CEA-Leti, CEA-List and Powerchip Semiconductor Manufacturing Corporation (PSMC) collaborate to combine RISC-V computing and silicon photonics within 3D semiconductor integration platforms for AI systems.

CEA-Leti collaborates with NcodiN to move optical interposer technology toward wafer-scale manufacturing for high-bandwidth computing and AI processor integration.

22nm battery-powered IC achieves ultra-fast scans, wide spectral span and high sensitivity.

CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture.

CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

CEA-Leti’s GaN microLED-organic photodetector integration, unveiled at Display Week, enables interactive displays with biometric and environmental sensing capabilities.

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits, highlighting their progress in 3D integration technologies for designing More than Moore systems, particularly RF integrated systems.

CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.

CEA-Leti will present two papers on its microLED technology advances at Photonics West 2024 about making matrices of LEDs with increased data-rate density, and strategies to reduce their efficiency loss at small sizes.