22 {{ "2026-01-22T00:00:00+00:00" | date "MMM" }} '26

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Diodes Incorporated News

Dual-channel digital isolators raise breakdown voltage beyond 12kV

Diodes Incorporated adds reinforced isolation support, 100 Mbps signaling, and 150 kV/µs CMTI for industrial power, energy, and data centers.

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22 {{ "2026-01-22T00:00:00+00:00" | date "MMM" }} '26

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ViewSonic

ViewSonic Unveils Industry’s First Android 16-Powered Interactive Displays and Education Ecosystem Innovations at Bett 2026

The new EDLA-certified ViewBoard IFP35-1 and IFP41-1 Series combine Android 16, advanced multi-touch technology, energy-efficient sensors, and integrated software to support modern K–12 and higher education environments.

Read more…

22 {{ "2026-01-22T00:00:00+00:00" | date "MMM" }} '26

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Schmalz News

Schmalz develops ESD-safe suction cup material for electronics handling

The new material targets electronics manufacturing, combining ESD protection, low marking behavior, and thermal resistance for automated handling of sensitive components.

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22 {{ "2026-01-22T00:00:00+00:00" | date "MMM" }} '26

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Microchip News

Microchip Introduces 600V Gate Driver Family for High-Voltage Power Management Applications

The new devices target motor control and power conversion applications, offering high-voltage operation, noise robustness, and logic-level compatibility for industrial and consumer designs.

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22 {{ "2026-01-22T00:00:00+00:00" | date "MMM" }} '26

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Anritsu News

HYUNDAI MOBIS Selects Anritsu’s Hybrid eCall Test Solution

All-in-one platform boosts reliability and efficiency for next-generation automotive emergency call systems.

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22 {{ "2026-01-22T00:00:00+00:00" | date "MMM" }} '26

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ICsense News

ICsense Expands In-House ASIC Volume Production with New Wafer Sort Cleanroom

ISO-7 facility strengthens turnkey testing, scalability, and supply-chain resilience for custom ASICs.

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22 {{ "2026-01-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-22T00:00:00+00:00" | date "longDate" }}

CEA Leti News

Display-integrated optical sensing for multifunctional, next-generation displays

CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture.

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22 {{ "2026-01-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-22T00:00:00+00:00" | date "longDate" }}

Anritsu News

Web-Based Platform for Mobile Device Testing

Anritsu introduces TestDeck to centralize test operations and data management for communication test and measurement systems.

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21 {{ "2026-01-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-21T00:00:00+00:00" | date "longDate" }}

Congatec News

High-Efficiency Embedded AI Module for Industrial Edge Systems

Congatec expands industrial embedded computing with AMD-based COM Express modules for rugged, scalable edge AI applications.

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21 {{ "2026-01-21T00:00:00+00:00" | date "MMM" }} '26

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TDK News

TDK expands its high-temperature MEMS accelerometer portfolio for energy market applications

The new AXO315T1 supports high-temperature downhole sensing, offering digital inclination measurement for MWD tools operating reliably under extreme thermal and vibration conditions.

Read more…

Diodes Incorporated adds reinforced isolation support, 100 Mbps signaling, and 150 kV/µs CMTI for industrial power, energy, and data centers.

The new EDLA-certified ViewBoard IFP35-1 and IFP41-1 Series combine Android 16, advanced multi-touch technology, energy-efficient sensors, and integrated software to support modern K–12 and higher education environments.

The new material targets electronics manufacturing, combining ESD protection, low marking behavior, and thermal resistance for automated handling of sensitive components.

The new devices target motor control and power conversion applications, offering high-voltage operation, noise robustness, and logic-level compatibility for industrial and consumer designs.

All-in-one platform boosts reliability and efficiency for next-generation automotive emergency call systems.

ISO-7 facility strengthens turnkey testing, scalability, and supply-chain resilience for custom ASICs.

CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture.

Anritsu introduces TestDeck to centralize test operations and data management for communication test and measurement systems.

Congatec expands industrial embedded computing with AMD-based COM Express modules for rugged, scalable edge AI applications.

The new AXO315T1 supports high-temperature downhole sensing, offering digital inclination measurement for MWD tools operating reliably under extreme thermal and vibration conditions.

International