26 {{ "2026-06-26T00:00:00+00:00" | date "MMM" }} '26

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Rutronik News

3D Hall-Effect Sensors for Automotive and Industrial Motion Control

Distributed by Rutronik, TDK's factory-programmable 3D sensing architecture resolves spatial constraints and alignment challenges within compact electric motor actuator designs.

Read more…

26 {{ "2026-06-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-26T00:00:00+00:00" | date "longDate" }}

Anritsu News

5G NR Uplink Data Compression Test Case Verification

Anritsu and Qualcomm verify 3GPP Release 17 uplink data compression test cases for 5G networks.

Read more…

26 {{ "2026-06-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-26T00:00:00+00:00" | date "longDate" }}

TE Connectivity News

1.27 mm Pitch Board Connectors for Industrial Electronics

TE Connectivity introduces the AMP SMC essential connector series for board-to-board applications.

Read more…

26 {{ "2026-06-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-26T00:00:00+00:00" | date "longDate" }}

Toshiba News

Prototyping Board for Evaluating Isolated Photorelays

Toshiba and MIKROE introduce the Opto 8 Click board to evaluate industrial photorelays.

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26 {{ "2026-06-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-26T00:00:00+00:00" | date "longDate" }}

MURATA News

PIM API Expansion for Electronic Component Data

Murata expands its information management API service to cover 73 product categories.

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25 {{ "2026-06-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-25T00:00:00+00:00" | date "longDate" }}

HBK World News

Portable DA110 Indicator for High-Precision Strain Gauge Measurement

HBK introduces the DA110 Handheld Indicator for mobile calibration and high-speed industrial asset monitoring.

Read more…

25 {{ "2026-06-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-25T00:00:00+00:00" | date "longDate" }}

Infineon News

Automotive 8Tx8Rx Imaging Radar Transceivers for Centralized Architectures

Infineon enters mass production with the CTRX8188F radar MMIC to support centralized automotive processing architectures.

Read more…

25 {{ "2026-06-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-25T00:00:00+00:00" | date "longDate" }}

Supermicro News

Hardware Platforms for Low-Latency Edge AI Inference

Supermicro introduces Intel-powered hardware platforms optimized for edge computing and industrial AI inference applications.

Read more…

25 {{ "2026-06-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-25T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Single-Die Secure Mobile IC with Post-Quantum Cryptography

STMicroelectronics introduces the ST54M mobile chip featuring a post-quantum cryptography accelerator and integrated NFC controller.

Read more…

25 {{ "2026-06-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-25T00:00:00+00:00" | date "longDate" }}

Broadcom News

OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor

OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.

Read more…

Market Overview

Overview of Silicon Carbide (SiC) Electronic Components and Modules Announced in the First Half of 2026

Technical Articles

Vertical Transistor Integration Through Stacked Nanosheet Architecture

Case studies

Integrated SMT Line for Complex Assemblies

3D Hall-Effect Sensors for Automotive and Industrial Motion Control

Distributed by Rutronik, TDK's factory-programmable 3D sensing architecture resolves spatial constraints and alignment challenges within compact electric motor actuator designs.

5G NR Uplink Data Compression Test Case Verification

Anritsu and Qualcomm verify 3GPP Release 17 uplink data compression test cases for 5G networks.

1.27 mm Pitch Board Connectors for Industrial Electronics

TE Connectivity introduces the AMP SMC essential connector series for board-to-board applications.

Prototyping Board for Evaluating Isolated Photorelays

Toshiba and MIKROE introduce the Opto 8 Click board to evaluate industrial photorelays.

PIM API Expansion for Electronic Component Data

Murata expands its information management API service to cover 73 product categories.

Portable DA110 Indicator for High-Precision Strain Gauge Measurement

HBK introduces the DA110 Handheld Indicator for mobile calibration and high-speed industrial asset monitoring.

Automotive 8Tx8Rx Imaging Radar Transceivers for Centralized Architectures

Infineon enters mass production with the CTRX8188F radar MMIC to support centralized automotive processing architectures.

Hardware Platforms for Low-Latency Edge AI Inference

Supermicro introduces Intel-powered hardware platforms optimized for edge computing and industrial AI inference applications.

Single-Die Secure Mobile IC with Post-Quantum Cryptography

STMicroelectronics introduces the ST54M mobile chip featuring a post-quantum cryptography accelerator and integrated NFC controller.

OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor

OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.

International