21
'26
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Intel News
21
'26
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Seco News
SECO to showcase Dragonwing IQ8 Edge AI module at electronica 2026
The SMARC module and Clea software suite demonstrate the seamless transition from prototyping to industrial deployment for physical AI applications.
20
'26
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Infineon News
High-performance microcontrollers for multi-motor control and power conversion
Infineon introduces a scalable microcontroller architecture designed to optimize industrial drives and digital infrastructure through advanced hardware security and precise analog processing.
20
'26
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CeramTec News
Semiconductor Manufacturing Ceramics for Process Chambers
CeramTec introduces advanced technical ceramics for wafer handling, plasma etching, and thermal management at SEMICON Europa to prevent contamination and thermal degradation.
20
'26
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MURATA News
Miniature NTC Thermistors for Dense Electronic Assemblies
Murata Manufacturing developed the NCU01 series 008004-inch size negative temperature coefficient thermistor to address spatial constraints in high-density electronic assemblies.
20
'26
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STMicroelectronics News
STMicroelectronics launches space-grade quad LVDS receiver
The RHFLVDS42 delivers 600 Mbps data rates with enhanced radiation resistance and ESD immunity for aerospace applications.
20
'26
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Acceed News
Acceed introduces Nuvo-9200VTC 24-core in-vehicle computer
The fanless edge AI platform supports 14th Gen Intel desktop processors and PoE+ cameras for rugged mobile applications.
19
'26
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TDK News
Linear Hall-Effect Current Sensor IC for Inverters
TDK Corporation introduces the Micronas CUR 3020 programmable Hall sensor for C-core concentrators to stabilize current measurement in automotive and industrial inverters.
19
'26
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FLIR
Teledyne FLIR’s Handheld Thermal Cameras Are Designed and Built in Europe
From Tallinn, Estonia, to Sweden, the company’s thermal cameras are developed and manufactured close to the engineers who design them.
19
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Hexagon Manufacturing Intelligence News
