CONGATEC INTRODUCES FIRST COM-HPC MINI MODULES AT EMBEDDED WORLD 2023

congatec – a leading vendor of embedded and edge computing technology – will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3 / booth 241). The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that are hardly larger than a credit card.

Highlight of the innovations: COM-HPC Mini
The flagship of congatec’s embedded world showcase are first samples of COM-HPC Mini designs. Launching officially after final PICMG ratification of the new specification, the first high-performance COM-HPC Mini modules will be equipped with the new 13th Gen Intel Core processors (codename Raptor Lake), which represent the latest benchmark for the high end of embedded and edge computing at client level.

The COM-HPC Mini form factor predominantly addresses ultra-compact high-performance designs such as DIN rail PCs or rugged handhelds and tablets. However, COM-HPC Mini also solves the Gordian knot that developers of ultra-compact COM Express systems have been facing when wanting to switch to COM-HPC to be able to utilize latest interface technologies.

The COM-HPC Mini with its 95x60 mm is a real liberator, opening up entirely new high-performance perspectives – in particular for the many ultra-compact system designs.