Siemens EDA introduces Innovator3D IC suite and Calibre 3DStress software, addressing complex 2.5D/3D IC designs to enhance design, yield, and reliability.

Siemens integrates generative and agentic AI across its EDA portfolio, enhancing productivity and accelerating chip/PCB design and verification through NVIDIA microservices.

These certifications cover Samsung's FinFET and MBCFET processes (14nm-2nm), enabling customers to confidently use Siemens' Calibre, Solido, and Aprisa software for next-gen semiconductor design.

New PADS Pro Essentials and Xpedition Standard software offer SMBs professional, AI-powered, collaborative PCB design, accelerating cycles and reducing risk.

Collaboration enhances Open Innovation Platform, accelerating semiconductor design with cutting-edge tools, boosting efficiency, and enabling next-gen chip technologies for future applications.

For the first time, high-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property.

Collaboration between Siemens, sureCore and Semiwise to develop cryogenic semiconductor designs capable of operating in extreme cold conditions required for quantum computing.

Siemens Digital Industries Software today announced that Samsung Foundry’s advanced 3nm process technology now supports Siemens’ entire Calibre^® nmPlatform tool, which is the industry’s leading solution for physical verification of next-generation integrated circuits (ICs).

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

Siemens Digital Industries Software today announced a range of expanded electronic design automation (EDA) early design verification functionalities for its Calibre^® platform for integrated circuit (IC) physical verification.