06
'26
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Micron News
06
'26
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Razorcat News
Razorcat Expands Automated C++ Unit Testing
Integration of compiler-based link stubbing into TESSY reduces manual dependency handling for embedded software testing in safety-critical systems.
06
'26
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Siemens News
Siemens Supports Verification of Arm AI CPU
Siemens collaborated with Arm to verify AI-focused CPU infrastructure for hyperscale cloud and agentic AI deployments.
05
'26
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STMicroelectronics News
GaN flyback converters target compact 100W power designs
STMicroelectronics integrates GaN switching, control, and drive functions to improve efficiency, thermal performance, and power density in consumer and industrial power supplies.
05
'26
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Kyocera News
Multilayer varistors target 48V automotive power systems
KYOCERA AVX expands high-temperature transient protection components to support growing 48V vehicle architectures, addressing electrical stress, space constraints, and reliability in automotive electronics.
05
'26
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Excelitas Technologies News
ToF imaging enables robust 3D sensing in harsh light
Excelitas introduces compact CMOS time-of-flight sensors and modules for industrial automation and robotics, supporting precise distance measurement under high ambient light conditions.
04
'26
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CEA Leti News
Semiconductor Innovation Summit Advances AI Manufacturing Technologies
CEA-Leti hosts LID World Summit 2026 to showcase semiconductor technologies enabling scalable AI factories and cross-industry applications.
04
'26
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BRADY
Industrial label printing unplugged
Automated identification and data capture specialist Brady Corporation launches a new type of hybrid label printer that offers industrial label printing performance in a cordless, portable design.
01
'26
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STMicroelectronics News
Compact 3-axis vibration sensing for condition monitoring
STMicroelectronics introduces a wide-bandwidth MEMS sensor to improve accuracy and integration in industrial and automotive condition monitoring systems.
01
'26
Written on
Broadcom News
