29 {{ "2026-09-29T00:00:00+00:00" | date "MMM" }} '26

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innodisk

Innodisk Launches DDR5 8000 RDIMM for Edge AI and High-Performance Computing

The industrial-grade DDR5 8000 RDIMM delivers 8000 MT/s data transfer speeds, 16GB–64GB capacities, and registered ECC architecture to support demanding AI and enterprise-server workloads.

Read more…

29 {{ "2026-09-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-29T00:00:00+00:00" | date "longDate" }}

Bopla News

Advanced Electronic Enclosures with Active Thermal and Antenna Integration

BOPLA introduces modular packaging systems featuring transparent film heating and advanced cooling mechanisms for industrial Internet of Things applications.

Read more…

28 {{ "2026-09-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-28T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing

Keysight collaborates with the Berkeley Wireless Research Center (BWRC) to pioneer flexible, high-efficiency OTA measurement techniques for emerging 6G systems and upper-midband spectrum applications.

Read more…

28 {{ "2026-09-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-28T00:00:00+00:00" | date "longDate" }}

Diodes Incorporated News

Advanced Rectifiers Enhance Automotive Efficiency

Diodes Incorporated introduces a new family of field-plated Super Barrier Rectifier products designed to optimize performance within the automotive data ecosystem and modern vehicle power architectures.

Read more…

25 {{ "2026-09-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-25T00:00:00+00:00" | date "longDate" }}

iBASE News

IBASE Launches High-Performance Edge AI Single Board Computer

IBASE Technology Inc. introduced the IB966, a 3.5-inch single board computer powered by Intel Core Ultra Series 3 processors for industrial automation and edge AI applications.

Read more…

25 {{ "2026-09-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-25T00:00:00+00:00" | date "longDate" }}

AMD News

Hardware Acceleration for Local Artificial Intelligence Workflows

Advanced Micro Devices and Perplexity have partnered to enable on-device artificial intelligence inference on personal computers using shared-memory processor architecture.

Read more…

25 {{ "2026-09-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-25T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Introduces 3300V Dual SiC MOSFET Power Module

High surge current capability and low conduction losses enhance conversion efficiency and operational resilience across heavy rail traction and grid infrastructure.

Read more…

25 {{ "2026-09-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-25T00:00:00+00:00" | date "longDate" }}

Renesas News

Ultra-Compact Configurable Mixed-Signal ICs

Renesas offers a highly miniaturized configurable hardware solution designed to consolidate analog and digital logic functions within space-constrained wearable technology hardware.

Read more…

24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-24T00:00:00+00:00" | date "longDate" }}

Samsung News

Adaptive High-Bandwidth Memory for Mobile AI

Samsung validates its next-generation LPDDR memory on Qualcomm’s mobile platform to address rising bandwidth and power demands of edge AI.

Read more…

24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-24T00:00:00+00:00" | date "longDate" }}

Qualcomm News

Micro-Power Processing Architectures for Multimodal Audio Wearable Devices

Qualcomm introduces a new processing platform that integrates artificial intelligence and micro-power Wi-Fi connectivity to support multimodal smart wearable ecosystems.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Case studies

IDS: AI-Based Inspection Detects Surface Defects on Highly Reflective Components

Innodisk Launches DDR5 8000 RDIMM for Edge AI and High-Performance Computing

The industrial-grade DDR5 8000 RDIMM delivers 8000 MT/s data transfer speeds, 16GB–64GB capacities, and registered ECC architecture to support demanding AI and enterprise-server workloads.

Advanced Electronic Enclosures with Active Thermal and Antenna Integration

BOPLA introduces modular packaging systems featuring transparent film heating and advanced cooling mechanisms for industrial Internet of Things applications.

Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing

Keysight collaborates with the Berkeley Wireless Research Center (BWRC) to pioneer flexible, high-efficiency OTA measurement techniques for emerging 6G systems and upper-midband spectrum applications.

Advanced Rectifiers Enhance Automotive Efficiency

Diodes Incorporated introduces a new family of field-plated Super Barrier Rectifier products designed to optimize performance within the automotive data ecosystem and modern vehicle power architectures.

IBASE Launches High-Performance Edge AI Single Board Computer

IBASE Technology Inc. introduced the IB966, a 3.5-inch single board computer powered by Intel Core Ultra Series 3 processors for industrial automation and edge AI applications.

Hardware Acceleration for Local Artificial Intelligence Workflows

Advanced Micro Devices and Perplexity have partnered to enable on-device artificial intelligence inference on personal computers using shared-memory processor architecture.

Toshiba Introduces 3300V Dual SiC MOSFET Power Module

High surge current capability and low conduction losses enhance conversion efficiency and operational resilience across heavy rail traction and grid infrastructure.

Ultra-Compact Configurable Mixed-Signal ICs

Renesas offers a highly miniaturized configurable hardware solution designed to consolidate analog and digital logic functions within space-constrained wearable technology hardware.

Adaptive High-Bandwidth Memory for Mobile AI

Samsung validates its next-generation LPDDR memory on Qualcomm’s mobile platform to address rising bandwidth and power demands of edge AI.

Micro-Power Processing Architectures for Multimodal Audio Wearable Devices

Qualcomm introduces a new processing platform that integrates artificial intelligence and micro-power Wi-Fi connectivity to support multimodal smart wearable ecosystems.

International