The new compact VCSEL proximity sensor contributes to greater miniaturization and battery capacity in wireless earbuds and other wearable devices.

Program Announces products and periods for long-term supply to ensure worry-free adoption in long life cycle equipment.

Reduces component volume by 99% and power loss by 55% when replacing silicon MOSFETs.

ROHM has developed Hall ICs, the BD5310xG-CZ / BD5410xG-CZ series, designed for automotive applications requiring magnetic detection.

ROHM developed LED driver ICs for automotive LCD backlights, supporting large displays in infotainment and instrument clusters, enhancing next-generation car infotainment.

The new RGB chip LED for automotive interiors minimizes colour variations due to colour mixing.

ROHM has started mass production of 650V GaN HEMTs GNP1070TC-Z and GNP1150TCA-Z, jointly developed with Ancora Semiconductors.

0.2Milliohm (PSR100) and 15W class (PSR330) variants in the industry’s smallest* size are also being commercialized.

Semikron Danfoss and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules.

ROHM has established mass production technology for Short-Wavelength Infrared (SWIR) devices in the industry’s smallest class 1608-size (1.6mm × 0.8mm) for portable/wearable/hearable devices requiring material detection.