TDK Corporation has expanded its semiconductor portfolio with an integrated motor controller designed to drive brushless and brushed DC motors in smart automotive actuators.
OMRON Corporation is integrating advanced simulation and artificial intelligence libraries to automate thermal warpage analysis in semiconductor manufacturing environments.
Rosenberger presents a comprehensive development approach for autonomous telematics platforms for resource monitoring in logistics, industry, and construction.
The upcoming DeviceEdge AIE-KT and new fanless AIE-PT systems will support NVIDIA Jetson T3000 and T2000 modules, enabling scalable, power-efficient AI computing for robotics and industrial edge applications.
Microchip Technology and Planetek Italia integrated hardware-accelerated machine learning on satellites to process orbital Earth observation data under strict power and radiation constraints.
Infineon Technologies AG and LS ELECTRIC are collaborating to develop high-efficiency direct current power infrastructure for AI data centers and next-generation power grids.