11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

Compact Photorelays for Semiconductor Automated Test Equipment

Toshiba introduces high-current solid-state relays in a miniature package to improve switching accuracy and circuit board density in hardware testing environments.

Read more…

11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-11T00:00:00+00:00" | date "longDate" }}

Nordic Semiconductor News

Satellite and Cellular Connectivity Certification for Digital Infrastructure

Nordic Semiconductor and LooUQ obtain satellite network certification for embedded modems to accelerate dual-mode cellular and satellite IoT deployment across remote industrial infrastructure.

Read more…

11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-11T00:00:00+00:00" | date "longDate" }}

MURATA News

Murata Heads to Hot Chips 2026

At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter.

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11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-11T00:00:00+00:00" | date "longDate" }}

Anglia Components News

Anglia and Silanna Partner to Distribute Cost-Effective ADCs

The agreement delivers pin-compatible analog-to-digital converters with long-term price stability and up to 30% savings.

Read more…

10 {{ "2026-08-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-10T00:00:00+00:00" | date "longDate" }}

Samsung News

Next-Generation 3D Memory Architectures for AI Data Infrastructure

Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.

Read more…

10 {{ "2026-08-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-10T00:00:00+00:00" | date "longDate" }}

Antaira News

Antaira Launches 100W AC-Powered PoE++ Injector

The rugged INJ-0201G-bt-AC-100-T delivers up to 100W over a single cable, upgrading non-PoE networks in harsh conditions.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Molex News

Compact Hybrid Connectors Simplify Humanoid Robot Joint Wiring

Molex combines 15 A power delivery and 1 Gbps Ethernet in a 5.65 mm routing profile for humanoid robots, AMRs and industrial automation systems.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Pickering News

High-Current LXI Switching Systems for Automated Power Testing

Pickering Interfaces introduces a standardized hardware architecture designed to route high-voltage signals and manage power supplies within the automotive data ecosystem.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Toshiba News

High-Speed Four-Channel Digital Isolators for Industrial Automation

Toshiba introduces high-speed isolation devices designed to maintain signal integrity within high-temperature manufacturing environments and the industrial digital supply chain.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Power Integrations News

2200 V Gallium Nitride Scales High-Voltage Power Systems

Power Integrations introduces a high-voltage semiconductor solution designed to support advanced power conversion demands in data centers and renewable infrastructure.

Read more…

Case studies

IDS cameras enable interactive museum experiences with vvvv and SCHNELLE BUNTE BILDER

Compact Photorelays for Semiconductor Automated Test Equipment

Toshiba introduces high-current solid-state relays in a miniature package to improve switching accuracy and circuit board density in hardware testing environments.

Satellite and Cellular Connectivity Certification for Digital Infrastructure

Nordic Semiconductor and LooUQ obtain satellite network certification for embedded modems to accelerate dual-mode cellular and satellite IoT deployment across remote industrial infrastructure.

Murata Heads to Hot Chips 2026

At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter.

Anglia and Silanna Partner to Distribute Cost-Effective ADCs

The agreement delivers pin-compatible analog-to-digital converters with long-term price stability and up to 30% savings.

Next-Generation 3D Memory Architectures for AI Data Infrastructure

Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.

Antaira Launches 100W AC-Powered PoE++ Injector

The rugged INJ-0201G-bt-AC-100-T delivers up to 100W over a single cable, upgrading non-PoE networks in harsh conditions.

Compact Hybrid Connectors Simplify Humanoid Robot Joint Wiring

Molex combines 15 A power delivery and 1 Gbps Ethernet in a 5.65 mm routing profile for humanoid robots, AMRs and industrial automation systems.

High-Current LXI Switching Systems for Automated Power Testing

Pickering Interfaces introduces a standardized hardware architecture designed to route high-voltage signals and manage power supplies within the automotive data ecosystem.

High-Speed Four-Channel Digital Isolators for Industrial Automation

Toshiba introduces high-speed isolation devices designed to maintain signal integrity within high-temperature manufacturing environments and the industrial digital supply chain.

2200 V Gallium Nitride Scales High-Voltage Power Systems

Power Integrations introduces a high-voltage semiconductor solution designed to support advanced power conversion demands in data centers and renewable infrastructure.

International