Achronix Semiconductor Corporation (Achronix), a leader in high-performance FPGAs and embedded FPGA (eFPGA IP), leveraged Ansys’ (NASDAQ: ANSS) multiphysics simulation to successfully signoff on its latest FPGA, the Speedster^®7t AC7t1500 FPGA.

Samsung will employ Ansys’ electromagnetic simulation tool suite to develop state-of-the-art designs, including 5G/6G, on the most advanced process technologies.

Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.

Ansys and TSMC extended their long-standing collaboration to achieve certification of Ansys’ power integrity software for TSMC’s industry-leading N4P and N3E process technologies. The certification for Ansys RedHawk-SC and Totem enables next generation silicon designs for machine learning, 5G mobile, and high-performance computing (HPC) applications. This latest collaboration builds on the recent certification of the Ansys platform for TSMC’s N4 and N3 processes.

New products Ansys^® Totem-SC and Ansys^® PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.

Ansys’ distributed compute platform and proven hierarchical methodology accelerates Juniper's networking chip design verification.

The University of Colorado Boulder will launch a master’s degree program that will integrate and feature Ansys’ best-in-class electronics simulation.

3rd Gen AMD EPYC processors with AMD 3D V-Cache technology — available on Microsoft Azure HBv3 virtual machines (VMs) — will be offered to Ansys Cloud customers in 2022.

Ansys and GlobalFoundries (GF) collaborate to offer first-of-its-kind silicon photonics solution to address the explosive growth of data volumes while significantly reducing power consumption.

SiPearl will apply Ansys’ industry-leading multiphysics platform to meet power and reliability goals on Europe’s new state-of-the-art microprocessor.