07 {{ "2026-10-07T00:00:00+00:00" | date "MMM" }} '26

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Crestron News

Crestron Unveils DM NVX 370 and Custom SoC

The new hardware and purpose-built silicon optimise AV-over-IP infrastructure with USB-C connectivity and enhanced power efficiency.

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07 {{ "2026-10-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-07T00:00:00+00:00" | date "longDate" }}

Intel News

Intel Xeon 6 Processors Accelerate Agentic AI Throughput

Intel demonstrates how its processors resolve infrastructure bottlenecks to maximize task throughput for complex AI workflows.

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07 {{ "2026-10-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-07T00:00:00+00:00" | date "longDate" }}

Kontron News

Public-Network Railway Communications for Regional Transit

Kontron Transportation is deploying a mission-critical communication network using public mobile infrastructure to modernize operations for AKN Eisenbahn.

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07 {{ "2026-10-07T00:00:00+00:00" | date "MMM" }} '26

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TDK News

Multilayer Inductors for Automotive Power-Over-Coax Signal Filtration

TDK expands its line of compact passive components designed to separate power and data signals within advanced vehicle camera networks.

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07 {{ "2026-10-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-07T00:00:00+00:00" | date "longDate" }}

Infineon News

High-Performance Microcontrollers for Automotive Smart Cockpit Display Systems

Infineon develops a new processing unit leveraging external LPDDR4 memory to drive dual high-resolution displays without requiring complex system-on-chip platforms.

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07 {{ "2026-10-07T00:00:00+00:00" | date "MMM" }} '26

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Renesas News

Low-Voltage 100V GaN Transistors for Data Center Power Architectures

Renesas introduces a family of enhancement-mode discrete power transistors designed to simplify high-frequency power conversion in 48V bus architectures and motor drives.

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06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-06T00:00:00+00:00" | date "longDate" }}

MvTec News

Machine Vision Architecture Expands AI and 3D Processing Capabilities

MVTec addresses the growing demand for automated industrial inspection by integrating advanced artificial intelligence and three-dimensional spatial analysis into its core software.

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06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-06T00:00:00+00:00" | date "longDate" }}

Toshiba News

Low-Power Dual-Channel Digital Isolators for Industrial Control Systems

Toshiba introduces the DCL32xx00 series to enable energy-efficient and secure signal transmission across electrical potential barriers in power conversion and automation architectures.

Read more…

06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-06T00:00:00+00:00" | date "longDate" }}

Microchip News

Direct 800V DC Rack Power Conversion

Microchip and Navitas introduced an 800V-to-6V DC reference platform using GaN devices and digital signal controllers to solve AI server thermal limits.

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06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-06T00:00:00+00:00" | date "longDate" }}

Samtec News

High-Performance Interconnect Solutions for Digital Infrastructure

Samtec presented advanced interconnect systems at electronica India 2026 to address signal integrity challenges in modern computing and industrial automation networks.

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Market Overview

Quantum Electronics Moves Toward Commercialization

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Crestron Unveils DM NVX 370 and Custom SoC

The new hardware and purpose-built silicon optimise AV-over-IP infrastructure with USB-C connectivity and enhanced power efficiency.

Intel Xeon 6 Processors Accelerate Agentic AI Throughput

Intel demonstrates how its processors resolve infrastructure bottlenecks to maximize task throughput for complex AI workflows.

Public-Network Railway Communications for Regional Transit

Kontron Transportation is deploying a mission-critical communication network using public mobile infrastructure to modernize operations for AKN Eisenbahn.

Multilayer Inductors for Automotive Power-Over-Coax Signal Filtration

TDK expands its line of compact passive components designed to separate power and data signals within advanced vehicle camera networks.

High-Performance Microcontrollers for Automotive Smart Cockpit Display Systems

Infineon develops a new processing unit leveraging external LPDDR4 memory to drive dual high-resolution displays without requiring complex system-on-chip platforms.

Low-Voltage 100V GaN Transistors for Data Center Power Architectures

Renesas introduces a family of enhancement-mode discrete power transistors designed to simplify high-frequency power conversion in 48V bus architectures and motor drives.

Machine Vision Architecture Expands AI and 3D Processing Capabilities

MVTec addresses the growing demand for automated industrial inspection by integrating advanced artificial intelligence and three-dimensional spatial analysis into its core software.

Low-Power Dual-Channel Digital Isolators for Industrial Control Systems

Toshiba introduces the DCL32xx00 series to enable energy-efficient and secure signal transmission across electrical potential barriers in power conversion and automation architectures.

Direct 800V DC Rack Power Conversion

Microchip and Navitas introduced an 800V-to-6V DC reference platform using GaN devices and digital signal controllers to solve AI server thermal limits.

High-Performance Interconnect Solutions for Digital Infrastructure

Samtec presented advanced interconnect systems at electronica India 2026 to address signal integrity challenges in modern computing and industrial automation networks.

International