HighTec EDV-Systeme expands its development platform to support the upcoming Infineon AURIX RC1 microcontrollers, enabling real-time compute and control for software-defined vehicles.
New high efficiency devices deliver record low on state resistance to support artificial intelligence datacentres humanoid robotics renewable energy and advanced power conversion system architectures.
TDK sensors, paired with Microchip’s dsPIC33A DSC and LAN8651/LAN8679, bring real-time edge intelligence with single-pair Ethernet connectivity to robotics.
The GMSL2 Discovery Kit combines intelligent camera modules, GMSL2 data transmission and NVIDIA Jetson Orin NX-based embedded computing in a preconfigured platform for evaluating multi-camera applications.
Infineon has successfully fabricated functional power devices on larger wafer formats, expanding wide-bandgap production capacity for automotive and industrial energy conversion systems.
Three tech leaders combine advanced networking, custom processors, and data centers to build Korea’s next-generation sovereign infrastructure for high-performance and energy-efficient artificial intelligence computing.