The upcoming DeviceEdge AIE-KT and new fanless AIE-PT systems will support NVIDIA Jetson T3000 and T2000 modules, enabling scalable, power-efficient AI computing for robotics and industrial edge applications.
Microchip Technology and Planetek Italia integrated hardware-accelerated machine learning on satellites to process orbital Earth observation data under strict power and radiation constraints.
Infineon Technologies AG and LS ELECTRIC are collaborating to develop high-efficiency direct current power infrastructure for AI data centers and next-generation power grids.
This collaborative research project develops bacterial cellulose circuit carriers and additive manufacturing processes for sustainable next-generation printed circuit boards.
ROHM introduces surface-mount power devices with standard footprint compatibility, designed to enhance server power supply efficiency and support high-density industrial applications.
Swissbit AG and Nexperia B.V. collaborate to develop secure storage and semiconductor solutions for AI accelerators, cloud data centers, and server systems.