08
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Fraunhofer News
08
'26
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Kontron News
Semiconductor Equipment Integration Software Advances
Kontron introduces a new generation of semiconductor equipment integration software with platform-independent architecture, open APIs, and enhanced cybersecurity support.
06
'26
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HTDS News
Single-Photon Counting Module for the Near-Infrared Spectrum
HTDS distributes a silicon avalanche technology optimized for high-precision spectral analysis and quantum communications.
03
'26
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Samsung News
Samsung Unveils HBM4E and Integrated AI Memory Infrastructure
Samsung Electronics has introduced its HBM4E memory architecture and Heat Path Block cooling technology at the COMPUTEX 2026 trade show.
02
'26
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TDK News
Automotive Gate Drive Transformers for High Voltage Vehicle Platforms
TDK Corporation introduces the E13 EM series of compact surface mount transformers for electric vehicle battery isolation systems.
02
'26
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Molex News
High-Speed Automotive Ethernet Connector System Delivers 25Gbps Network Speeds
Molex has expanded its high-speed interconnect portfolio to meet the growing bandwidth demands of advanced driver-assistance systems and centralized vehicle compute architectures.
02
'26
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APEM
APEM and Alps Alpine Europe strengthen collaboration to deliver next-generation industrial HMI solutions
Partnership combines complementary expertise to support industrial OEMs with advanced, fully integrated Human-Machine Interface systems across Europe.
02
'26
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OMRON News
SiC-MOSFET Relays for High-Voltage Applications up to 3,300 V
Omron introduces the G3VH series to increase efficiency and compactness in high-voltage architectures.
01
'26
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Toshiba News
80V N-Channel Power MOSFET for Digital Power Management
Toshiba engineers a compact 80-volt power transistor to minimize conduction losses and improve switching efficiency in data centers and communication base stations.
01
'26
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Toshiba News
