CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

CEA-Leti’s GaN microLED-organic photodetector integration, unveiled at Display Week, enables interactive displays with biometric and environmental sensing capabilities.

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits, highlighting their progress in 3D integration technologies for designing More than Moore systems, particularly RF integrated systems.

CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.

CEA-Leti will present two papers on its microLED technology advances at Photonics West 2024 about making matrices of LEDs with increased data-rate density, and strategies to reduce their efficiency loss at small sizes.

Breakthrough Classifies Types of Arrhythmia Recordings With Precise Aleatoric and Epistemic Uncertainty.

CEA-Leti and Intel collaborate on developing layer transfer technology for 2D TMDs on 300mm wafers, aiming to extend Moore's Law beyond 2030.

CEA-Leti researchers have demonstrated that electrons and other charge carriers can move faster in germanium tin, enabling lower operation voltages and smaller footprints in vertical transistors.

CEA-Leti presented three papers at IEDM 2022 detailing its recent advances and future challenges in quantum computing using Si-based qubit devices with FDSOI technologies. A plenary talk presented the path towards scalable quantum computers with silicon technology.