The new release expands digital engineering solutions with leading solvers and large-scale computing in connected workflows.

Ansys and Altium will further streamline electronics design and development with seamless integration between ECAD and simulation.

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

Ansys' comprehensive power analytics reduce project risk, improve predictive accuracy, and accelerate time to market for Axelera AI’s new Metis AI Platform.

Ansys is bringing the power of digital twins to PowerizeD, a European initiative that focuses on the digitalization of power electronics and decarbonization.

Foundry certification enables GF 22FDX customers to validate their chip designs’ power integrity and reliability with Ansys golden signoff tools.

Through a new multiyear agreement, Ansys’ comprehensive simulation portfolio will empower Murata to develop cutting-edge, sustainable wireless connectivity products.

Ansys is certified for TSMC’s innovative FINFLEX architecture on N3E for flexible power/performance tradeoffs.

Ansys enables engineering teams to see through complexity and design the next generation of world-changing products. The new capabilities in Ansys 2022 R2 cross the breadth of physics, engineering disciplines, and industries to support the scale and interoperability needed to gain knowledge of real-world product performance.

Ansys' paper on its solution to enable secure electronic designs won the Best Paper Award at the IEEE International Symposium on Hardware Oriented Security and Trust (HOST), the world-leading hardware security conference.