29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

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MURATA News

Murata Unveils the World Smallest RF Microwave Switch Connector

Engineered to reduce board mounting area by forty percent, these compact components deliver superior high frequency performance for dense modern mobile and communication devices.

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29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

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TDK News

TDK Unveils Advanced DC Contactors For Electric Vehicles And Infrastructure

The new series offers reliable bidirectional switching to support demanding automotive power systems rapid charging stations renewable energy storage and artificial intelligence data center architectures.

Read more…

29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

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Exxelia

Exxelia to present new Capacitors and Magnetics Innovations at Electronica 2026, Hall A6 – 419

Exxelia, a leading designer and manufacturer of high-reliability passive components and precision subsystems, will exhibit at the upcoming Electronica 2026 trade fair in Munich, Germany, from November 10 to November 13, 2026. Technical staff and product specialists will be located in Hall A6, Booth 419, presenting four primary areas of new product development.

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29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

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Leuze

Leuze integrates cybersecurity into industrial sensor development to meet CRA requirements

The Cyber Resilience Act introduces new requirements for connected digital products. Leuze addresses these requirements through systematic threat analysis, secure sensor architectures, authenticated access and security updates throughout the planned product lifecycle.

Read more…

29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

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CEVA News

Ceva Unveils Next-Generation NeuPro NPU Portfolio

A common architecture and unified software stack span Physical AI applications from always-on sensors to AI infrastructure.

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29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

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RECOM Power News

RECOM introduces RVP007 transformer driver for isolated power supplies

The IC features a programmable full-bridge topology supporting LLC applications for compact 1-20W power designs.

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29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-29T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Launches Ultra-Low Power RL78/G21 Microcontroller

The component optimizes smart appliance control while offering ±4 kV ESD robustness.

Read more…

29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-29T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Presents Secure Boot ETSI Standard at electronica

The new EN 304 623 standard helps manufacturers meet the strict requirements of the Cyber Resilience Act.

Read more…

29 {{ "2026-10-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-29T00:00:00+00:00" | date "longDate" }}

Siemens digital Industry Software News

Siemens launches next generation of Sinamics G drives

The unified drive platform offers SIL3 functional safety, integrated cybersecurity, and seamless TIA Portal digitalization for continuous-motion applications.

Read more…

28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

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TDK News

High-Density AC-DC Power Supplies Push Medical Power Limits

High-Power-Density AC-DC Power Supplies for Medical and Industrial Systems.

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Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Optimizing Plastic Machining for Semiconductor Equipment

Murata Unveils the World Smallest RF Microwave Switch Connector

Engineered to reduce board mounting area by forty percent, these compact components deliver superior high frequency performance for dense modern mobile and communication devices.

TDK Unveils Advanced DC Contactors For Electric Vehicles And Infrastructure

The new series offers reliable bidirectional switching to support demanding automotive power systems rapid charging stations renewable energy storage and artificial intelligence data center architectures.

Exxelia to present new Capacitors and Magnetics Innovations at Electronica 2026, Hall A6 – 419

Leuze integrates cybersecurity into industrial sensor development to meet CRA requirements

The Cyber Resilience Act introduces new requirements for connected digital products. Leuze addresses these requirements through systematic threat analysis, secure sensor architectures, authenticated access and security updates throughout the planned product lifecycle.

Ceva Unveils Next-Generation NeuPro NPU Portfolio

A common architecture and unified software stack span Physical AI applications from always-on sensors to AI infrastructure.

RECOM introduces RVP007 transformer driver for isolated power supplies

The IC features a programmable full-bridge topology supporting LLC applications for compact 1-20W power designs.

Renesas Launches Ultra-Low Power RL78/G21 Microcontroller

The component optimizes smart appliance control while offering ±4 kV ESD robustness.

Keysight Presents Secure Boot ETSI Standard at electronica

The new EN 304 623 standard helps manufacturers meet the strict requirements of the Cyber Resilience Act.

Siemens launches next generation of Sinamics G drives

The unified drive platform offers SIL3 functional safety, integrated cybersecurity, and seamless TIA Portal digitalization for continuous-motion applications.

High-Density AC-DC Power Supplies Push Medical Power Limits

High-Power-Density AC-DC Power Supplies for Medical and Industrial Systems.

International