TDK Corporation (TSE 6762) announces the introduction of the TDK-Lambda TPF45000-385 three-phase input, non-isolated 45kW AC-DC power supply.

The market for wireless earphones and headphones is rapidly expanding worldwide. According to the 2021 Worldwide Electronics Market published by Fuji Chimera Research Institute, it is estimated to have reached 210 million units in 2019 and forecasted to grow to 776 million in 2026 (approximately 3.6 times the 2019 level). A driving factor is the advent of completely wireless earphones (TWS: True Wireless Stereo*1), where the left and the pieces are independently wireless.

TDK Corporation (TSE:6762) announces the new DBM20/ZBM20 and ZBM-AC of TDK-Lambda buffer modules. TDK-Lambda Corporation (President and CEO: Sanai Hattori) will start accepting orders from February 2022.

TDK Corporation (TSE:6762) presents the new B78416A* series of compact EPCOS transformers with EP 6 cores for ultrasonic applications. The series comprises five types with transformation ratios between 1:1:8.42 and 1:1:15.

TDK Corporation (TSE:6762) has announced that in an industry first, it has successfully built a recycling system that reuses PET films used in the manufacturing process of multilayer ceramic capacitors (MLCCs)*1.

TDK Corporation (TSE:6762) announces that it has successfully shipped prototype heads with next generation recording technology, MAS-MAMR, which is co-developed with Toshiba Corporate R&D Center and Toshiba Electric Devices & Storage Corporation.

TDK Corporation (TSE: 6762) has extended its range of bipolar DC high-voltage contactors to include the new HVC43 (B88269X3**0C011) series. These products complete the existing range by offering continuous currents from 150 A DC to 250 A DC and operating voltages of up to 1000 V DC. The contactors are available in 12 V or 24 V coils with a power consumption of 6 W.

TDK Corporation (TSE: 6762) presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 per cent compared to preceding types.

TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.

TDK Corporation (TSE 6762) announces the introduction of the 500W rated TDK-Lambda brand CUS500M1 series of AC-DC power supplies. The series is certified to the medical IEC 60601-1 and audio / visual / ITE (Information Technology Equipment) IEC 62368-1 standards for both Class I or Class II (double insulated) installations.