Fujitsu develops a dual-wavelength infrared imaging sensor to support advanced thermal detection in security, disaster monitoring, and scientific sensing applications.
STMicroelectronics introduces PMICs designed to consolidate power supply, monitoring, and protection functions for STM32-based embedded systems in industrial electronics.
Pickering Electronics highlights how reed relays support reliable power and signal switching in demanding mining environments through a new application guide.
Rutronik expands its portfolio with YAGEO’s RP series, delivering enhanced stability, environmental resistance and precision for demanding applications.
Infineon Technologies introduces TLVR-based quad-phase power module to deliver high current density and efficient power delivery for next-generation AI processors.
ERJPC series delivers 0.1% tolerance and 25 ppm/K TCR with higher power density, enabling compact and cost-efficient designs for automotive and industrial electronics.
Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.
Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management, enabling high-power radar and communication systems that double current performance limits for military missions.
OMRON introduces PCB-mount relays designed to support high-voltage isolation and compact system integration in electric vehicle charging and energy storage applications.