18
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Rutronik News
18
'26
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Anritsu News
Anritsu Debuts AI-Enabled Tensor VNA at EuMW 2026
The intelligent vector network analyzer streamlines complex high-frequency component testing using natural-language assistance and advanced hardware.
18
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STMicroelectronics News
STMicroelectronics Unveils Compact Intelligent Power Modules for Appliances
The SLLIMM series shrinks 600V 3-phase IGBT inverters by 30% for space-constrained motor drives and heat pumps.
17
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Harman News
HARMAN Joins SDVerse Marketplace
HARMAN joins the SDVerse B2B marketplace to provide automakers with expanded access to software-defined vehicle products and engineering solutions.
17
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TME News
Global Expansion of Electronic Component Logistics
Transfer Multisort Elektronik Sp. z o.o. presents international growth strategies and automated distribution infrastructure at Electronica 2026.
17
'26
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ONSEMI News
onsemi Introduces Embedded Power Platform for Higher Power Density
Silicon wafer packaging integrates multiple dies and optimizes electrical, thermal and mechanical performance for AI infrastructure, electric vehicles and industrial applications.
17
'26
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Samsung News
Samsung Launches 245.76TB BM1773 SSD for High-Density AI Data Centers
E3.S QLC SSD combines PCIe 5.0, 4.5GB/s sequential writes, 50K IOPS and enhanced durability for demanding AI workloads.
17
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STMicroelectronics News
STMicroelectronics Unveils New Image Sensor for Automotive In-Cabin Monitoring
The 1.1 MP VD56GA sensor lowers system costs for driver and occupant monitoring in high-volume vehicle platforms through enhanced infrared sensitivity.
17
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FESTO News
Configurable Digital I/O Module for Decentralized Automation
Festo introduces the CPX-AP-I-16DIO M12 configurable digital I/O module to optimize decentralized machine architectures and expand connectivity for Mitsubishi PLC environments.
17
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Intel News
