Anritsu’s new Simultaneous Sweep for MS46131A VNAs enables synchronized, parallel measurements across four units, reducing test time and enhancing multi-band testing flexibility.
Exxelia, a designer and manufacturer of high-reliability passive electronic components, announces its participation in the 55th edition of the International Paris Air Show (SIAE 2025).
Keysight’s Electromagnetic Simulator and Synopsys’ AI-powered RF design migration flow, provide an efficient, integrated radio frequency circuit re-design solution.
binder enhances component reliability with custom PUR foaming and potting processes, ensuring optimal protection for sensitive electromechanical and electronic assemblies.
JUMPtec unveils new COM and SMARC modules powered by Intel Core 3 and N-Series processors, delivering enhanced performance for embedded and edge computing applications.
Murata’s NXJ1T series offers compact, high-isolation 1W DC-DC converters for demanding industrial, medical, and energy applications with exceptional reliability.
STMicro begins mass production of ST67W611M1 Wi-Fi/Bluetooth module, developed with Qualcomm; Siana sees early success integrating it into STM32-based IoT devices.
Micron’s 1-gamma LPDDR5X delivers industry-leading 10.7Gbps speed, 20% power savings, and the thinnest package, enabling faster, energy-efficient AI on flagship smartphones.
Cliff Electronics expands its FT Connector range with dual USB FeedThroughs, offering compact, cost-effective connectivity solutions for data, power, and modern device integration.