31 {{ "2026-03-31T00:00:00+00:00" | date "MMM" }} '26

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IDS Imaging Development Systems GmbH

IDS launches Nion 3D ToF camera for industrial use with 1.2 MP depth sensing

1.2 MP ToF technology delivers stable, high-speed 3D data for industrial environments, even under motion and changing light conditions.

Read more…

30 {{ "2026-03-30T00:00:00+00:00" | date "MMM" }} '26

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Fujitsu News

Dual-band infrared sensor for high-resolution thermal monitoring

Fujitsu develops a dual-wavelength infrared imaging sensor to support advanced thermal detection in security, disaster monitoring, and scientific sensing applications.

Read more…

30 {{ "2026-03-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-30T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Power management ICs for industrial embedded processors

STMicroelectronics introduces PMICs designed to consolidate power supply, monitoring, and protection functions for STM32-based embedded systems in industrial electronics.

Read more…

30 {{ "2026-03-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-30T00:00:00+00:00" | date "longDate" }}

Pickering News

Reed Relays Improve Reliability in Mining Systems

Pickering Electronics highlights how reed relays support reliable power and signal switching in demanding mining environments through a new application guide.

Read more…

27 {{ "2026-03-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-27T00:00:00+00:00" | date "longDate" }}

Rutronik News

Thin film resistors for high-precision and stable electronics

Rutronik expands its portfolio with YAGEO’s RP series, delivering enhanced stability, environmental resistance and precision for demanding applications.

Read more…

27 {{ "2026-03-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-27T00:00:00+00:00" | date "longDate" }}

Infineon News

Power Module Boosts AI Data Center Efficiency

Infineon Technologies introduces TLVR-based quad-phase power module to deliver high current density and efficient power delivery for next-generation AI processors.

Read more…

27 {{ "2026-03-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-27T00:00:00+00:00" | date "longDate" }}

Diodes Incorporated News

MOSFETs Improve Efficiency in 48V Automotive Systems

Diodes Incorporated introduces PowerDI 8080-5 MOSFETs with ultra-low RDS(ON) to reduce losses and enhance efficiency in automotive power applications.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

Panasonic Industry News

Panasonic Industry Introduces High-Precision Thick-Film Resistors

ERJPC series delivers 0.1% tolerance and 25 ppm/K TCR with higher power density, enabling compact and cost-efficient designs for automotive and industrial electronics.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

MICRO EPSILON News

Inline Wafer Thickness Measurement in Confined Environments

Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.

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26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

Northrop Grumman News

Northrop Grumman Harnesses Synthetic Diamonds to Power Next Generation Defense Microelectronics

Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management, enabling high-power radar and communication systems that double current performance limits for military missions.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

Deployable 5G networks enable tactical communications

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

IDS launches Nion 3D ToF camera for industrial use with 1.2 MP depth sensing

1.2 MP ToF technology delivers stable, high-speed 3D data for industrial environments, even under motion and changing light conditions.

Dual-band infrared sensor for high-resolution thermal monitoring

Fujitsu develops a dual-wavelength infrared imaging sensor to support advanced thermal detection in security, disaster monitoring, and scientific sensing applications.

Power management ICs for industrial embedded processors

STMicroelectronics introduces PMICs designed to consolidate power supply, monitoring, and protection functions for STM32-based embedded systems in industrial electronics.

Reed Relays Improve Reliability in Mining Systems

Pickering Electronics highlights how reed relays support reliable power and signal switching in demanding mining environments through a new application guide.

Thin film resistors for high-precision and stable electronics

Rutronik expands its portfolio with YAGEO’s RP series, delivering enhanced stability, environmental resistance and precision for demanding applications.

Power Module Boosts AI Data Center Efficiency

Infineon Technologies introduces TLVR-based quad-phase power module to deliver high current density and efficient power delivery for next-generation AI processors.

MOSFETs Improve Efficiency in 48V Automotive Systems

Diodes Incorporated introduces PowerDI 8080-5 MOSFETs with ultra-low RDS(ON) to reduce losses and enhance efficiency in automotive power applications.

Panasonic Industry Introduces High-Precision Thick-Film Resistors

ERJPC series delivers 0.1% tolerance and 25 ppm/K TCR with higher power density, enabling compact and cost-efficient designs for automotive and industrial electronics.

Inline Wafer Thickness Measurement in Confined Environments

Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.

Northrop Grumman Harnesses Synthetic Diamonds to Power Next Generation Defense Microelectronics

Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management, enabling high-power radar and communication systems that double current performance limits for military missions.

International