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EUTECT GmbH News
06
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Samsung News
Next-Generation Vertically Stacked Memory Architectures For Artificial Intelligence Infrastructure
Samsung Electronics introduces advanced hybrid bonding technologies and ultra-high-layer storage components to maximize bandwidth efficiency in parallel computing systems.
06
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ASMPT News
Automated SMT Systems for Electronics Production
ASMPT SMT Solutions introduces updated assembly platforms and automated stencil printing frameworks designed to optimize high-density circuit board production workflows.
06
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Ambiq News
Open-Source Profiler for Edge AI Workloads
Ambiq Micro has released a diagnostic utility designed to provide cycle-level execution metrics for neural network optimization on resource-constrained microcontrollers.
06
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AMD News
AMD, Supermicro and Spectro Cloud Launch Turnkey Solution
Built on AMD EPYC processors, AMD Instinct GPUs and AMD Pensando networking, the solution is integrated into select Supermicro systems and orchestrated by Spectro Cloud.
05
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NXP News
Ultra-Wideband Supports Digital Access and Vehicle Presence Detection
BMW Group is deploying NXP Semiconductors’ ultra-wideband technology for secure digital vehicle access and in-cabin presence detection across selected 2026 vehicle programs.
05
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TDK News
Axial aluminum electrolytic capacitors for heavy DC links
TDK Corporation expands its electrolytic capacitor portfolio for 48-volt to 120-volt systems in order to effectively reduce component counts within industrial traction inverters.
05
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Silicon Labs News
Silicon Labs Launches BG2B Bluetooth SoC Delivering Ultra-Low-Power IoT Performance
New chip combines Bluetooth Channel Sounding, Secure Vault, CAN-FD integration extending battery life while reducing system cost for developers worldwide.
05
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Toshiba News
Toshiba Launches TXZ+ M4L Microcontroller Series
These Arm Cortex-M4 components integrate hardware accelerators for efficient and secure motor control.
05
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Rision News
