27
'26
Written on
Seco News
27
'26
Written on
Lane Electronics News
High-Reliability Compact Interconnect Systems for Unmanned Aerial Vehicles
Lane Electronics provides a range of low-weight, vibration-resistant electrical connectors engineered to support the demanding hardware requirements of autonomous drone platforms.
27
'26
Written on
Congatec News
congatec secures aReady.COM edge architectures with patented OT-IT communication
Isolated system partitions and controlled data exchange integrate IoT connectivity, virtualization and AI while strengthening security by design.
27
'26
Written on
Kyocera News
Vibration-Resistant Surface-Mount Electrolytic Capacitors
KYOCERA AVX introduces a new line of electronic components designed to mitigate mechanical stress in harsh environments by maximizing board-mounting strength.
27
'26
Written on
Aetina
Aetina Launches MegaEdge AIP-RQ87 2U Edge AI System for Private LLMs, AI Agents and Intelligent Automation
The 2U edge AI platform is designed to simplify enterprise deployment of private LLMs, AI agents, RAG applications and multimodal AI while supporting flexible accelerator configurations.
27
'26
Written on
Keysight technologies News
AttoTude Accelerates Sub-THz Interconnect IC Design with Keysight EDA Software
AttoTude has reduced its design cycles by more than 50% while achieving first-pass silicon success across advanced RF, sub-THz, and THz tape-outs that underpin its guided-wave interconnect platform.
27
'26
Written on
Rutronik News
Nordic Semiconductor launches the nRF93M1 LTE Cat 1 bis Module
Now available at Rutronik, the kit provides an ideal platform for getting started with the new LTE Cat 1 bis module and accelerating proof-of-concept development.
27
'26
Written on
Infineon News
Infineon Equips Fox ESS with Silicon Carbide Technology
Advanced CoolSiC MOSFETs reduce switching losses by 70 percent, boosting efficiency in residential energy storage systems.
26
'26
Written on
Rohm Semiconductors News
Automotive-Grade 650V IGBTs for Auxiliary Systems
ROHM introduces a redesigned semiconductor architecture to improve switching efficiency and short-circuit tolerance in electric vehicle thermal management and industrial motor drives.
26
'26
Written on
Vision Components News
