02
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Qualcomm News
02
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Micron News
Integration of high-bandwidth memory in advanced artificial intelligence digital infrastructure
Micron Technology collaborates with ecosystem partners to implement specialized memory architectures for next-generation data centers and intelligent edge applications.
02
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Wernerwirth News
Technical Component Protection via Polymer Potting and Hotmelt Processes
Werner Wirth offers development services and series production for electronic assembly protection.
02
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Intel News
Integration of High-Density Processors and Ethernet Adapters for Digital Infrastructure
Intel partnered with top OEMs like Dell, HPE, Lenovo, and Supermicro to deploy unified compute and networking systems optimized for agentic AI workloads and data movement.
02
'26
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Rutronik News
GaN Power Electronics Development Platform
Rutronik introduces a Gallium Nitride evaluation system designed to accelerate motor control and power conversion development across high-efficiency applications.
02
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Keysight technologies News
Keysight Collaborates With NTT DOCOMO and NTT on 6G Modeling
Keysight Technologies partners with NTT DOCOMO and NTT to accelerate realistic 6G channel modeling and distributed MIMO wireless communication simulations.
01
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STMicroelectronics News
Automotive inertial module improves GNSS positioning accuracy
STMicroelectronics introduces a high-temperature automotive IMU combining synchronized MEMS sensing and sensor fusion support for navigation, telematics and vehicle motion analysis.
01
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Samsung News
HBM4E memory samples target next-generation AI infrastructure
Samsung Electronics begins shipment of 12-layer HBM4E samples with higher bandwidth, improved energy efficiency and expanded memory capacity for AI computing platforms.
01
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CeramTec News
CeramTec at PCIM Expo 2026
From 9 to 11 June, in Nuremberg, discover high-performance silicon nitride and Rubalit 710 C solutions for e-mobility, high-voltage, and high-frequency electronics backed by a reliable European supply chain.
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Cognex Germany Inc
