Ansys enables engineering teams to see through complexity and design the next generation of world-changing products. The new capabilities in Ansys 2022 R2 cross the breadth of physics, engineering disciplines, and industries to support the scale and interoperability needed to gain knowledge of real-world product performance.

Ansys' paper on its solution to enable secure electronic designs won the Best Paper Award at the IEEE International Symposium on Hardware Oriented Security and Trust (HOST), the world-leading hardware security conference.

Achronix Semiconductor Corporation (Achronix), a leader in high-performance FPGAs and embedded FPGA (eFPGA IP), leveraged Ansys’ (NASDAQ: ANSS) multiphysics simulation to successfully signoff on its latest FPGA, the Speedster^®7t AC7t1500 FPGA.

Samsung will employ Ansys’ electromagnetic simulation tool suite to develop state-of-the-art designs, including 5G/6G, on the most advanced process technologies.

Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.

Ansys and TSMC extended their long-standing collaboration to achieve certification of Ansys’ power integrity software for TSMC’s industry-leading N4P and N3E process technologies. The certification for Ansys RedHawk-SC and Totem enables next generation silicon designs for machine learning, 5G mobile, and high-performance computing (HPC) applications. This latest collaboration builds on the recent certification of the Ansys platform for TSMC’s N4 and N3 processes.

New products Ansys^® Totem-SC and Ansys^® PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.

Ansys’ distributed compute platform and proven hierarchical methodology accelerates Juniper's networking chip design verification.

The University of Colorado Boulder will launch a master’s degree program that will integrate and feature Ansys’ best-in-class electronics simulation.

3rd Gen AMD EPYC processors with AMD 3D V-Cache technology — available on Microsoft Azure HBv3 virtual machines (VMs) — will be offered to Ansys Cloud customers in 2022.