06
'25
Written on
STMicroelectronics News
06
'25
Written on
TE Connectivity News
TE Connectivity Unveils Inside Device Connectivity Portfolio
New compact connectors deliver up to 45 A capacity, high EMI resilience, and vibration tolerance—optimising ECUs, HPCs, and ADAS integration in next-gen software-defined vehicles.
03
'25
Written on
Silicon Labs News
Silicon Labs Series 3 SoCs launch for next-gen connectivity
Silicon Labs announced the general availability of its new 22 nm Series 3 SoCs, featuring multi-core architecture and the world's first PSA Level 4 security to accelerate secure, feature-rich IoT and Matter deployments.
03
'25
Written on
TDK News
TDK Develops AI Chip for Real-Time Learning
TDK and Hokkaido University developed an analog reservoir AI chip prototype that mimics the cerebellum, enabling real-time learning and high-speed, low-power processing for edge AI applications like human interfaces.
03
'25
Written on
Infineon News
Infineon launches industry-first TLVR power module for AI data centers
New dual-phase module delivers 140A output, 50% PDN loss reduction, ultra-fast transient response, and improved efficiency to meet AI growth demands.
03
'25
Written on
MvTec News
MVTec Highlights Machine Vision Advancements for Semiconductor Quality & Efficiency
MVTec presents HALCON, MERLIC, and Deep Learning Tool, boosting defect detection, traceability, precision, and production speed while reducing waste.
03
'25
Written on
ByteSnap Design News
ByteSnap Unveils OMaaS for Smarter Component Obsolescence Management
Proactive BOM monitoring and lifecycle tracking help UK manufacturers prevent disruptions, reduce administrative workload, and focus on innovation instead of reactive obsolescence firefighting.
03
'25
Written on
Broadcom News
Broadcom Showcases Industry-Leading Quality and Reliability of Co-Packaged Optics
As hyperscale data centers push beyond 51.2 Tb/s switch bandwidth, CPO offers a sustainable path forward by addressing the power constraints and physical limitations of traditional pluggable optics.
02
'25
Written on
Vishay News
Vishay Intertechnology Power Metal Strip Resistor Delivers Power to 5 W in Compact 1206 Case Size
Offering High Power Density of > 650 W/in2, Space-Saving Device Provides Low Resistance Down to 0.3 mΩ to Increase Efficiency.
02
'25
Written on
Rutronik News
