09
'26
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AMD News
09
'26
Written on
STMicroelectronics News
STMicroelectronics Expands Industrial IoT Capabilities with Advanced SIM and Zephyr
ST87M01 modules introduce SoftSIM integration, factory-level SGP.32 remote profile provisioning, and open-source Zephyr compatibility to simplify supply chains and streamline development for industrial IoT applications.
09
'26
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Vertiv News
Silicon Carbide Integration for Critical Data Center Infrastructure
Vertiv and Infineon Technologies AG have partnered to integrate advanced power semiconductors into high-voltage distribution systems for artificial intelligence data centers.
09
'26
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Fuchs Lubricants News
Dispensable Thermal Interface Materials for Electronic Heat Dissipation
FUCHS Lubricants Co. has introduced a portfolio of thermal interface materials designed to optimize heat dissipation in power electronics and semiconductor devices.
09
'26
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Seco News
Industrial Linux Integration for Physical AI and Robotics Hardware
SECO and Peridio integrate a standardized Linux operating system onto Qualcomm Dragonwing hardware for autonomous machines.
09
'26
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Diodes Incorporated News
Diodes launches dual-channel isolated gate drivers for power switching
The new API21550 and API21552 series offer robust capacitive isolation and high CMTI for WBG transistors.
09
'26
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Cyntec
Cyntec Drives Intelligent e-Mobility and AI Computing with Advanced Power Magnetics and Current Sensing Technologies at Electronica 2026
Cyntec, a leading provider of power magnetics and resistive current sensing solutions, will showcase its latest innovations for automotive electrification and AI computing at Electronica, taking place in Munich from 10-13 November, 2026.
06
'26
Written on
Texas Instruments News
Texas Instruments Launches Advanced Modules To Accelerate Connected Factory Automation
New multiprotocol modules and master transceivers bridge complex automation networks with field sensors to simplify industrial communication designs and reduce overall factory deployment costs.
06
'26
Written on
Fraunhofer News
OLED Microdisplay Interface Integration for Wearable Near-Eye Display Systems
Fraunhofer IPMS engineers a 2K OLED microdisplay package integrating MIPI DSI-2 control and onboard power management.
06
'26
Written on
CEVA News
