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Kontron News
Kontron introduces a COM-HPC Mini Module based on 13th Generation Intel® Core™ technology
The COMh-m7RP (E2) enables maximum performance in miniature format.
Kontron a leading global provider of IoT/Embedded Computer Technology (ECT), announces the COM-HPC Mini module - COMh-m7RP (E2) based on 13th Generation Intel® Core™ technology. With the ratification of the COM-HPC 1.2 specification to COM-HPC Mini, PICMG has significantly extended the high-performance standard. Customers now benefit from the broad scalability of the standard, offering new application possibilities.
The COM-HPC Mini module measures only 95 mm x 70 mm and thus complements the COM-HPC standard with a more compact format compared to the COM-HPC Client and Server formats. The COM-HPC high-speed connector with 400-pins provides tremendous IO capabilities taking care of the increasing requirements for high-speed IO interfaces also in the small form factor segment.
The COMh-m7RP (E2) supports the entire range of the 13th Gen Intel® Core™ Raptor Lake family (-U / -P / -H), offering up to 14 cores (up to 6 P-cores and up to 8 E-cores) based on Intel® performance hybrid architecture. With up to 96 graphics execution units driven by Intel® Iris® Xe graphics, it delivers high-performance graphics and fast video processing for an impressive experience and highly parallel AI workloads with four display pipes and Pipelock synchronization.
The modules come with up to 64 GB LPDDR5(x)-6000 soldered memory and 2x 2.5 Gbit Ethernet, including TSN. As a storage medium, an NVMe SSD up to 1 TB can be optionally integrated onboard. With 16 PCI Express lanes - 8x PCIe Gen3 + 8x PCIe Gen4 (optional 8x PCIe Gen5 for higher performance SKUs), two 10 GbE interfaces as well as versatile DDI / USB4 / USB3 interfaces, including Thunderbolt and DisplayPort Alternate Mode, the COMh-m7RP (E2) brings unprecedented IO connectivity to a very small form factor.
The COM-HPC® Mini module provides essential, industrial-grade features such as support for In-Band Error Correction Code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time Sensitive Networking (TSN) and an extended temperature range of -40 °C to +85 °C (operating). Selected SKUs are compliant to industrial use conditions of 24/7 operation over 10 years for best-in-class durability. IoT differentiation also ensures long-life availability.
In a nutshell, the COMh-m7RP (E2) module offers the highest possible performance in a compact and space-saving format for compute-intensive applications, as well as demanding control and visualization tasks, with minimal space and challenging environmental requirements.
"COM-HPC Mini enables the integration of ultra-high-performance COMs in the smallest application areas. It is crucial that the technical possibilities of the Intel® Next Gen Core™ platforms can be fully utilized," explains Irene Hahner, Product Manager COM-HPC Modules at Kontron.
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