AcceleRate mP 0.635 mm Pitch Connectors Now Available from Powell
High-density Samtec interconnects support 64 Gbps PAM4 for AI, HPC, and advanced datacom.
www.powell.com
Powell Electronics now stocks Samtec’s 0.635 mm pitch AcceleRate® mP series connectors, a next-generation family of high-density, high-speed power and signal arrays developed for increasingly demanding AI, HPC, and advanced datacom systems.
Designed for exceptional signal integrity and compact system architectures, the AcceleRate mP series features a low-profile form factor with standard 5 mm and 10 mm stack heights. The connectors support data rates of up to 64 Gbps PAM4 (32 Gbps NRZ) and are engineered to meet the requirements of PCIe® 6.0 and CXL™ 3.1 architectures.
A key innovation of the series is its rotated power blade design, which improves thermal performance while simplifying breakout routing. An open-pin-field layout further enhances routing efficiency and grounding flexibility in dense PCB environments. Configurations support up to eight power contacts and 240 signal contacts, addressing both power delivery and high-speed signaling needs.
For mechanical robustness and reliable assembly, each connector includes weld tabs for secure board-level attachment and polarized guide posts to support blind mating. Optional alignment pins are available for applications requiring additional mating precision.
“The AcceleRate mP series represents a major step forward in high-density interconnect design,” said Gary Evans, European Director at Powell Electronics. “As next-generation compute and networking architectures push the limits of power, speed, and space, this platform provides the performance and flexibility engineers need to design with confidence.”
www.powell.com
