Infineon validates its non-volatile memory architecture to support continuous out-of-band server management and infrastructure operations within high-density data center environments.
The company highlights a unified wireless platform combining decentralized mesh networking with LoRa® physical layer modulation for long-range IoT deployments.
The expanded uEye FA series adds models with 2 to 12.5 MP Sony STARVIS 2 sensors, combining rugged protection with high image quality for industrial automation and inspection tasks.
Featuring a multiplexed memory architecture, the new module improves bandwidth and computational efficiency while supporting scalable AI and HPC deployments.
The Vera CPU is speeding up next-generation NVIDIA chip designs, and early testing shows up to 1.5x higher performance on key verification and simulation workloads.
The new solutions are designed to address the growing demand for higher memory bandwidth driven by AI data centers, cloud infrastructure and accelerated compute workloads.