11
'26
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TDK News
11
'26
Written on
Samsung News
Co-Optimized Semiconductor Design Platform for Advanced Node Artificial Intelligence
Cadence Design Systems & Samsung Foundry have expanded their technical partnership to provide certified design flows for 2-nanometer gate-all-around fabrication.
11
'26
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Same Sky Devices News
Same Sky Expands SPG Thermoelectric Generator Product Family
Same Sky has broadened its SPG thermoelectric generator (TEG) module line with expanded package dimensions and power ratings up to 27.3 W for industrial waste heat energy recovery.
11
'26
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Pickering News
Pickering Exhibits Semiconductor Test Switching at Microelectronics UK
The company will present its modular signal switching systems and the Test System Architect software in London.
10
'26
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Pickering News
Low-Thermal EMF Reed Relays for Precision Signal Switching
Pickering Electronics Series 120 relays reduce thermal EMF offsets in high-density automated test equipment and semiconductor data acquisition systems.
10
'26
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Renesas News
Renesas Launches Pin-Compatible 64-Bit MPUs for Advanced HMI & IoT
RZ/G3L and RZ/G3SE combine up to four Cortex-A55 cores, 1 mW standby power, PCIe and TSN Ethernet for scalable edge systems.
10
'26
Written on
Microchip News
Microchip Launches 1.2 V Clock Buffers for Advanced SoCs & FPGAs
SY757xx buffers provide voltage translation, ultra-low jitter and broad frequency support, simplifying clock distribution while reducing components and preserving signal integrity.
10
'26
Written on
TDK News
TDK Launches High-Capacitance Soft-Termination MLCCs for 48V Systems
The 10 μF/100 V X7R components minimize ESR while preventing board-flex cracking in AI servers and EVs.
10
'26
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Fraunhofer News
Fraunhofer IPMS Develops MEMS Spatial Light Modulators
Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.
09
'26
Written on
Anritsu News
