02
'26
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TDK News
02
'26
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Molex News
High-Speed Automotive Ethernet Connector System Delivers 25Gbps Network Speeds
Molex has expanded its high-speed interconnect portfolio to meet the growing bandwidth demands of advanced driver-assistance systems and centralized vehicle compute architectures.
02
'26
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APEM
APEM and Alps Alpine Europe strengthen collaboration to deliver next-generation industrial HMI solutions
Partnership combines complementary expertise to support industrial OEMs with advanced, fully integrated Human-Machine Interface systems across Europe.
02
'26
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OMRON News
SiC-MOSFET Relays for High-Voltage Applications up to 3,300 V
OMRON introduces the G3VH series to increase efficiency and compactness in high-voltage architectures.
01
'26
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Toshiba News
80V N-Channel Power MOSFET for Digital Power Management
Toshiba engineers a compact 80-volt power transistor to minimize conduction losses and improve switching efficiency in data centers and communication base stations.
01
'26
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Toshiba News
Toshiba Launches 80V Power MOSFET for Efficient AI Data Center Power Supplies
New U-MOS11-H-based MOSFET delivers lower power losses, reduced EMI and improved thermal performance for high-density industrial power applications.
01
'26
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Sensata Technologies News
Integrated Active and Passive High-Voltage Circuit Protection
Sensata Technologies introduces the STPS500P series PyroFuse, featuring dual-trigger redundancy for rapid fault interruption.
01
'26
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Keysight technologies News
Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow
Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success.
01
'26
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binder Connector News
binder transforms components into intelligent systems through printed electronics
By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures.
30
'26
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Wooptix News
