Posifa’s PMF82000 MEMS mass air flow sensors provide accurate low-flow performance, fast 9 ms response, and easy integration for medical and industrial devices.
Vishay’s VEMD8083 silicon PIN photodiode combines compact design, high sensitivity, and fast response, delivering up to 16 μA light current for biomedical wearables.
The new 10BASE-T1S devices provide a simple, cost-effective connection from remote sensors to zonal gateways, greatly accelerating the next-generation automotive architecture.
November 2025 - LEMO, a global leader in leader in the design and manufacture of reliable high quality interconnect solutions, announces the launch of the REDEL SP IP68 Series, the next generation of high-performance connectors engineered for medical, test & measurement, and UAV applications.
Focusing on Industry AI and Enterprise AI, Innodisk strengthens partnerships with Intel, NVIDIA, Qualcomm, and Axelera AI to drive scalable, real-world AI deployments.
TRUMPF increases efficiency and precision in chip production with the TruPlasma RF Series G3, web-based control, real-time monitoring, and pulse frequencies up to 400 kHz.
Delivers 9600 MT/s with a 10% bandwidth boost, enhanced signal integrity, advanced diagnostics, and backward compatibility for next-gen AI and HPC workloads.
CoolGaN bi-directional switch enables single-stage power conversion, boosting energy output, reliability, and compactness while cutting power loss by up to 68%.
Beckhoff demonstrates how EtherCAT protocol, PC-based control, AI-integrated TwinCAT 3 software, and XPlanar systems transform semiconductor production from wafer fabrication to packaging.