10
'26
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HMS Industrial Networks AB
10
'26
Written on
Microchip News
Timing Platform Strengthens Critical Infrastructure Synchronization
Microchip Technology introduces a software update designed to coordinate high-precision time transfer links and detect satellite vulnerabilities within distributed digital ecosystems.
10
'26
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Toshiba News
Copper-Clip MOSFETs Enhance Automotive Power
Toshiba introduces a 40-volt electrical switching architecture designed to increase thermal dissipation and current capacity for high-stress vehicle motor drive systems.
10
'26
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Kontron News
Hardware Acceleration Unit For Mission-Critical Data Workloads
Kontron introduces a compact computing solution designed to process artificial intelligence inference and parallel calculations within harsh aerospace defense environments.
10
'26
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Keysight technologies News
6G Channel Modeling for Realistic Network Simulation
Keysight Technologies, NTT DOCOMO and NTT are developing methods to evaluate future 6G wireless architectures.
10
'26
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Mitsubishi Electric News
Mitsubishi Electric & Semikron Danfoss Develop New Power Module
Jointly developed 3-level standard package enhances inverter efficiency, design flexibility and standardization for industrial and renewable applications.
10
'26
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Infineon News
Semiconductor Partnership for Humanoid Robot Development
Infineon and VinRobotics are collaborating to develop humanoid robot platforms using semiconductor, AI, and robotics technologies.
10
'26
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Rohm Semiconductors News
Top-Side Cooling Semiconductor Packages for SiC MOSFETs
ROHM develops a surface-mount package architecture designed to maximize thermal dissipation and high-voltage insulation in automotive and industrial power conversion systems.
10
'26
Written on
Nexperia News
Top-Side Cooled Silicon Carbide MOSFETs in QDPAK
Nexperia introduced high-voltage wide-bandgap semiconductors featuring a surface-mount configuration designed to optimize thermal dissipation in power-dense systems.
10
'26
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electronica Shanghai Info
