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Molex Unveils AI Optical Interconnect Platform
Molex accelerates AI cluster scaling with high-density optical switching and CPO innovations.
www.molex.com
Molex has introduced a comprehensive optical interconnect roadmap aimed at accelerating AI cluster deployment and hyperscale data center scaling. The announcement includes enhancements to its Co-Packaged Optics (CPO) toolkit and the debut of a High-Radix Optical Circuit Switch (OCS) Platform.
Faster deployment and improved serviceability
At the core of the announcement is the new VersaBeam EBO Backplane Connector, designed to consolidate up to 192 fibers into a single interface. Built on Expanded Beam Optical (EBO) technology, the solution reduces sensitivity to dust and minimizes maintenance.
When combined with the TeraVERSE® detachable fiber connector from Teramount, the system enables a modular, serviceable fiber-to-chip architecture.
Key benefits include:
- Up to 85% reduction in deployment time
- Simplified installation through “blind-mate” connectivity
- Reduced need for cleaning, inspection, and specialized handling
- Improved serviceability with swappable optical components
Boosting density and reducing power consumption
Molex has also expanded its CPO toolkit to address bandwidth, power, and thermal challenges in AI infrastructure.
New additions include:
Molex has also expanded its CPO toolkit to address bandwidth, power, and thermal challenges in AI infrastructure.
New additions include:
- Versatile Format Interconnect (VFI) Optical Backplane System
- Up to 50% increase in interconnect density
- External Laser Source Small Form Factor Pluggable (ELSFP)
- Moves lasers off-chip to improve reliability
- Reduces thermal load and enhances system efficiency
These solutions align with Optical Internetworking Forum (OIF) CPO 2.0 standards, ensuring interoperability and scalability.
High-radix optical switching for AI clusters
A major highlight is the launch of the High-Radix Optical Circuit Switch (OCS) Platform, designed to enable large-scale, reconfigurable optical connectivity.
Built on MEMS-based optical switching technology, the platform:
High-radix optical switching for AI clusters
A major highlight is the launch of the High-Radix Optical Circuit Switch (OCS) Platform, designed to enable large-scale, reconfigurable optical connectivity.
Built on MEMS-based optical switching technology, the platform:
- Eliminates the need for power-intensive optical-electrical-optical (O-E-O) conversion
- Reduces power consumption and thermal load
- Enables dynamic reconfiguration of network topologies
- Supports flatter, more efficient architectures for AI workloads
This approach allows data center operators to maximize GPU utilization and optimize network performance for both AI training and inference workloads.
Enabling next-generation AI infrastructure
According to Peter Lee, Vice President and General Manager of the Optical Solutions Business Unit at Molex, the rapid growth of AI is placing unprecedented demands on data center networks.
The company’s integrated optical stack is designed to deliver:
Enabling next-generation AI infrastructure
According to Peter Lee, Vice President and General Manager of the Optical Solutions Business Unit at Molex, the rapid growth of AI is placing unprecedented demands on data center networks.
The company’s integrated optical stack is designed to deliver:
- Greater scalability for hyperscale deployments
- Improved operational and energy efficiency
- Flexible, high-density interconnect architectures
Showcasing at OFC 2026
Molex will demonstrate its full optical portfolio at OFC 2026, including:
Molex will demonstrate its full optical portfolio at OFC 2026, including:
- VersaBeam EBO Backplane Connector
- TeraVERSE fiber interface
- VFI and ELSFP solutions
- High-Radix OCS Platform live demonstration
The showcase will highlight real-time optical path reconfiguration and system-level performance at scale, reinforcing Molex’s role in advancing next-generation AI data center connectivity.
Edited by an industrial journalist, Lekshman Ramdas, with AI assistance.
www.molex.com
Edited by an industrial journalist, Lekshman Ramdas, with AI assistance.
www.molex.com
