Sivers Photonics demonstrates next-generation DFB laser arrays supporting 4 Terabit GPU to GPU communication for Generative AI applications
Sivers Semiconductors, will be present at the upcoming European Conference on Optical Communication 2023, taking place in the company’s hometown of Glasgow at the Scottish Exhibition Centre from 1 – 5 October 2023.
- Sivers and Ayar Labs will hold a joint live demonstration, showing the Sivers 8-wavelength distributed feedback (DFB) laser array integrated into the Ayar Labs SuperNova™ multi-wavelength optical source supporting 4 Terabit data communication. The Wall Street Journal explains this advanced technology in yesterday’s published article: https://www.wsj.com/articles/chip-companies-see-the-light-e790968c.
- Interim Managing Director and CTO Andrew McKee, will deliver a talk entitled “Advances in InP Laser Arrays for Data Centre and Sensing Applications” on the Market Focus stage in the exhibition area on Tuesday 3 October at 11.20 am.
- Sivers will also participate in “PICs for Quantum Applications” Symposium, Tuesday 2 October from 3.30 – 5.00 pm, where Andy McKee will be a panelist and speaker.
You can find Sivers Photonics at booth #615, from 2-4 October. The team from Sivers look forward to showcasing their range of custom III-V photonic devices, with a focus on CW-WDM MSA compliant 8-wavelength O-Band CW DFB laser arrays, which will be shown as part of a live demo.
Sivers will host a joint live demonstration with Ayar Labs, showcasing the 8-wavelength distributed feedback (DFB) laser array from Sivers Photonics, integrated into the Ayar Labs SuperNova™ multi-wavelength optical source. The demonstration will be located at Sivers’ booth, #615, during the exhibition, running from 2 – 4 October. Teams from Sivers Photonics and Ayar Labs will be available throughout the event to take attendees through the live demonstration.
This advanced joint technology between both companies is driving revolutionary breakthroughs supporting generative AI applications. As foundational AI models have become larger and more complex, they require more GPU processing and memory capacity. Integrating optical I/O within the GPU package to communicate with the rest of the GPU cluster, allows for efficient scaling of infrastructures to handle ever-growing AI demands. By using optical connections instead of electrical, power consumption can be lowered by up to 90% while allowing for 5-10x better communication within the AI cluster to increase utilization of all GPUs.
In addition to their presence at the exhibition, Sivers Photonics CTO, Andy McKee, will present, “Advances in InP Laser Arrays for Data Centre and Sensing Applications” on the Market Focus stage in the exhibition area on Tuesday 3 October at 11.20 am.
Sivers will also be taking part in the symposium, “PICs for Quantum Applications”, where Andy McKee will be a panelist and speaker, presenting “High Performance Laser sources for Hybrid PIC Quantum Applications”. The symposium takes place on Tuesday 3 October from 3.30 – 5.00 pm, during the ECOC conference.
“Electrical communication in generative AI clusters is getting to its limit, with regards to speed, heat and capacity. With Sivers laser array we will be able to allow for 5-10x better performance with up to 90% less power consumption to give generative AI clusters the performance needed. With Sivers lasers integrated in Ayar Labs SuperNova™ multi-wavelength optical source, we are working together to solve one of the main challenges for GPU to GPU communication to support the future revolution of generative AI applications”, said Anders Storm, Sivers Semiconductors Group CEO.
ECOC is the leading international event for the latest advances in optical communications and networking. From research to marketplace, from components to systems and networks, ECOC features the industry’s most innovative companies showcasing optical innovations, products, technology, and research enabling communications networks globally.
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