ST. PAUL, Minn.--(BUSINESS WIRE)-- 3M, 3M Innovative Properties Co. and Cinotop Electronics Co., Ltd. have reached a patent license agreement for use of 3M’s metal mesh technology.
STMicroelectronics’ EVL400W-EUPL7 evaluation board delivers a ready-to-use 400-Watt power-supply solution that meets today’s toughest eco-design norms. The board leverages innovative features of ST’s L4984D current-mode PFC controller and L6699 resonant half-bridge controller to maximize energy efficiency in multiple operating modes.
NGK INSULATORS, LTD. (hereinafter "NGK") based in Nagoya, Japan, announced that it will exhibit a maintenance-free small power source module for IoT devices at CES 2020 jointly with TOREX SEMICONDUCTOR LTD. (President: Koji Shibamiya, Headquarters: Chuo-ku, Tokyo; hereinafter “TOREX”).
The city of Speyer in the state of Rheinland-Palatinate was Germany’s “lightning capital” in 2019. Siemens’ lightning information service BLIDS (which stands for Blitz-Informationsdienst von Siemens) detected just under 3.1 lightning strikes per square kilometer in Speyer in 2019.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced a new device structure that improves the reliability of SiC MOSFET [1]. Schottky barrier diodes [2] (SBDs) embedded into the MOSFET realize a structure that improves reliability more than 10 times [3] compared to Toshiba’s typical structure while suppressing any rise in on-resistance.