Infineon Technologies expands radiation-hardened power electronics for satellite power conversion and GaN-based space platforms.

Infineon Technologies AG and LS ELECTRIC are collaborating to develop high-efficiency direct current power infrastructure for AI data centers and next-generation power grids.

Collaboration integrates CoolSiC MOSFETs into liquid-cooled modular platforms for heavy-duty EV charging and energy storage.

Infineon enters mass production with the CTRX8188F radar MMIC to support centralized automotive processing architectures.

Infineon supplies 100-volt gallium nitride devices to enhance the efficiency and power density of rooftop solar photovoltaic energy systems.

Infineon introduces a digital infrastructure solution enabling automotive engineers to test and validate microcontroller capabilities without requiring physical hardware.

Infineon Technologies and NVIDIA collaborate to implement post-quantum resilient cryptographic hardware on the Jetson Thor platform for industrial robotics applications.

Infineon provides semiconductor power management solutions for the NVIDIA modular MGX architecture to optimize energy distribution in high-density accelerated computing data centers.

Infineon Technologies has developed a ready-to-integrate hardware and software architecture to enable digital card tokenization and near-field communication transactions on wearable computing devices.

Infineon will present semiconductor platforms at PCIM Europe 2026 targeting data center power conversion, industrial automation, electromobility, and resilient power infrastructure.