CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.

Gallium Nitride Seen as Highly Efficient Replacement for Silicon In Wide Range of Consumer and Industrial Uses.

Institute’s Experts to Host Online Tutorial on Qubit Figures of Merit And Short Course on 3D Sequential Integration.

Project Will Build Demonstrators for Transmitting and Receiving Qubits and Focus on Integrating the Technology in a Unique Platform to Address Quantum Computing Applications.

With Ultimate Goal of Improving Virus Knowledge, Team Now Will Use its Optomechanical System to Design a Prototype for Airborne Virus Analysis.

Clinical Trials Show Higher Spatial Resolution, Less Noise, Fewer Artifacts, And Color Capabilities in Patients’ Images.

 The "COREnect" (European Core Technologies for future connectivity systems and components) consortium is glad to announce that its project has been selected by the European Commission in the frame of the Horizon 2020 Research & Innovation programme.

European H2020 COSMICC Project Breakthroughs 'Will Answer Tremendous Market Needs with a Target Cost per Bit that Traditional Wavelength-Division Multiplexing Transceivers Cannot Meet'.

In an FDSOI CMOS processing breakthrough, CEA-Leti scientists have pushed fabrication thermal-process boundaries down to 500°C for CMOS integration, while showing strong performance gains especially in P-type metal-oxide-semiconductor (PMOS) logic devices.

Virtual Presentation During VLSI 2020 Details Transistors' Performance And Power-Use Advantages Versus FinFET Devices.