Keysight to present at electronica 2026

electronica 2026 takes place from November 10 to 13, 2026, at the Trade Fair Center Messe München in Munich, Germany, covering electronic components, systems, and test equipment across global manufacturing sectors. At Stand 506 in Hall A4 and within the Measurement Technology Forum, Keysight Technologies showcases validation platforms designed to test high-density data center power topologies, 1.6-terabit interconnects, and automotive electrification networks.

Core Technology and System Architecture
The technical architecture centers on the Functional Interconnect Test Solution paired with signal integrity oscilloscopes to evaluate 1.6-terabit optical and electrical transmission fabrics. Testing protocols verify multi-lane transceiver performance operating at 100G and 200G per lane, measuring jitter, bit-error distributions, and channel loss across dense silicon photonics and physical layer interfaces. AI-assisted design workflows leverage surrogate modeling and algorithmic agents to automate high-dimensional parametric exploration across benchtop power and source-measure instruments. In the high-frequency domain, the PSG XG7 analog signal generator coordinates with modular PXI network analyzers to execute calibrated lab-to-field microwave and millimeter-wave characterization.

Deployment or Implementation
The hardware and software platforms deploy across semiconductor packaging facilities, high-speed test benches, and electric vehicle interoperability laboratories. Interconnect test fixtures integrate directly with device under test channels to validate signal integrity without introducing external fixture parasitics. Vehicle charging validation instruments interface between electric vehicles and electric vehicle supply equipment to analyze vehicle-to-grid power delivery and protocol conformance. For regulatory cyber resilience, device security audit suites map physical hardware vectors to verify compliance with the Cyber Resilience Act and international security standards.

Industry Applications
The measurement platforms serve hyperscale data center operators, high-performance semiconductor fabricators, defense contractors, and automotive subsystem manufacturers. Scaling AI compute clusters creates severe thermal and signal integrity challenges, where sub-picosecond jitter or power supply ripple can degrade inter-accelerator communication links. Standardized physical-layer characterization enables engineering teams to isolate channel crosstalk, verify transceiver compliance, and ensure deterministic link performance across multi-vendor computing architectures.

Operational Impact and Performance Metrics
Automating transceiver and power characterization with agentic software workflows shortens test execution cycles and prevents operator setup variance during multi-lane parameter sweeps. Real-time signal integrity analysis identifies signal attenuation and impedance mismatches across 100G and 200G lanes, preventing costly board re-spins and field link failures. Establishing unified physical layer and protocol testing frameworks allows manufacturers to accelerate product certification, verify charging interoperability, and stabilize production yields across advanced electronics programs.

Edited by Romila DSilva, Induportals Editor, with AI assistance.