14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

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TDK News

TDK launches PositionSense 9-axis sensor for physical AI devices

The two-chip solution integrates a 6-axis IMU and 3-axis magnetometer for accurate navigation in GPS-denied environments.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

Siemens News

Semiconductor Test Pattern Execution High Speed Interfaces

Siemens EDA launches Tessent Silicon Executable software to translate and run design-for-test patterns natively across automated test equipment, bench, and system-level environments.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

ZEISS News

Advanced Packaging Solutions for X-Ray Inspection and Warpage Correction

ZEISS is expanding its semiconductor manufacturing portfolio with new metrology equipment designed to address process control challenges in high-density chiplet architectures.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Dual-Range MEMS Pressure Sensor for Altitude and Depth Measurement

STMicroelectronics introduces a compact piezoresistive sensor designed to streamline circuitry in wearable electronics by combining atmospheric and deep-water pressure monitoring.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

TDK News

Dual-Die Magnetic Motor Position Sensors for ASIL D By-Wire Applications

TDK introduces Micronas HAR 3025 with stray-field compensation to ensure fail-operational commutation in redundant automotive actuators.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

Toshiba News

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Broadband Semiconductor Characterization in the Sub-Terahertz Range

Single-touchdown measurements from near DC to 250 GHz accelerate the development of high-frequency transistors for future telecommunications systems.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Infimotion News

InfiMotion highlights advanced electric drives at Paris Motor Show

The supplier powers multiple automotive brands with integrated 800V and 900V high-efficiency traction systems.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Infineon News

Digital Power-Path Protection for 800-Volt AI Server Architectures

Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Link Layer Retry Validation in AI Ethernet Fabrics

Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

TDK launches PositionSense 9-axis sensor for physical AI devices

The two-chip solution integrates a 6-axis IMU and 3-axis magnetometer for accurate navigation in GPS-denied environments.

Semiconductor Test Pattern Execution High Speed Interfaces

Siemens EDA launches Tessent Silicon Executable software to translate and run design-for-test patterns natively across automated test equipment, bench, and system-level environments.

Advanced Packaging Solutions for X-Ray Inspection and Warpage Correction

ZEISS is expanding its semiconductor manufacturing portfolio with new metrology equipment designed to address process control challenges in high-density chiplet architectures.

Dual-Range MEMS Pressure Sensor for Altitude and Depth Measurement

STMicroelectronics introduces a compact piezoresistive sensor designed to streamline circuitry in wearable electronics by combining atmospheric and deep-water pressure monitoring.

Dual-Die Magnetic Motor Position Sensors for ASIL D By-Wire Applications

TDK introduces Micronas HAR 3025 with stray-field compensation to ensure fail-operational commutation in redundant automotive actuators.

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

Broadband Semiconductor Characterization in the Sub-Terahertz Range

Single-touchdown measurements from near DC to 250 GHz accelerate the development of high-frequency transistors for future telecommunications systems.

InfiMotion highlights advanced electric drives at Paris Motor Show

The supplier powers multiple automotive brands with integrated 800V and 900V high-efficiency traction systems.

Digital Power-Path Protection for 800-Volt AI Server Architectures

Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.

Link Layer Retry Validation in AI Ethernet Fabrics

Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.

International