Siemens’ AI-driven Questa One transforms IC verification into a self-optimizing system, accelerating cycles, reducing manual effort, and increasing productivity.
The stack technology places two P/N junctions in series within one chip to achieve an optical output power increase of almost 180% compared to a single stack chip.
Infineon Technologies announced that the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.
Anritsu Site Master MS2085A and MS2089A now include VNA and VVM measurements, expanding applications to include filter and amplifier testing, radar, and antenna array maintenance.
Automotive E/E architectures are shifting to centralized designs for better performance, cost-efficiency, and safety—driving demand for high-speed, reliable LPDDR5X automotive-grade memory.
AMD's EPYC 4005 Series leverages the AM5 socket, offering versatile enterprise solutions. The 16-core 4565P outperforms Intel's Xeon 6300P by 1.83x in Phoronix benchmarks.
Pickering Electronics’ expert guide outlines how reed relays optimize semiconductor wafer testing, offering reliability and precision for ATE systems in parametric and functional validation.