Devices Offer Very Low Power Consumption, Excellent EMI, No Audible Noise, and Reduced BOM Costs; Complement Renesas’ MCU and Sensor Lines.

Enhanced Platform Delivers Selective Ozone Detection, Miniature Sensor, and a IP67 Waterproof Package for Wearables, Smartphones, and Industrial Monitoring Devices.

Azure RTOS Components Integrated into Renesas RA Flexible Software Package, Renesas Synergy Software Platform, and Easily Accessible via Renesas RX’s Smart Configurator.

New 8.2mm Creepage IGBT Drivers and IPM Driver Reduce PCB Mounting Area by 35 Percent to Maximize Board Space.

Pre-Tested and Certified Cat-M1 Cellular Modules Optimized and Ready to Deploy for Wireless IoT Networks Without the Need for Gateways; One-Stop Shop Portal Provides Device Management and Global Operation on a Single eSim.

DRP-AI Handles both AI Inference and Image Processing Functions, Eliminating External ISP Requirements and Enabling More Cost-Efficient Vision AI Implementations.

Expanded I3C Ecosystem Now Includes Firmware, Software, and Hardware, Accelerating Product Qualification and Adoption for DDR5 Solutions.

FemtoClock2 Family Simplifies Design with Industry’s Lowest Power and Smallest 75fs Jitter Clocks.

By Using Certified RX MCUs, Customers Can Easily Develop Devices Meeting Security Requirements.

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today held a third press conference regarding the occurrence of a fire on March 19, 2021 at part of the processes in the N3 Building (300mm line) of Naka Factory (located in Hitachinaka, Ibaraki Prefecture) of Renesas Semiconductor Manufacturing Co., Ltd, a wholly-owned manufacturing subsidiary of Renesas.