07 {{ "2026-04-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-07T00:00:00+00:00" | date "longDate" }}

AMD News

Fujisoft develops AI security system on AMD platform

Integrated FPGA and x86 architecture enables low-latency AI image recognition for industrial site monitoring and reduced false alarms.

Read more…

06 {{ "2026-04-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-06T00:00:00+00:00" | date "longDate" }}

CEA Leti News

RISC-V and Photonics Integration for AI Chiplets

CEA-Leti, CEA-List and Powerchip Semiconductor Manufacturing Corporation (PSMC) collaborate to combine RISC-V computing and silicon photonics within 3D semiconductor integration platforms for AI systems.

Read more…

03 {{ "2026-04-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-03T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

GaN Gate Drivers for High-Speed Power Conversion

STMicroelectronics introduces GaN drivers enabling efficient motion control and compact power conversion system design.

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03 {{ "2026-04-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-03T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Expands European Portfolio Through Strategic Sales Partnership With TTi

Anritsu now distributes TTi general purpose instruments across Europe, enhancing its laboratory and production offerings with precision power supplies and signal generators for diverse engineering applications.

Read more…

02 {{ "2026-04-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-02T00:00:00+00:00" | date "longDate" }}

Nanomade News

Transparent force and touch sensing film for HMIs

A joint Nanomade–PolyIC development combines printed electronics and force detection to support transparent user interfaces in automotive, medical and consumer devices.

Read more…

02 {{ "2026-04-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-02T00:00:00+00:00" | date "longDate" }}

Molex News

Molex Completes Acquisition of Smiths Interconnect to Strengthen High-Reliability Portfolio

Molex acquires Smiths Interconnect to expand capabilities across aerospace, medical, and semiconductor markets.

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02 {{ "2026-04-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-02T00:00:00+00:00" | date "longDate" }}

Omnivision News

Image signal processor integration for arthroscopy imaging

Omnivision ISP integration targets stable colour reproduction and low-latency processing in endoscopic visualization platforms used in minimally invasive surgical imaging workflows.

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01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Tria Technologies News

Multi-OS Support for ARM Embedded Systems

Tria Technologies extends Qualcomm-based platforms with Yocto Linux, Windows 11 IoT, and Android to increase flexibility in embedded system design.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Melexis News

Code-Free Three-Phase Motor Driver Simplifies BLDC Design

Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Expanded Heat Sink Portfolio Targets Thermal Management Optimization

Würth Elektronik introduces modular heat sink families to improve thermal management efficiency in power electronics, embedded systems, and industrial applications.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

Deployable 5G networks enable tactical communications

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

Fujisoft develops AI security system on AMD platform

Integrated FPGA and x86 architecture enables low-latency AI image recognition for industrial site monitoring and reduced false alarms.

RISC-V and Photonics Integration for AI Chiplets

CEA-Leti, CEA-List and Powerchip Semiconductor Manufacturing Corporation (PSMC) collaborate to combine RISC-V computing and silicon photonics within 3D semiconductor integration platforms for AI systems.

GaN Gate Drivers for High-Speed Power Conversion

STMicroelectronics introduces GaN drivers enabling efficient motion control and compact power conversion system design.

Anritsu Expands European Portfolio Through Strategic Sales Partnership With TTi

Anritsu now distributes TTi general purpose instruments across Europe, enhancing its laboratory and production offerings with precision power supplies and signal generators for diverse engineering applications.

Transparent force and touch sensing film for HMIs

A joint Nanomade–PolyIC development combines printed electronics and force detection to support transparent user interfaces in automotive, medical and consumer devices.

Molex Completes Acquisition of Smiths Interconnect to Strengthen High-Reliability Portfolio

Molex acquires Smiths Interconnect to expand capabilities across aerospace, medical, and semiconductor markets.

Image signal processor integration for arthroscopy imaging

Omnivision ISP integration targets stable colour reproduction and low-latency processing in endoscopic visualization platforms used in minimally invasive surgical imaging workflows.

Multi-OS Support for ARM Embedded Systems

Tria Technologies extends Qualcomm-based platforms with Yocto Linux, Windows 11 IoT, and Android to increase flexibility in embedded system design.

Code-Free Three-Phase Motor Driver Simplifies BLDC Design

Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.

Expanded Heat Sink Portfolio Targets Thermal Management Optimization

Würth Elektronik introduces modular heat sink families to improve thermal management efficiency in power electronics, embedded systems, and industrial applications.

International