The new custom design flow features Ansys' signoff power integrity and electromagnetic modelling capabilities that meet the needs of high-speed circuit designers.

uPI leverages Ansys’ multiphysics simulation tools to enhance the design, development, and verification of its chip package designs.

The new release expands digital engineering solutions with leading solvers and large-scale computing in connected workflows.

Ansys and Altium will further streamline electronics design and development with seamless integration between ECAD and simulation.

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

Ansys' comprehensive power analytics reduce project risk, improve predictive accuracy, and accelerate time to market for Axelera AI’s new Metis AI Platform.

Ansys is bringing the power of digital twins to PowerizeD, a European initiative that focuses on the digitalization of power electronics and decarbonization.

Foundry certification enables GF 22FDX customers to validate their chip designs’ power integrity and reliability with Ansys golden signoff tools.

Through a new multiyear agreement, Ansys’ comprehensive simulation portfolio will empower Murata to develop cutting-edge, sustainable wireless connectivity products.

Ansys is certified for TSMC’s innovative FINFLEX architecture on N3E for flexible power/performance tradeoffs.