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Parker launches thin bond-line thermal greases for PCB cooling
Silicone-based thermal interface materials target low-pressure, high-tolerance assemblies, with ASTM D5470 thermal impedance data for electronics and automotive modules.
www.parker.com
Parker Hannifin’s Chomerics Division has introduced a new series of silicone-based thermal greases designed to transfer heat away from PCB-level components while maintaining very thin bond lines. The THERM-A-GREASE™ range is positioned for electronics thermal management applications where assembly tolerances are tight, and compression forces must be kept low.
Thermal conductivity options up to 7.0 W/m·K
The THERM-A-GREASE™ portfolio includes four grease grades differentiated by thermal conductivity: 1.5 W/m·K (THERM-A-GREASE™ 15), 3.0 W/m·K (THERM-A-GREASE™ 30), 5.0 W/m·K (THERM-A-GREASE™ 50), and 7.0 W/m·K (THERM-A-GREASE™ 70). All products use a thermally conductive filler in paste form to improve heat flow between components and heatsinks or mating surfaces.
A key specification is the minimum bond line thickness of 0.025 mm, intended to support thin bond-line requirements in manufacturing environments with strict assembly tolerances.
ASTM D5470 thermal impedance data for low-pressure assemblies
For thermal interface materials, impedance under pressure is often the more direct indicator of heat transfer performance across an interface. Parker provides thermal impedance values measured in accordance with ASTM D5470, at pressures of 2.75 bar and 6.89 bar, using the minimum bond line thickness of 0.025 mm.
- THERM-A-GREASE™ 15: 0.097°C·cm²/W at 2.75 bar; 0.084°C·cm²/W at 6.89 bar
- THERM-A-GREASE™ 30: 0.097°C·cm²/W at 2.75 bar; 0.084°C·cm²/W at 6.89 bar
- THERM-A-GREASE™ 50: 0.084°C·cm²/W at 2.75 bar; 0.071°C·cm²/W at 6.89 bar
- THERM-A-GREASE™ 70: 0.065°C·cm²/W at 2.75 bar; 0.045°C·cm²/W at 6.89 bar
The stated performance targets applications where thermal management must be achieved without high clamping force—useful for densely packed or mechanically sensitive PCB assemblies.
Handling and process compatibility for production and rework
The THERM-A-GREASE™ series is designed to deflect under assembly pressure with low compression force, helping reduce stress on components, solder joints, and PCB leads. Parker positions the material for common electronics manufacturing workflows, including stencilling, screen printing, and dispensing.
From a process perspective, the greases are supplied as ready-to-use materials without requirements for mixing, curing, or refrigeration, which simplifies storage and line integration. The product is also presented as suitable for rework and repair, where removal and reapplication are routine.
Reliability focus for harsh environments
Parker states the greases are qualified through a reliability testing regime including exposure to thermal cycling, long-term heat aging, and high humidity, with stability claims including resistance to pump-out and hardening or cracking over time. This aligns with thermal interface material (TIM) failure modes commonly seen in long-life electronics and vibration/temperature-variable installations.
Target application areas include CPUs, GPUs, and memory modules, along with power supplies, power conversion equipment, lighting, and automotive control modules—use cases where consistent thermal contact is required over repeated temperature cycles and long operating hours within a broader electronics thermal management stack.
Electrical properties and packaging formats
For electrical behaviour, Parker specifies a dielectric constant of 7.0 at 1,000 kHz (ASTM D150) and a dissipation factor of 0.002 at 1,000 kHz (Chomerics test method).
The THERM-A-GREASE™ range is offered in multiple packaging formats, including manual syringe, EFD plastic cartridge, 8-ounce container, and aluminium cartridge, with fill volumes up to 300 cc.
www.parker.com
Handling and process compatibility for production and rework
The THERM-A-GREASE™ series is designed to deflect under assembly pressure with low compression force, helping reduce stress on components, solder joints, and PCB leads. Parker positions the material for common electronics manufacturing workflows, including stencilling, screen printing, and dispensing.
From a process perspective, the greases are supplied as ready-to-use materials without requirements for mixing, curing, or refrigeration, which simplifies storage and line integration. The product is also presented as suitable for rework and repair, where removal and reapplication are routine.
Reliability focus for harsh environments
Parker states the greases are qualified through a reliability testing regime including exposure to thermal cycling, long-term heat aging, and high humidity, with stability claims including resistance to pump-out and hardening or cracking over time. This aligns with thermal interface material (TIM) failure modes commonly seen in long-life electronics and vibration/temperature-variable installations.
Target application areas include CPUs, GPUs, and memory modules, along with power supplies, power conversion equipment, lighting, and automotive control modules—use cases where consistent thermal contact is required over repeated temperature cycles and long operating hours within a broader electronics thermal management stack.
Electrical properties and packaging formats
For electrical behaviour, Parker specifies a dielectric constant of 7.0 at 1,000 kHz (ASTM D150) and a dissipation factor of 0.002 at 1,000 kHz (Chomerics test method).
The THERM-A-GREASE™ range is offered in multiple packaging formats, including manual syringe, EFD plastic cartridge, 8-ounce container, and aluminium cartridge, with fill volumes up to 300 cc.
www.parker.com
