02 {{ "2026-07-02T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-07-02T00:00:00+00:00" | date "longDate" }} APEM APEM and Alps Alpine Europe strengthen collaboration to deliver next-generation industrial HMI solutions Partnership combines complementary expertise to support industrial OEMs with advanced, fully integrated Human-Machine Interface systems across Europe. Read more…
02 {{ "2026-07-02T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-07-02T00:00:00+00:00" | date "longDate" }} OMRON News SiC-MOSFET Relays for High-Voltage Applications up to 3,300 V OMRON introduces the G3VH series to increase efficiency and compactness in high-voltage architectures. Read more…
01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }} Toshiba News 80V N-Channel Power MOSFET for Digital Power Management Toshiba engineers a compact 80-volt power transistor to minimize conduction losses and improve switching efficiency in data centers and communication base stations. Read more…
01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }} Toshiba News Toshiba Launches 80V Power MOSFET for Efficient AI Data Center Power Supplies New U-MOS11-H-based MOSFET delivers lower power losses, reduced EMI and improved thermal performance for high-density industrial power applications. Read more…
01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }} Sensata Technologies News Integrated Active and Passive High-Voltage Circuit Protection Sensata Technologies introduces the STPS500P series PyroFuse, featuring dual-trigger redundancy for rapid fault interruption. Read more…
01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }} Keysight technologies News Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success. Read more…
01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }} binder Connector News binder transforms components into intelligent systems through printed electronics By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures. Read more…
30 {{ "2026-06-30T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-06-30T00:00:00+00:00" | date "longDate" }} Wooptix News Integration of wavefront phase imaging into semiconductor metrology Wooptix installs automated inspection platform at CEA-Leti to advance nanotopography research. Read more…
30 {{ "2026-06-30T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-06-30T00:00:00+00:00" | date "longDate" }} AMD News AMD Introduces Versal Premium Gen 2 Memory on Package Adaptive SoCs New devices integrate up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development. Read more…
29 {{ "2026-06-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-06-29T00:00:00+00:00" | date "longDate" }} Melexis News Digital current sensing optimizes signal integrity in automotive traction inverters Melexis introduces a digital output current sensor to mitigate electromagnetic interference within high-power electric vehicle powertrains. Read more…