Delta will combine its automotive energy management, xEV powertrain, in-vehicle high-performance computing and system integration expertise with NVIDIA Hyperion and NVIDIA Halos to support the development of Level 4 autonomous driving solutions.
Murata begins mass production of 0201-inch three-terminal MLCCs in the LLD series to minimize parasitic inductance in space-constrained mobile electronics.
3D Systems introduces a semiconductor wafer table prototype based on additive manufacturing to optimize thermal control and reduce production lead times.
Quobly and CEA-Leti are collaborating to utilize the FAMES Pilot Line for testing scaling methodologies in semiconductor manufacturing for quantum architectures.
The industrial-grade DDR5 8000 RDIMM delivers 8000 MT/s data transfer speeds, 16GB–64GB capacities, and registered ECC architecture to support demanding AI and enterprise-server workloads.
BOPLA introduces modular packaging systems featuring transparent film heating and advanced cooling mechanisms for industrial Internet of Things applications.
Keysight collaborates with the Berkeley Wireless Research Center (BWRC) to pioneer flexible, high-efficiency OTA measurement techniques for emerging 6G systems and upper-midband spectrum applications.
Diodes Incorporated introduces a new family of field-plated Super Barrier Rectifier products designed to optimize performance within the automotive data ecosystem and modern vehicle power architectures.
IBASE Technology Inc. introduced the IB966, a 3.5-inch single board computer powered by Intel Core Ultra Series 3 processors for industrial automation and edge AI applications.