the IMS5400-TH for accurate thickness measurements and the vacuum-suitable IMS5600-DS for distance measurements with picometer resolution.

The new scanCONTROL 30xx laser scanners offer the highest performance and are used for high speed and precise 2D/3D measurement tasks.

The thicknessCONTROL MTS 820x and MTS 920x thickness measuring systems from Micro-Epsilon offer a new and efficient solution for measurement tasks in hot rolling mills. They enable high precision measurements on thick and thin materials and are considered more precise and efficient than X-ray devices.

In order process huge components using automated plasma cutting systems down to micrometer accuracy, it is necessary to carry out reliable 3D measurements of these components in advance.

The scanCONTROL 3060-25/BL laser profile scanners set a new performance level in precision profile measurements.

The capaNCDT MD6-22 from Micro-Epsilon is a capacitive measuring device designed for mobile, high precision gap and distance measurements.

The colorSENSOR CFO100 is used for precise position detection in automated printing processes of cosmetics bottles.

In numerous industrial processes, high precision temperature control is required to achieve high and consistent quality results.