01 {{ "2026-09-01T00:00:00+00:00" | date "MMM" }} '26

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Infineon News

Radiation-Hardened Semiconductors for Space Telescopes

Infineon provides radiation-resistant power infrastructure for the NASA Roman Space Telescope to ensure stable energy distribution at the second Sun-Earth Lagrange point.

Read more…

01 {{ "2026-09-01T00:00:00+00:00" | date "MMM" }} '26

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Mediatek News

NVIDIA and MediaTek Deepen Alliance Across AI, PC, and Automotive

MediaTek to Adopt New NVIDIA NVLink Fusion Platform, Helping Customers Take Custom XPUs to NVIDIA NVLink-Connected, Rack-Scale AI Factories.

Read more…

01 {{ "2026-09-01T00:00:00+00:00" | date "MMM" }} '26

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Qualcomm News

Qualcomm and HUMAIN Unveil Horizon Ultra AI PC at LEAP 2026

Horizon Ultra is the new flagship of the HUMAIN Horizon line bringing CPU, GPU and NPU computing together for on-device AI and launching first with Microsoft Windows.

Read more…

01 {{ "2026-09-01T00:00:00+00:00" | date "MMM" }} '26

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Broadcom News

Broadcom Announces VMware AI Factory

New AI Infrastructure Automation and Private AI Services Deliver a Single Consistent Environment for Deploying, Governing, and Securing AI Workloads from Bare Metal to Inference.

Read more…

31 {{ "2026-08-31T00:00:00+00:00" | date "MMM" }} '26

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Seco News

Scalable Embedded Computing for Automated Vision Workloads

SECO provides integrated hardware modules and software frameworks that transition early-stage artificial intelligence models into highly reliable, mass-produced connected systems.

Read more…

31 {{ "2026-08-31T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-31T00:00:00+00:00" | date "longDate" }}

QNX News

QNX and Hailo Integrate Edge AI for Critical Systems

Support for the Hailo-8 accelerator on QNX merges advanced AI performance with real-time reliability for edge computing.

Read more…

28 {{ "2026-08-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-28T00:00:00+00:00" | date "longDate" }}

Advantech News

Advantech integrates Intel Core Ultra Series 3 for scalable Edge AI

Integrated AI acceleration, graphics and industrial computing enable faster inference, simplified integration and scalable intelligent automation across demanding edge applications.

Read more…

28 {{ "2026-08-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-28T00:00:00+00:00" | date "longDate" }}

Zel Components News

Component Distribution Network Expansion for Electronic Manufacturing

Zel Components integrates seven manufacturing partners to bypass supply chain constraints and accelerate industrial hardware development.

Read more…

27 {{ "2026-08-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-27T00:00:00+00:00" | date "longDate" }}

Seco News

Transitioning Embedded Prototypes to Industrial Edge AI

SECO introduces a standardized system-on-module designed to bridge rapid developer prototyping with full-scale industrial integration for advanced robotics and machine vision workflows.

Read more…

27 {{ "2026-08-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-27T00:00:00+00:00" | date "longDate" }}

Lane Electronics News

High-Reliability Compact Interconnect Systems for Unmanned Aerial Vehicles

Lane Electronics provides a range of low-weight, vibration-resistant electrical connectors engineered to support the demanding hardware requirements of autonomous drone platforms.

Read more…

Case studies

IDS camera technology enables precision potato sorting for professional and family-run farms

Radiation-Hardened Semiconductors for Space Telescopes

Infineon provides radiation-resistant power infrastructure for the NASA Roman Space Telescope to ensure stable energy distribution at the second Sun-Earth Lagrange point.

NVIDIA and MediaTek Deepen Alliance Across AI, PC, and Automotive

MediaTek to Adopt New NVIDIA NVLink Fusion Platform, Helping Customers Take Custom XPUs to NVIDIA NVLink-Connected, Rack-Scale AI Factories.

Qualcomm and HUMAIN Unveil Horizon Ultra AI PC at LEAP 2026

Horizon Ultra is the new flagship of the HUMAIN Horizon line bringing CPU, GPU and NPU computing together for on-device AI and launching first with Microsoft Windows.

Broadcom Announces VMware AI Factory

New AI Infrastructure Automation and Private AI Services Deliver a Single Consistent Environment for Deploying, Governing, and Securing AI Workloads from Bare Metal to Inference.

Scalable Embedded Computing for Automated Vision Workloads

SECO provides integrated hardware modules and software frameworks that transition early-stage artificial intelligence models into highly reliable, mass-produced connected systems.

QNX and Hailo Integrate Edge AI for Critical Systems

Support for the Hailo-8 accelerator on QNX merges advanced AI performance with real-time reliability for edge computing.

Advantech integrates Intel Core Ultra Series 3 for scalable Edge AI

Integrated AI acceleration, graphics and industrial computing enable faster inference, simplified integration and scalable intelligent automation across demanding edge applications.

Component Distribution Network Expansion for Electronic Manufacturing

Zel Components integrates seven manufacturing partners to bypass supply chain constraints and accelerate industrial hardware development.

Transitioning Embedded Prototypes to Industrial Edge AI

SECO introduces a standardized system-on-module designed to bridge rapid developer prototyping with full-scale industrial integration for advanced robotics and machine vision workflows.

High-Reliability Compact Interconnect Systems for Unmanned Aerial Vehicles

Lane Electronics provides a range of low-weight, vibration-resistant electrical connectors engineered to support the demanding hardware requirements of autonomous drone platforms.

International