Multifunctional enclosure system KV 4600
All functions are integrated into the enclosure front, thus offering a high degree of flexibility for your electronics.
Modular and innovative enclosure system
Ready for the future - the electronic enclosure KV 4600 sets new standards in terms of modularity and functionality.
The multifunctional, modular enclosure system with overall widths of 12.5 / 17.5 / 22.5 mm and further are particularly suitable for modern control and industrial IoT applications as well as a number of further applications - also applicable as single enclosure and stand-alone solution. Reduce your installation effort - with just a few enclosure components to the finished device. Increase your degree of automation - the push-in terminals meet the high requirements of the reflow soldering process. Individuality - customer-specific adaptations can be realized in a simple and cost-effective way.
Highlights:
- Module widths from 12.5 mm and different installation depths available
- Usage of up to two circuit boards per enclosure width
- High signal density due to the use of compact push-in terminals
- Light conductor concept - high display density with minimum space requirements
- Common bus concepts can be integrated into the bottom assembly
- Optionally sealable, tiltable front cover (manipulation protection)
- Optional mounting rail bus system (In-Rail-Bus)
- Easy and cost-effective realization of customer-specific adaptations
Customer benefits:
- Full functionality at the enclosure front
- PCB surface up to 9500 mm² allows multiple applications and a cost-effective design
- Quick installation by simplified enclosure design
- High mechanical stability and vibration resistance
Electronic enclosure smart and super compact
The I/O electronic enclosure is a variant of the enclosure series KV 4600 and excels by its super compact module width of only 12.5 mm and depth of 66 mm. The I/O enclosure is particularly suitable for modern control and industrial IoT applications, e.g. in the area of process engineering, and a number of further applications with confined space conditions. The pluggable push-in connection technology is preferably integrated from the front side.
The wiring, reading of signals or the connection of plugs is therefore practice-oriented and convenient in the application. Device systems are often contacted and managed decentrally via bus systems. For this purpose, the I/O electronic enclosure offers connecting elements that are separately available and make it possible to link the individual modules.
Highlights:
- Convenient front connection technology for the transfer of signals, data, and power
- Up to 20 inputs/outputs each module - 5 slots per circuit board
- Space-saving module width of only 12.5 mm with an installation depth of 66 mm
- PCB surface of 6429 mm² allows for manifold applications
- High mechanical stability
- Common bus concepts can be integrated into the bottom assembly
- Optionally, each terminal connection can be assigned to a light conductor
