01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

80V N-Channel Power MOSFET for Digital Power Management

Toshiba engineers a compact 80-volt power transistor to minimize conduction losses and improve switching efficiency in data centers and communication base stations.

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01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Launches 80V Power MOSFET for Efficient AI Data Center Power Supplies

New U-MOS11-H-based MOSFET delivers lower power losses, reduced EMI and improved thermal performance for high-density industrial power applications.

Read more…

01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }}

Sensata Technologies News

Integrated Active and Passive High-Voltage Circuit Protection

Sensata Technologies introduces the STPS500P series PyroFuse, featuring dual-trigger redundancy for rapid fault interruption.

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01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow

Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success.

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01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }}

binder Connector News

binder transforms components into intelligent systems through printed electronics

By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures.

Read more…

30 {{ "2026-06-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-30T00:00:00+00:00" | date "longDate" }}

Wooptix News

Integration of wavefront phase imaging into semiconductor metrology

Wooptix installs automated inspection platform at CEA-Leti to advance nanotopography research.

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30 {{ "2026-06-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-30T00:00:00+00:00" | date "longDate" }}

AMD News

AMD Introduces Versal Premium Gen 2 Memory on Package Adaptive SoCs

New devices integrate up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development.

Read more…

29 {{ "2026-06-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-29T00:00:00+00:00" | date "longDate" }}

Melexis News

Digital current sensing optimizes signal integrity in automotive traction inverters

Melexis introduces a digital output current sensor to mitigate electromagnetic interference within high-power electric vehicle powertrains.

Read more…

29 {{ "2026-06-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-29T00:00:00+00:00" | date "longDate" }}

Kvaser AB

Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity

Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.

Read more…

26 {{ "2026-06-26T00:00:00+00:00" | date "MMM" }} '26

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Rutronik News

3D Hall-Effect Sensors for Automotive and Industrial Motion Control

Distributed by Rutronik, TDK's factory-programmable 3D sensing architecture resolves spatial constraints and alignment challenges within compact electric motor actuator designs.

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Market Overview

Overview of Silicon Carbide (SiC) Electronic Components and Modules Announced in the First Half of 2026

Technical Articles

Vertical Transistor Integration Through Stacked Nanosheet Architecture

Case studies

Integrated SMT Line for Complex Assemblies

80V N-Channel Power MOSFET for Digital Power Management

Toshiba engineers a compact 80-volt power transistor to minimize conduction losses and improve switching efficiency in data centers and communication base stations.

Toshiba Launches 80V Power MOSFET for Efficient AI Data Center Power Supplies

New U-MOS11-H-based MOSFET delivers lower power losses, reduced EMI and improved thermal performance for high-density industrial power applications.

Integrated Active and Passive High-Voltage Circuit Protection

Sensata Technologies introduces the STPS500P series PyroFuse, featuring dual-trigger redundancy for rapid fault interruption.

Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow

Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success.

binder transforms components into intelligent systems through printed electronics

By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures.

Integration of wavefront phase imaging into semiconductor metrology

Wooptix installs automated inspection platform at CEA-Leti to advance nanotopography research.

AMD Introduces Versal Premium Gen 2 Memory on Package Adaptive SoCs

New devices integrate up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development.

Digital current sensing optimizes signal integrity in automotive traction inverters

Melexis introduces a digital output current sensor to mitigate electromagnetic interference within high-power electric vehicle powertrains.

Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity

Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.

3D Hall-Effect Sensors for Automotive and Industrial Motion Control

Distributed by Rutronik, TDK's factory-programmable 3D sensing architecture resolves spatial constraints and alignment challenges within compact electric motor actuator designs.

International