10
'26
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Pickering News
10
'26
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Renesas News
Renesas Launches Pin-Compatible 64-Bit MPUs for Advanced HMI & IoT
RZ/G3L and RZ/G3SE combine up to four Cortex-A55 cores, 1 mW standby power, PCIe and TSN Ethernet for scalable edge systems.
10
'26
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Microchip News
Microchip Launches 1.2 V Clock Buffers for Advanced SoCs & FPGAs
SY757xx buffers provide voltage translation, ultra-low jitter and broad frequency support, simplifying clock distribution while reducing components and preserving signal integrity.
10
'26
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TDK News
TDK Launches High-Capacitance Soft-Termination MLCCs for 48V Systems
The 10 μF/100 V X7R components minimize ESR while preventing board-flex cracking in AI servers and EVs.
10
'26
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Fraunhofer News
Fraunhofer IPMS Develops MEMS Spatial Light Modulators
Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.
09
'26
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Anritsu News
Anritsu at ECOC 2026
From September 21 to September 23, in Malaga, Spain, Anritsu collaborates with ecosystem partners to validate high-capacity multi-core optical transmission systems for next-generation digital infrastructure.
09
'26
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Anritsu News
High-Speed Test Solutions for AI Infrastructure
Anritsu demonstrates advanced test and measurement solutions at ECOC 2026 in Malaga, Spain, to validate high-speed optical and digital networks for artificial intelligence applications.
09
'26
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Kontron News
Integration of virtualization in rugged embedded computing systems
SYSGO and Kontron collaborate to implement a validated board support package for secure mixed-criticality embedded systems in harsh environments.
09
'26
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TDK News
TDK Launches 10 μF 100 V Soft-Termination X7R MLCC for 48 V Systems
New 3225-format capacitors combine low ESR, high capacitance and AEC-Q200 qualification for AI servers, humanoid robots, xEVs and industrial equipment.
09
'26
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Infineon News
