Integration of NVIDIA Modulus AI framework with the Ansys SeaScape platform will enable engineers to easily build customized AI solutions that can improve designer productivity and quickly identify optimal design configurations.

Ansys' certified semiconductor solutions will enable Faraday to shorten design cycles of 2.5D/3D-ICs and ensure designs meet signal integrity and performance goals.

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors.

Collaboration optimizes Ansys solutions and AI capabilities, boosts simulation speeds up to 1,600x.

The expanded collaboration between Ansys and Microsoft delivers Ansys products optimized for high-performance computing to customers for flexible control over cost and deployment.

Ansys multiphysics platforms support TSMC's latest silicon technologies, enabling advanced semiconductor vendors to create faster, lower power designs.

Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips.

Ansys is expanding its electronics portfolio to streamline RF filter design workflows for wireless communications.

The new custom design flow features Ansys' signoff power integrity and electromagnetic modelling capabilities that meet the needs of high-speed circuit designers.

uPI leverages Ansys’ multiphysics simulation tools to enhance the design, development, and verification of its chip package designs.