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Danisense Launches DP12IP High-Precision Transducer

A compact, PCB-mounted module providing isolated DC and AC measurements for space-constrained power electronics.

  www.danisense.com
Danisense Launches DP12IP High-Precision Transducer

Danisense has introduced the DP12IP series current transducer, a module designed to provide isolated direct current (DC) and alternating current (AC) measurement for demanding printed circuit board (PCB) mounted power electronics applications.

Hardware Design and Measurement Capabilities
Engineered for integration into 1U power supplies and other space-constrained equipment, the PCB-mount package features a 32-millimeter form factor and weighs 250 grams. The hardware supports current measurements up to 18A and accommodates measurement resistors up to 100 ohms at full scale, facilitating stable data acquisition for power conversion and control systems.

The transducer utilizes closed-loop compensated fluxgate technology, operating with a fixed excitation frequency and second harmonic zero-flux detection. This architecture provides highly stable measurement performance with a maximum linearity error of 10 parts per million (ppm). The system is targeted for deployment in magnet power supplies for particle accelerators, precision servo drives for motion control, battery test benches, and power analysis systems. Loic Moreau, Sales and Marketing Director at Danisense, indicated that combining this specific fluxgate technology with a compact PCB-mount integration addresses the operational requirement for accurate current measurement in next-generation power electronics platforms.

Additional Context
This section details technical specifications and competitive benchmarking not included in the original product announcement.

In the high-precision current sensing market, fluxgate technology provides significantly lower offset and gain drift compared to conventional Hall-effect alternatives, placing Danisense in direct competition with premium sensor lines from manufacturers such as LEM and HIOKI. The push for extreme miniaturization in transducer components is largely driven by the rapid industrial adoption of wide-bandgap (WBG) semiconductors, including Silicon Carbide (SiC) and Gallium Nitride (GaN), which enable smaller, higher-density power converters. By migrating metrology-grade measurement capabilities directly onto the printed circuit board, engineers can eliminate the parasitic inductance and space penalties associated with external cabling and bulky standalone measurement modules, thereby optimizing the thermal and spatial footprint of modern high-frequency test benches and precision power architectures.

Edited by Lekshman Ramdas, Induportals editor – adapted by AI.

www.danisense.com

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