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Trelleborg Unveils Advanced Semiconductor Seals at Semicon Europa 2025
Showcasing Isolast PureFab, Turcon Variseal NW, and K-Fab seals, Trelleborg delivers high-purity, high-temperature, low-outgassing solutions for extreme front-end and sub-fab semiconductor processes.
www.trelleborg.com
Isolast® PureFab™ JPF42, an ultra-high temperature perfluoroelastomer (FFKM) developed for demanding subfab applications and thermal processes, including rapid thermal processing (RTP), atomic layer deposition (ALD) and oxidation.
Trelleborg Sealing Solutions demonstrates its extensive engineering capabilities and expanded range of semiconductor seals at Semicon Europa 2025, at stand 311 in Hall C1, Messe München, Germany, from November 18 to 21.
Chris Busby, Global Segment Director Semiconductor, says: "The extreme temperatures and more aggressive chemical precursors increasingly characterizing semiconductor environments demand ever-more reliable sealing solutions to prevent premature failure. We will showcase the latest innovations in our semiconductor portfolio, specifically engineered to address these challenges at Semicon Europa 2025. As a Trelleborg customer, you benefit from premium engineering capabilities to develop the right custom solutions for today's increasingly extreme fab and sub-fab environments, including the unique ability to model compression set data using finite element analysis (FEA). A step change in technology, this advanced FEA provides engineers with more accurate predictions of a seal's usable lifetime as they design and manufacture finished products."
Trelleborg will showcase its extensive Isolast® PureFab® range, providing excellent performance in aggressive front-end processes, including deposition, etch, ash/strip, plasma cleaning and thermal processing such as atomic layer deposition. Comprising leading-edge perfluoroelastomers (FFKM), PureFab® offers unique properties including high-temperature stability, high purity, exceptionally low trace metal content and outstanding plasma resistance. This leads to reduced particle generation and ultra-low outgassing performance in high-vacuum conditions, enabling end users to extend product maintenance cycles while ensuring process yield is maximized.
Also featured are bonded slit valve door seals for wafer transfer chambers, offering significantly higher performance than conventional O-Rings. Comprised of dynamic rubber-to-metal bonded seals, they are characterized by a longer lifespan and a much more reliable sealing performance. Thanks to their extremely low particle generation and high durability, costly downtime and maintenance intervals are minimized. Naturally, this reliable product meets all semiconductor industry standards.
Another solution on display is the Turcon® Variseal® NW. The Turcon® case of the flange seal encompasses an energizing spring that eliminates the possibility of contact between the spring or spring cavity and system media. It is ideal for semiconductor applications where it can successfully operate in a vacuum and is proven in fluorine gas.
Isolast® K-Fab™ is a FFKM specifically formulated for semiconductor applications, which forms the sealing element of the Isolast® K-Fab™ flange seal. Resistant to both extreme temperatures and the complex chemistries found in critical subfab environments, the elastomer element uses far less material than traditional O-Rings, improving the seal's thermal properties and eliminating thermal expansion and groove overfill.
Trelleborg Sealing Solutions will also highlight the significant expansion of its European semiconductor manufacturing capabilities in Malta. The site has added over 500 square meters of cleanroom space, focusing on fluoroelastomer (FKM) and FFKM elastomer products with options to extend capabilities in the future. Production in the extension is scheduled to begin in mid-2026.
www.trelleborg.com
Trelleborg Sealing Solutions demonstrates its extensive engineering capabilities and expanded range of semiconductor seals at Semicon Europa 2025, at stand 311 in Hall C1, Messe München, Germany, from November 18 to 21.
Chris Busby, Global Segment Director Semiconductor, says: "The extreme temperatures and more aggressive chemical precursors increasingly characterizing semiconductor environments demand ever-more reliable sealing solutions to prevent premature failure. We will showcase the latest innovations in our semiconductor portfolio, specifically engineered to address these challenges at Semicon Europa 2025. As a Trelleborg customer, you benefit from premium engineering capabilities to develop the right custom solutions for today's increasingly extreme fab and sub-fab environments, including the unique ability to model compression set data using finite element analysis (FEA). A step change in technology, this advanced FEA provides engineers with more accurate predictions of a seal's usable lifetime as they design and manufacture finished products."
Trelleborg will showcase its extensive Isolast® PureFab® range, providing excellent performance in aggressive front-end processes, including deposition, etch, ash/strip, plasma cleaning and thermal processing such as atomic layer deposition. Comprising leading-edge perfluoroelastomers (FFKM), PureFab® offers unique properties including high-temperature stability, high purity, exceptionally low trace metal content and outstanding plasma resistance. This leads to reduced particle generation and ultra-low outgassing performance in high-vacuum conditions, enabling end users to extend product maintenance cycles while ensuring process yield is maximized.
Also featured are bonded slit valve door seals for wafer transfer chambers, offering significantly higher performance than conventional O-Rings. Comprised of dynamic rubber-to-metal bonded seals, they are characterized by a longer lifespan and a much more reliable sealing performance. Thanks to their extremely low particle generation and high durability, costly downtime and maintenance intervals are minimized. Naturally, this reliable product meets all semiconductor industry standards.
Another solution on display is the Turcon® Variseal® NW. The Turcon® case of the flange seal encompasses an energizing spring that eliminates the possibility of contact between the spring or spring cavity and system media. It is ideal for semiconductor applications where it can successfully operate in a vacuum and is proven in fluorine gas.
Isolast® K-Fab™ is a FFKM specifically formulated for semiconductor applications, which forms the sealing element of the Isolast® K-Fab™ flange seal. Resistant to both extreme temperatures and the complex chemistries found in critical subfab environments, the elastomer element uses far less material than traditional O-Rings, improving the seal's thermal properties and eliminating thermal expansion and groove overfill.
Trelleborg Sealing Solutions will also highlight the significant expansion of its European semiconductor manufacturing capabilities in Malta. The site has added over 500 square meters of cleanroom space, focusing on fluoroelastomer (FKM) and FFKM elastomer products with options to extend capabilities in the future. Production in the extension is scheduled to begin in mid-2026.
www.trelleborg.com
