JUMPtec COM Express and SMARC modules with next-generation Intel Core 3 processor

The new Intel^® Core 3 and N-Series processors are backward-compatible with previous generations (codenamed Alder Lake N / Amston Lake).

With these next-generation processors, all three module form factors deliver increased performance, the addition of a 4-core 6W SKU, and enhanced energy efficiency. As in previous versions, integrated AI instruction sets – Intel^® AVX (Advanced Vector Extensions 2) and Intel^® VNNI (Vector Neural Network Instructions) – enable rapid processing of deep learning inferences, making them ideal for intelligent, performance-intensive edge applications with low power requirements.

Improved graphics performance via Intel^® Graphics with INT8 support and up to 32 Execution Units (EUs) significantly boosts object recognition capabilities.

These energy-efficient modules, rated for an operating temperature range from 0°C to 60°C, are suitable for fanless, compact systems in rugged and industrial environments. Typical applications include IoT gateways, control computers, and input devices in industrial settings, rugged mobile platforms, as well as Point-of-Sale (POS), Point-of-Interest (POI), kiosk systems, and digital signage.

COM Express^® Compact Type 6 supports up to 16 GB DDR5-4800 via a single SODIMM socket, up to four display interfaces, six PCIe 3.0 lanes, four USB 3.2 Gen 2 / 2.0, four USB 2.0 interfaces, two SATA ports, one 2.5GBASE-T Ethernet, and optional eMMC flash.

COM Express^® Mini Type 10, ideal for space-constrained systems, supports up to 32 GB LPDDR5-4800 memory-down, four PCIe 3.0 lanes, two USB 3.2 Gen 2, six USB 2.0, two SATA ports, and onboard eMMC.

SMARC^®, optimized for low-profile applications, offers up to 32 GB LPDDR5-4800 memory-down, up to two USB 3.2 Gen 2, four USB 2.0, one SATA port, onboard eMMC, and two Ethernet ports supporting 1GBASE-T or optionally 2.5GBASE-T.

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