03
'26
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Protolabs News
03
'26
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Trumpf News
Ionized Sputtering for Glass Substrate Packaging
TRUMPF introduces an industrial plasma generation process designed to coat high-density through-glass vias, facilitating rapid data transmission in artificial intelligence processors.
03
'26
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Würth Elektronik News
High-Speed Optocoupler WL-OCHS for Digital Signal Transmission
Würth Elektronik presents the high-speed optocoupler WL-OCHS for secure, galvanically isolated signal transmission in interference-prone industrial and medical applications.
03
'26
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Seco News
SECO Industrial HMI and SBC Dragonwing IQ-2390
SECO introduces the Compact Vision 5 Dragonwing IQ-2390 HMI and SBC-Dragonwing-IQ-2390 to modernize compact embedded industrial systems with on-device AI.
03
'26
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Kyocera News
KYOCERA AVX Debuts 0201 KGU Series RF MLCCs
The ultraminiature, ultra-low-ESR capacitors deliver exceptional stability and minimize physical footprints for next-generation wireless systems.
02
'26
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Qualcomm News
Edge Processors for Consumer and Industrial Machine Intelligence
Qualcomm Technologies introduced edge processors to enable localized artificial intelligence, machine vision, and real-time deterministic control across connected consumer devices and rugged industrial deployments.
02
'26
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Rutronik News
Rutronik & Nanopower Partner to Expand Ultra-Low-Power IoT Portfolio
Nanoampere-range power-saving ICs support energy-autonomous sensors, extending battery life and enabling battery-free designs across connected applications.
02
'26
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Nexperia News
Power Semiconductor Integration for Next-Generation Electrified Vehicle Powertrains
Nexperia and Aurobay Technologies collaborate to integrate wide-bandgap semiconductors into high-efficiency propulsion platforms for hybrid and electric automotive systems.
02
'26
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Trumpf News
TRUMPF Showcases Integrated AI Chip Cooling Technology at Semicon Taiwan 2026
Ultrashort-pulse lasers create microscopic cooling structures directly within chip stacks, addressing heat dissipation challenges in advanced semiconductor packaging.
02
'26
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Alps Alpine News
