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Infineon News
www.infineon.com
02
'22
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i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost
Infineon Technologies AG in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C.
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Infineon launches SLC26P security controller based on 28 nm technology for payment applications; expands its supply option to enable long-term, dependable sourcing for smart card and embedded security ICs
Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured, market demand for 28 nm products has also increased.
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German Federal Printing Office, Fraunhofer and Infineon demonstrate for the first time electronic passport security for the quantum computer era
Quantum computers could become a serious threat to the security of documents such as electronic passports before the present decade is over.
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Infineon and TSMC to introduce RRAM technology for automotive AURIX TC4x product family
Infineon Technologies AG and TSMC today announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology into Infineon’s next generation AURIX microcontrollers (MCU).
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Infineon and Fingerprints step into cooperation on the all-in-one solution SECORA Pay Bio that will bring biometric payment cards to a new level
Infineon Technologies AG and Fingerprint Cards AB (STO: FING B, Fingerprints) today announced the signing of a joint development and commercialization agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card.
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EasyPACK4B enables single module solution for the world’s largest 352 kW photovoltaic string inverter
Infineon Technologies AG recently added EasyPACK 4B to its industry-leading Easy power module family. The lead-type of the new family targets applications in photovoltaic string inverters.
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Infineon achieves ISO/SAE 21434 process certification; AURIX TC4xx microcontroller family first to be standard-certified
Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles.
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Infineon`s new family of 2 x 37 W audio amplifiers features second generation of MERUS multilevel switching amplifier technology
When designing portable and battery-powered audio devices for consumer speaker applications, maximizing battery playback time and, at the same time, maintaining excellent audio performance in a compact form and at a low system cost is essential.
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