28
'26
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Advantech News
28
'26
Written on
Zel Components News
Component Distribution Network Expansion for Electronic Manufacturing
Zel Components integrates seven manufacturing partners to bypass supply chain constraints and accelerate industrial hardware development.
27
'26
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Seco News
Transitioning Embedded Prototypes to Industrial Edge AI
SECO introduces a standardized system-on-module designed to bridge rapid developer prototyping with full-scale industrial integration for advanced robotics and machine vision workflows.
27
'26
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Lane Electronics News
High-Reliability Compact Interconnect Systems for Unmanned Aerial Vehicles
Lane Electronics provides a range of low-weight, vibration-resistant electrical connectors engineered to support the demanding hardware requirements of autonomous drone platforms.
27
'26
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Congatec News
congatec secures aReady.COM edge architectures with patented OT-IT communication
Isolated system partitions and controlled data exchange integrate IoT connectivity, virtualization and AI while strengthening security by design.
27
'26
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Kyocera News
Vibration-Resistant Surface-Mount Electrolytic Capacitors
KYOCERA AVX introduces a new line of electronic components designed to mitigate mechanical stress in harsh environments by maximizing board-mounting strength.
27
'26
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Aetina
Aetina Launches MegaEdge AIP-RQ87 for Private AI and Intelligent Automation
The new 2U edge AI system enables rapid deployment of private LLMs, AI agents, RAG applications, and intelligent automation with enterprise-grade performance in a compact on-premises platform.
27
'26
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Keysight technologies News
AttoTude Accelerates Sub-THz Interconnect IC Design with Keysight EDA Software
AttoTude has reduced its design cycles by more than 50% while achieving first-pass silicon success across advanced RF, sub-THz, and THz tape-outs that underpin its guided-wave interconnect platform.
27
'26
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Rutronik News
Nordic Semiconductor launches the nRF93M1 LTE Cat 1 bis Module
Now available at Rutronik, the kit provides an ideal platform for getting started with the new LTE Cat 1 bis module and accelerating proof-of-concept development.
27
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Infineon News
