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Anritsu News
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TE Connectivity News
1.27 mm Pitch Board Connectors for Industrial Electronics
TE Connectivity introduces the AMP SMC essential connector series for board-to-board applications.
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Toshiba News
Prototyping Board for Evaluating Isolated Photorelays
Toshiba and MIKROE introduce the Opto 8 Click board to evaluate industrial photorelays.
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MURATA News
PIM API Expansion for Electronic Component Data
Murata expands its information management API service to cover 73 product categories.
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HBK World News
Portable DA110 Indicator for High-Precision Strain Gauge Measurement
HBK introduces the DA110 Handheld Indicator for mobile calibration and high-speed industrial asset monitoring.
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Infineon News
Automotive 8Tx8Rx Imaging Radar Transceivers for Centralized Architectures
Infineon enters mass production with the CTRX8188F radar MMIC to support centralized automotive processing architectures.
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Supermicro News
Hardware Platforms for Low-Latency Edge AI Inference
Supermicro introduces Intel-powered hardware platforms optimized for edge computing and industrial AI inference applications.
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STMicroelectronics News
Single-Die Secure Mobile IC with Post-Quantum Cryptography
STMicroelectronics introduces the ST54M mobile chip featuring a post-quantum cryptography accelerator and integrated NFC controller.
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Broadcom News
OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor
OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.
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Anritsu News
