10
'26
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TDK News
10
'26
Written on
Fraunhofer News
Fraunhofer IPMS Develops MEMS Spatial Light Modulators
Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.
09
'26
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Anritsu News
Anritsu at ECOC 2026
From September 21 to September 23, in Malaga, Spain, Anritsu collaborates with ecosystem partners to validate high-capacity multi-core optical transmission systems for next-generation digital infrastructure.
09
'26
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Anritsu News
High-Speed Test Solutions for AI Infrastructure
Anritsu demonstrates advanced test and measurement solutions at ECOC 2026 in Malaga, Spain, to validate high-speed optical and digital networks for artificial intelligence applications.
09
'26
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Kontron News
Integration of virtualization in rugged embedded computing systems
SYSGO and Kontron collaborate to implement a validated board support package for secure mixed-criticality embedded systems in harsh environments.
09
'26
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TDK News
TDK Launches 10 μF 100 V Soft-Termination X7R MLCC for 48 V Systems
New 3225-format capacitors combine low ESR, high capacitance and AEC-Q200 qualification for AI servers, humanoid robots, xEVs and industrial equipment.
09
'26
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Infineon News
Infineon Launches OPTIREG PMIC for EV Traction Inverters
The integrated PMIC reduces PCB footprint by up to 70% while embedding ASIL-D safety and internal resolver excitation.
09
'26
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ARROW News
Arrow Enables Remote Evaluation of NXP Ara240 Edge AI Accelerator
Digital Test Drive gives engineers hands-on access to AI workloads for computer vision, generative AI and multimodal edge applications before hardware investment.
08
'26
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STMicroelectronics News
Integration of advanced battery management systems
STMicroelectronics collaborates with industrial manufacturers to deploy precision lithium-battery management integrated circuits for portable equipment.
08
'26
Written on
Phytec News
