14 {{ "2026-05-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-14T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens Accelerates Semiconductor Library Characterization

The new AI-assisted software is designed to reduce semiconductor library generation time and improve throughput for advanced chip design workflows.

Read more…

13 {{ "2026-05-13T00:00:00+00:00" | date "MMM" }} '26

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PTC News

Cloud-Based ECAD-MCAD Integration for PCB Development

PTC and Altium connect Onshape and Altium platforms to synchronize electronic and mechanical design workflows in real time.

Read more…

13 {{ "2026-05-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-13T00:00:00+00:00" | date "longDate" }}

TDK News

High-Efficiency DC-DC Power Modules for Battery Systems

TDK Corporation introduced a non-isolated buck-boost DC-DC converter platform designed to improve power efficiency and thermal management in industrial and mobile electronic systems.

Read more…

13 {{ "2026-05-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-13T00:00:00+00:00" | date "longDate" }}

Micron News

High-Capacity DDR5 RDIMM Architecture for Artificial Intelligence Infrastructure

Micron Technology has commenced sampling 256GB DDR5 memory modules based on 1-gamma fabrication nodes to optimize performance and energy efficiency in the automotive data ecosystem.

Read more…

13 {{ "2026-05-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-13T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens Introduces AI-Based Semiconductor Characterization Software

Solido Characterizer accelerates Liberty file generation and SPICE-based library development for advanced semiconductor process nodes.

Read more…

12 {{ "2026-05-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-12T00:00:00+00:00" | date "longDate" }}

Septentrio News

Compact GNSS Module Targets Industrial Automation

Septentrio introduces a multi-frequency GNSS receiver designed for UAVs, robotics, and precision industrial control systems requiring low SWaP and resilient positioning.

Read more…

12 {{ "2026-05-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-12T00:00:00+00:00" | date "longDate" }}

CEVA News

Integrated Wireless IP Solutions for High Throughput Bluetooth Applications

Ceva, Inc. has secured a design win for its integrated Bluetooth High Data Throughput platform to streamline wireless subsystem development for a major semiconductor manufacturer.

Read more…

12 {{ "2026-05-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-12T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon Expands High-Voltage SiC Power Modules

The new silicon carbide module variants support 1500 V DC-link architectures in renewable energy and high-power conversion systems.

Read more…

11 {{ "2026-05-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-11T00:00:00+00:00" | date "longDate" }}

Nexcom News

Post-Quantum Cryptography Integration in Edge Network Appliances

NEXCOM develops the FTA 5190 edge server to facilitate the migration toward quantum-resistant encryption standards within the global automotive data ecosystem.

Read more…

11 {{ "2026-05-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-11T00:00:00+00:00" | date "longDate" }}

Delta Electronics

Delta Expands its R&D Capabilities in Soest, Germany with Opening of New R&D Center, Strengthening its Innovation Process in EMEA

New R&D expected to advance Delta’s cutting-edge power solutions for AI data centers and e-mobility; facility designed to meet LEED Gold standards and to house up to 250 talents.

Read more…

Technical Articles

Redefining Electrical Protection for Data Centers and Critical Infrastructure

Case studies

Wireless test infrastructure expands device certification

White Paper

How to Choose the Right Onboard Charger for Your Battery Pack: 5 Critical Design Considerations

Siemens Accelerates Semiconductor Library Characterization

The new AI-assisted software is designed to reduce semiconductor library generation time and improve throughput for advanced chip design workflows.

Cloud-Based ECAD-MCAD Integration for PCB Development

PTC and Altium connect Onshape and Altium platforms to synchronize electronic and mechanical design workflows in real time.

High-Efficiency DC-DC Power Modules for Battery Systems

TDK Corporation introduced a non-isolated buck-boost DC-DC converter platform designed to improve power efficiency and thermal management in industrial and mobile electronic systems.

High-Capacity DDR5 RDIMM Architecture for Artificial Intelligence Infrastructure

Micron Technology has commenced sampling 256GB DDR5 memory modules based on 1-gamma fabrication nodes to optimize performance and energy efficiency in the automotive data ecosystem.

Siemens Introduces AI-Based Semiconductor Characterization Software

Solido Characterizer accelerates Liberty file generation and SPICE-based library development for advanced semiconductor process nodes.

Compact GNSS Module Targets Industrial Automation

Septentrio introduces a multi-frequency GNSS receiver designed for UAVs, robotics, and precision industrial control systems requiring low SWaP and resilient positioning.

Integrated Wireless IP Solutions for High Throughput Bluetooth Applications

Ceva, Inc. has secured a design win for its integrated Bluetooth High Data Throughput platform to streamline wireless subsystem development for a major semiconductor manufacturer.

Infineon Expands High-Voltage SiC Power Modules

The new silicon carbide module variants support 1500 V DC-link architectures in renewable energy and high-power conversion systems.

Post-Quantum Cryptography Integration in Edge Network Appliances

NEXCOM develops the FTA 5190 edge server to facilitate the migration toward quantum-resistant encryption standards within the global automotive data ecosystem.

Delta Expands its R&D Capabilities in Soest, Germany with Opening of New R&D Center, Strengthening its Innovation Process in EMEA

New R&D expected to advance Delta’s cutting-edge power solutions for AI data centers and e-mobility; facility designed to meet LEED Gold standards and to house up to 250 talents.

International