The unified workflow enables engineers to simulate complete electrical-optical-electrical signal chains, catching cross-domain issues and accelerating design tradeoffs for next-generation AI infrastructure.
Rutronik supplies the Murata Type 2FR module to consolidate processing and simultaneous wireless networking protocols within connected industrial automation environments.
Diodes Incorporated introduces a high-sensitivity Hall-effect latch for automotive motor control and position sensing applications operating in electrically harsh environments.
AAEON has introduced a Panther Lake-based embedded computing platform combining CPU, GPU, and NPU resources for industrial AI inference and edge computing deployments.
Freudenberg Sealing Technologies developed a profiled metal spring mechanism to manage thermal runaway through adjustable trigger pressure and rapid gas venting.
The innovative 1200V trench-gate power device aims to enhance energy efficiency and reduce power consumption in next-generation generative artificial intelligence data centers.
ROHM introduces low-capacitance protection diodes for multi-gigabit industrial, automotive, and consumer interfaces where signal integrity and transient suppression must coexist.
Qualcomm Technologies introduces the Dragonwing MBM platform family for broadband devices combining 5G connectivity, advanced multimedia processing and integrated AI capabilities.