Cars with fully or partially electrified drivetrains will account for two thirds of cars produced by 2028, as per analyst forecasts. This rapid growth of electromobility is driving the demand for power semiconductors.

Infineon Technologies AG today announced it is teaming with Edge Impulse to extend its Tiny Machine Learning-based AI development tools for the PSoC 63 Bluetooth^® LE microcontroller (MCU).

Infineon Technologies AG and Teledyne e2v have developed a reference design for the implementation of compute-intensive space systems.

Infineon Technologies AG and the Austrian product compliance company Kontrol are entering into a strategic partnership to make the future of mobility as both legally compliant and safe as possible.

Infineon is expanding its automotive microphone portfolio with the introduction of the XENSIV MEMS microphone IM68A130A, designed for ANC systems with an analog interface.

Infineon Technologies AG and eleQtron GmbH, a pioneer in Quantum Computing (QC) from Siegen, North Rhine Westfalia, Germany, announced today their partnership to jointly develop trapped ion Quantum Processor Units (QPUs) for scalable quantum computers.

As part of the global effort for decarbonization, improving the energy efficiency of buildings is a critical part of the solution.

Digital isolators have become the preferred choice in many modern designs because of the many benefits they offer.

Infineon presents its new generation of 1200 V CoolSiC MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC) MOSFET generation offers high power density and efficiency, enables bi-directional charging and significantly reduces system cost in on-board charging (OBC) and DC-DC applications.

Infineon Technologies has announced the release of ModusToolbox 3.1 with enhanced capabilities giving developers more features at their fingertips to develop software solutions for their hardware designs.